Resistance welding a porous metal layer to a metal substrate

US10427235B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10427235-B2
Application numberUS-201313787150-A
CountryUS
Kind codeB2
Filing dateMar 6, 2013
Priority dateNov 18, 2010
Publication dateOct 1, 2019
Grant dateOct 1, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus and method are provided for manufacturing an orthopedic prosthesis by resistance welding a porous metal layer of the orthopedic prosthesis onto an underlying metal substrate of the orthopedic prosthesis. The resistance welding process involves directing an electrical current through the porous layer and the substrate, which dissipates as heat to cause softening and/or melting of the materials, especially along the interface between the porous layer and the substrate. The softened and/or melted materials undergo metallurgical bonding at points of contact between the porous layer and the substrate to fixedly secure the porous layer onto the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing an orthopedic prosthesis comprising the steps of: providing a metal substrate; providing a porous metal layer having a thickness; positioning the porous metal layer against the metal substrate to form an interface between the porous metal layer and the metal substrate; directly contacting the porous metal layer with a textured contacting surface integral with an electrode during welding, wherein the textured contacting surface of the electrode approximates surface features of the porous metal layer to be directly contacted by the electrode during welding; and directing an electrical current to the interface between the porous metal layer and the metal substrate to resistance weld the porous metal layer to the metal substrate Ode maintaining the thickness of the porous metal layer, the current traveling from the electrode, through the porous metal layer, and toward the metal substrate. 2. The method of claim 1 , further comprising the step of applying a weld pressure to hold the porous metal layer against the substrate, wherein the weld pressure is sufficiently low to avoid deforming the porous metal layer. 3. The method of claim 2 , wherein the weld pressure is less than 3,000 psi (20.7 MPa). 4. The method of claim 1 , wherein the electrical current comprises a pulsed electrical current, the pulsed electrical current includes at least 10 pulses. 5. The method of claim 4 , wherein the directing step comprises directing each pulse of the pulsed electrical current to the orthopedic prosthesis at a current density of at least 75 kA/in 2 (11.6 kA/cm 2 ). 6. The method of claim 4 , wherein pulses of the pulsed electrical current are separated by a cooling time, and the cooling time comprises less than 1 second. 7. The method of claim 1 , wherein the directing step is performed in a controlled atmosphere having an oxygen concentration less than about 10 ppm. 8. The method of claim 1 , wherein the directing step bonds the porous metal layer and the metal substrate together at a tensile strength of 2,900 psi (20.0 MPa) or more. 9. The method of claim 2 , further comprising the step of: applying a forge pressure to the orthopedic prosthesis after the directing step. 10. The method of claim 9 , wherein the forge pressure is less than the weld pressure. 11. The method of claim 1 , wherein the porous metal layer includes reticulated vitreous carbon foam. 12. The method of claim 11 , further comprising coating the reticulated vitreous carbon foam, wherein the coating step comprises a chemical vapor deposition step to coat the outer surface of the porous structure with metal and to infiltrate the porous structure with metal. 13. The method of claim 1 , wherein the textured contacting surface of the electrode includes knurling. 14. The method of claim 13 , wherein the textured contacting surface of the electrode includes pyramid-shaped projections. 15. The method of claim 1 , wherein: the porous metal layer is previously manufactured and has a porosity of 55% to 90%, and positioning of the porous metal layer generates a net contact area of 15% to 25% between the previously manufactured porous metal layer and the metal substrate at said interface; and the method further comprises applying a weld pressure holding the previously manufactured porous metal layer against the metal substrate, wherein said weld pressure is at least 100 psi (0.7 MPa) but less than 3,000 psi (20.7 MPa), and wherein said net contact area is maintained despite applying said weld pressure. 16. The method of claim 14 , wherein the pyramid-shaped projections include projections of different sizes. 17. The method of claim 14 , wherein the knurling includes pyramid-shaped projections of 45 degree and 0.040 pitch geometries.

Assignees

Inventors

Classifications

  • Titanium or titanium-based alloys, e.g. Ti-Ni alloys · CPC title

  • having an open-celled or open-pored structure · CPC title

  • soldered or brazed or welded · CPC title

  • Designing or manufacturing processes · CPC title

  • Femoral heads {; Femoral endoprostheses} · CPC title

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What does patent US10427235B2 cover?
An apparatus and method are provided for manufacturing an orthopedic prosthesis by resistance welding a porous metal layer of the orthopedic prosthesis onto an underlying metal substrate of the orthopedic prosthesis. The resistance welding process involves directing an electrical current through the porous layer and the substrate, which dissipates as heat to cause softening and/or melting of th…
Who is the assignee on this patent?
Zimmer Inc
What technology area does this patent fall under?
Primary CPC classification A61F2/30907. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Oct 01 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).