Devices and methods for monitoring, in particular for regulating, a cutting process

US10427242B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10427242-B2
Application numberUS-201615067316-A
CountryUS
Kind codeB2
Filing dateMar 11, 2016
Priority dateSep 13, 2013
Publication dateOct 1, 2019
Grant dateOct 1, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An evaluation apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

First claim

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What is claimed is: 1. A method for monitoring a cutting process on a workpiece, the method comprising: focusing a high-energy beam onto the workpiece; capturing an image of a region of the workpiece to be monitored, the region comprising an interaction region of the high-energy beam with the workpiece, the image captured by forming an observation beam for observing the interaction region from an observation direction extending at an angle to the beam axis of the high-energy beam in a convergent beam path between the focusing element and the workpiece; determining, via a data processor, at least one characteristic variable of a kerf formed during the cutting process on the basis of the captured image of the interaction region; generating an image of the interaction region from along the observation beam; and modifying, via a control apparatus, the alignment of the observation direction in a projection into a plane perpendicular to the beam axis in a manner dependent on an advance direction of the cutting process. 2. The method of claim 1 , wherein the high-energy beam is a laser beam. 3. The method of claim 1 , further comprising: determining a cutting front angle of the kerf and/or an overshoot and/or undershoot of a predetermined cutting front angle of the kerf as the at least one characteristic variable of the cutting process; and regulating the cutting front angle to a predetermined constant value by influencing at least one manipulated parameter of the cutting process. 4. The method of claim 3 , wherein the manipulated parameter for regulating the cutting front angle is selected in a manner dependent on a contour to be cut into the workpiece. 5. The method of claim 3 , wherein the advance speed between the high-energy beam and the workpiece is influenced as a manipulated parameter for regulating the cutting front angle if the advance speed is restricted to a maximum value by the material and the thickness of the workpiece. 6. The method of claim 5 , wherein the power of the high-energy beam is kept at a constant value while influencing the advance speed. 7. The method of claim 3 , wherein the power of the high-energy beam is influenced as a manipulated parameter for regulating the cutting front angle if the advance speed between the high-energy beam and the workpiece is restricted to a maximum value by the geometry of a contour to be cut into the workpiece. 8. The method of claim 7 , wherein the advance speed is kept at the maximum value while influencing the power of the high-energy beam. 9. The method of claim 8 , wherein the power of the high-energy beam is modulated and the modulation of the power of the high-energy beam is influenced as a manipulated parameter for regulating the cutting front angle. 10. The method of claim 3 , wherein the constant value, to which the cutting front angle is regulated, is in the range of 2°-6°. 11. The method of claim 3 , wherein the constant value, to which the cutting front angle is regulated, is in the range of 3°-5°. 12. A non-transitory computer-readable storage device storing computer executable instructions for monitoring a cutting process on a workpiece that, if executed by a computer system, cause the computer system to carry out operations comprising: causing a high-energy beam to focus onto the workpiece; causing an image capture apparatus to capture an image of a region of the workpiece to be monitored, the region comprising an interaction region of the high-energy beam with the workpiece, the capture of the image obtained by forming an observation beam for observing the interaction region from an observation direction extending at an angle to the beam axis of the high-energy beam in a convergent beam path between the focusing element and the workpiece; determining, via a data processor, at least one characteristic variable of a kerf formed during the cutting process, on the basis of the captured image of the interaction region; generating an image of the interaction region from along the observation beam; and modifying, via a control apparatus, the alignment of the observation direction in a projection into a plane perpendicular to the beam axis in a manner dependent on an advance direction of the cutting process. 13. A device for monitoring a cutting process on a workpiece comprising: a focusing element for focusing a high-energy beam onto the workpiece; an image capture apparatus for capturing a region at the workpiece to be monitored, the region comprising an interaction region of the high-energy beam with the workpiece, wherein the image capture apparatus forms an observation beam for observing the interaction region from an observation direction extending at an angle to a beam axis of the high-energy beam, and wherein the image capture apparatus comprises an imaging optic system configured to generate an image of the interaction region from along the observation beam and a data processor configured to determine at least one characteristic variable of a kerf formed during the cutting process on the basis of the image of the interaction region wherein the data processor is configured to determine at least one of a cutting front angle of the kerf, an overshoot of a predetermined cutting front angle, and an undershoot of the predetermined cutting front angle of the kerf as the at least one characteristic variable of the kerf on the basis of the captured interaction region, and wherein the device further comprises a closed-loop control apparatus for regulating the cutting front angle to a predetermined constant value by influencing at least one manipulated parameter of the cutting process, wherein the data processor is configured to determine the cutting front angle of the kerf and wherein the closed-loop control apparatus for regulating the cutting front angle has a continuous-action controller, in particular a PID controller.

Assignees

Inventors

Classifications

  • by boring or cutting · CPC title

  • B23K26/032Primary

    using optical means · CPC title

  • Weld quality monitoring · CPC title

  • Energy control of the laser beam (B23K26/0622 takes precedence) · CPC title

Patent family

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What does patent US10427242B2 cover?
The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An evaluation apparatus determines at least one characteri…
Who is the assignee on this patent?
Trumpf Werkzeugmaschinen Gmbh Co Kg
What technology area does this patent fall under?
Primary CPC classification B23K26/032. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 01 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).