Adhesive composition and film roll

Patent metadata

Field	Value
Publication number	US-10428249-B2
Application number	US-201415032548-A
Country	US
Kind code	B2
Filing date	Nov 7, 2014
Priority date	Nov 8, 2013
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

An adhesive composition and a film roll whereby blocking can be prevented and excellent temporary pressure bonding properties can be obtained. The adhesive composition of the present invention contains an epoxy resin, a latent curing agent, and an acrylic rubber having a carboxyl group or a glycidyl group, and the acrylic rubber phase-separates from the epoxy resin at a normal temperature and is compatible with the epoxy resin at a predetermined temperature higher than the normal temperature and lower than the curing temperature. Adhesive force is thereby reduced at the normal temperature, blocking can be prevented from occurring and excellent adhesive force can be obtained during temporary pressure bonding.

First claim

The invention claimed is:

1. A film roll comprising:
an adhesive film comprising a phenoxy resin, an epoxy resin, a latent curing agent, an acrylic rubber having a carboxyl group or a glycidyl group, and a butadiene rubber, in which the acrylic rubber phase-separates from the epoxy resin at a normal temperature of 20° C.±15° C. and is compatible with the epoxy resin at a predetermined temperature of 40 to 80° C.; and
a reel in which the adhesive film is wound around a roll core,
wherein the epoxy resin is a bisphenol-type epoxy resin,
wherein the latent curing agent is an imidazole-type latent curing agent,
wherein the acrylic rubber content is 40 pts. mass or more and 60 pts. mass or less with respect to 100 pts. mass of epoxy resin,
wherein the latent curing agent is a microcapsule type, and
wherein the latent curing agent content is 80 pts. mass or more and 120 pts. mass or less with respect to 100 pts. mass of epoxy resin.

2. A method for manufacturing a connecting structure for connecting an electronic component comprising:
temporary pressure bonding in which an adhesive film comprising a phenoxy resin, an epoxy resin, a latent curing agent, an acrylic rubber having a carboxyl group or a glycidyl group, and a butadiene rubber, wherein the acrylic rubber phase-separates from the epoxy resin at a normal temperature of 20° C.±15° C. and is compatible with the epoxy resin at a predetermined temperature of 40 to 80° C. is held between a first electronic component and a second electronic component at the predetermined temperature; and
final pressure bonding of the first electronic component and the second electronic component at a temperature of 160 to 210° C.,
wherein the epoxy resin is a bisphenol-type epoxy resin,
wherein the latent curing agent is an imidazole-type latent curing agent,
wherein the acrylic rubber content is 40 pts. mass or more and 60 pts. mass or less with respect to 100 pts. mass of epoxy resin,
wherein the latent curing agent is a microcapsule type, and
wherein the latent curing agent content is 80 pts. mass or more and 120 pts. mass or less with respect to 100 pts. mass of epoxy resin.

3. The method for manufacturing a connecting structure for connecting an electronic component according to claim 2 ,
wherein the adhesive film comprises conductive particles.

4. The method for manufacturing a connecting structure for connecting an electronic component according to claim 2 ,
wherein the acrylic rubber has a glass transition temperature of 50° C. or less.

5. The method for manufacturing a connecting structure for connecting an electronic component according to claim 2 ,
wherein a transmittance of the adhesive film at the normal temperature is lower than a transmittance thereof at the predetermined temperature.

Assignees

• Dexerials Corp

Inventors

• Kaku Naomi

Classifications

• C09J133/068

  containing glycidyl groups · CPC title

• C09J2203/318

  for the production of liquid crystal displays · CPC title

• C08L33/068

  containing glycidyl groups · CPC title

• C08G2650/56

  Polyhydroxyethers, e.g. phenoxy resins · CPC title

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title