Composition for forming a silica based layer, silica based layer, and electronic device

Patent metadata

Field	Value
Publication number	US-10427944-B2
Application number	US-201514839642-A
Country	US
Kind code	B2
Filing date	Aug 28, 2015
Priority date	Dec 19, 2014
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

A composition for forming a silica based layer, the composition including a silicon-containing polymer having polydispersity ranging from about 3.0 to about 30 and a solvent, and having viscosity ranging from about 1.30 centipoise (cps) to about 1.80 cps at 25° C. Also, a silica based layer is formed of the composition, and an electronic device includes the silica based layer.

First claim

What is claimed is:

1. A composition for forming a silica based layer, the composition comprising polysilazane having polydispersity ranging from about 7.0 to about 13.6 and a solvent, and
having viscosity ranging from about 1.35 centipoise (cps) to about 1.60 cps when measured at a measurement temperature of 25° C.

2. The composition of claim 1 , wherein the polysilazane has a weight average molecular weight of about 4,000 to about 160,000.

3. The composition of claim 1 , wherein the polysilazane has a weight average molecular weight of about 20,000 to about 160,000.

4. The composition of claim 1 , wherein the solvent comprises at least one selected from benzene, toluene, xylene, ethylbenzene, diethylbenzene, trimethylbenzene, triethylbenzene, cyclohexane, cyclohexene, decahydro naphthalene, dipentene, pentane, hexane, heptane, octane, nonane, decane, ethylcyclohexane, methylcyclohexane, cyclohexane, cyclohexene, p-menthane, dipropylether, dibutylether, anisole, butyl acetate, amyl acetate, methylisobutylketone, and a combination thereof.

5. The composition of claim 1 , wherein an amount of the polysilazane is about 0.1 to about 30 wt % based on the total amount of the composition.

6. The composition of claim 1 , wherein the polysilazane comprises hydrogenated polysilazane.

7. A silica based layer manufactured from the composition of claim 1 .

8. An electronic device comprising the silica based layer of claim 7 .

9. A method of manufacturing a silica based layer, the method comprising:
coating the composition of claim 1 on a substrate;
drying the coated substrate with the composition to produce a resultant; and
curing the resultant.

10. The method of claim 9 , wherein the polysilazane has a weight average molecular weight of about 4,000 to about 160,000.

11. The method of claim 9 , wherein the polysilazane has a weight average molecular weight of about 20,000 to about 160,000.

12. The method of claim 9 , wherein the solvent comprises at least one selected from benzene, toluene, xylene, ethylbenzene, diethylbenzene, trimethylbenzene, triethylbenzene, cyclohexane, cyclohexene, decahydro naphthalene, dipentene, pentane, hexane, heptane, octane, nonane, decane, ethylcyclohexane, methylcyclohexane, cyclohexane, cyclohexene, p-menthane, dipropylether, dibutylether, anisole, butyl acetate, amyl acetate, methylisobutylketone, and a combination thereof.

13. The method of claim 9 , wherein an amount of the polysilazane is about 0.1 to about 30 wt % based on the total amount of the composition.

14. The method of claim 9 , wherein the polysilazane comprises hydrogenated polysilazane.

15. An electronic device comprising a silica based layer manufactured according to the method of claim 9 .

16. An electronic device comprising a silica based layer, the silica based layer being a derivative of the composition of claim 1 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Jang Jun-Young
• Kwak Taek-Soo
• Kim Woo-Han
• Yun Hui-Chan
• Bae Jin-Hee
• Kim Bo-Sun
• Na Yoong-Hee
• Park Sae-Mi
• Lee Han-Song
• Lim Wan-Hee

Classifications

• H10P14/6922

  the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC · CPC title

• H10P14/6689

  the compound being a silazane · CPC title

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• C08G77/62

  Nitrogen atoms · CPC title

• H01B3/46

  silicones · CPC title