Additive for high-purity copper electrolytic refining, method of producing high-purity copper, and high-purity electrolytic copper

Patent metadata

Field	Value
Publication number	US-10428434-B2
Application number	US-201615277508-A
Country	US
Kind code	B2
Filing date	Sep 27, 2016
Priority date	Sep 30, 2015
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

The present invention provides an additive for high-purity copper electrolytic refining, a method of producing high-purity copper, and a high-purity electrolytic copper. This additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in copper electrolytic refining. The additive includes a silver and chlorine reducing agent of electrolytic copper which is formed of tetrazoles which is one of a tetrazole and a tetrazole derivative.

First claim

What is claimed is:

1. An additive for high-purity copper electrolytic refining which is an additive to be added to a copper electrolyte in copper electrolytic refining, the additive comprising:
a silver and chlorine reducing agent of electrolytic copper which is formed of one of tetrazoles selected from a tetrazole and a tetrazole derivative,
wherein the additive further comprises a stress relaxation agent formed of a polyvinyl alcohol or a derivative thereof,
the polyvinyl alcohol or the derivative thereof in the stress relaxation agent has a saponification rate of 70 to 99% by mole and an average polymerization degree of 200 to 2500, and
the tetrazole derivative is one of an alkyl derivative, an amino derivative, and a phenyl derivative of tetrazole.

2. The additive for high-purity copper electrolytic refining according to claim 1 ,
wherein the additive further comprises an impurity reducing agent formed of one of a polyethylene glycol and a non-ionic surfactant, the non-ionic surfactant having a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.

3. The additive for high-purity copper electrolytic refining according to claim 1 ,
wherein the additive further comprises an impurity reducing agent formed of one of a polyethylene glycol and a non-ionic surfactant, the non-ionic surfactant having a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.

4. A method of producing high-purity copper, comprising:
performing copper electrolytic refining using a copper electrolyte to which a silver and chlorine reducing agent formed of one of tetrazoles is added,
wherein a concentration of the silver and chlorine reducing agent in the copper electrolyte is set to be in a range of 0.1 to 30 mg/L, and
the one of tetrazoles is selected from a tetrazole and a tetrazole derivative, and the tetrazole derivative is one of an alkyl derivative, an amino derivative, and a phenyl derivative of tetrazole.

5. The method of producing high-purity copper according to claim 4 ,
wherein the copper electrolytic refining is performed using the copper electrolyte to which a impurity reducing agent formed of one of a polyethylene glycol and a non-ionic surfactant is added together with the silver and chlorine reducing agent, the non-ionic surfactant having a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.

6. The method of producing high-purity copper according to claim 5 ,
wherein the impurity reducing agent is one of a polyethylene glycol, a polyoxyethylene monophenyl ether, and a polyoxyethylene naphthyl ether.

7. The method of producing high-purity copper according to claim 6 ,
wherein the copper electrolytic refining is performed using the copper electrolyte to which a stress relaxation agent is added together with the silver and chlorine reducing agent or combination of the silver and chlorine reducing agent and the impurity reducing agent, the stress relaxation agent being formed of a polyvinyl alcohol or a derivative thereof.

8. The method of producing high-purity copper according to claim 5 ,
wherein a concentration of the impurity reducing agent in the copper electrolyte is set to be in a range of 2 to 500 mg/L.

9. The method of producing high-purity copper according to claim 5 ,
wherein the copper electrolytic refining is performed using the copper electrolyte to which a stress relaxation agent is added together with the silver and chlorine reducing agent or combination of the silver and chlorine reducing agent and the impurity reducing agent, the stress relaxation agent being formed of a polyvinyl alcohol or a derivative thereof.

10. The method of producing high-purity copper according to claim 4 ,
wherein the copper electrolytic refining is performed using the copper electrolyte to which a stress relaxation agent is added together with the silver and chlorine reducing agent or combination of the silver and chlorine reducing agent and the impurity reducing agent, the stress relaxation agent being formed of a polyvinyl alcohol or a derivative thereof.

11. The method of producing high-purity copper according to claim 10 ,
wherein the stress relaxation agent is one of a polyvinyl alcohol, a carboxy-modified polyvinyl alcohol, an ethylene-modified polyvinyl alcohol, and a polyoxyethylene-modified polyvinyl alcohol.

12. The method of producing high-purity copper according to claim 10 ,
wherein the polyvinyl alcohol or the derivative thereof which has a saponification rate of 70 to 99% by mole and an average polymerization degree of 200 to 2500 is used as the stress relaxation agent.

13. The method of producing high-purity copper according to claim 10 ,
wherein a concentration of the stress relaxation agent in the copper electrolyte is set to be in a range of 0.1 to 100 mg/L.

Assignees

• Mitsubishi Materials Corp

Inventors

• Tarutani Yoshie
• Kubota Kenji
• Nakaya Kiyotaka

Classifications

• C25C1/12 Primary

  of copper · CPC title