Corner mounted tip-off tube for vacuum package

Patent metadata

Field	Value
Publication number	US-10425559-B2
Application number	US-201615177185-A
Country	US
Kind code	B2
Filing date	Jun 8, 2016
Priority date	Jun 15, 2015
Publication date	Sep 24, 2019
Grant date	Sep 24, 2019

Abstract

Various embodiments of the present disclosure may include a device comprising a vacuum package housing. The vacuum package housing comprises a base and a plurality of walls connected to the base and defining an interior cavity adapted to receive a focal plane array, wherein at least two of the walls meet to define a corner of the vacuum package housing. The vacuum package housing further comprises an aperture formed at the corner, wherein the aperture extends through the at least two of the walls to provide a channel between the interior cavity of the vacuum package and an external environment, and wherein the aperture is adapted to receive a tip-off tube configured to be changed from an open state to a closed state to maintain a vacuum within the interior cavity.

First claim

What is claimed is:

1. A device comprising:
a vacuum package housing comprising:
a base;
a plurality of walls connected to the base and defining an interior cavity adapted to receive a focal plane array, wherein at least two of the walls meet to define a corner of the vacuum package housing;
a recess formed in the at least two walls at the corner;
an aperture formed at the corner and disposed within the recess, wherein the aperture extends through the at least two of the walls to provide a channel between the interior cavity of the vacuum package and an external environment, and wherein the aperture is adapted to receive a tip-off tube adapted to be changed from an open state to a closed state to maintain a vacuum within the interior cavity; and
wherein the recess is adapted to at least partially enclose the tip-off tube to limit protrusion of the tip-off tube into the external environment while the tip-off tube is in the closed state.

2. The device of claim 1 , further comprising the tip-off tube connected to the vacuum package housing at the aperture.

3. The device of claim 2 , wherein the tip-off tube is in the open state and is adapted to be connected to a vacuum pump to substantially evacuate the interior cavity of the vacuum package housing.

4. The device of claim 3 , further comprising the vacuum pump connected to the tip-off tube.

5. The device of claim 2 , wherein the tip-off tube is in the closed state.

6. The device of claim 1 , further comprising the tip-off tube in the closed state and connected to the vacuum package housing at the aperture.

7. The device of claim 1 , wherein the vacuum package housing is substantially rectangular, and wherein the base and the walls are one integrated structure.

8. The device of claim 1 , further comprising:
the focal plane array disposed in the interior cavity of the vacuum package housing;
supporting electronics disposed in the interior cavity of the vacuum package housing with the focal plane array, wherein the supporting electronics comprise a read out integrated circuit; and
a plurality of connecting pins extended from the interior cavity of the vacuum package through the base, wherein the connecting pins are adapted to connect the supporting electronics to external additional electronics.

9. The device of claim 8 , further comprising:
a window connected to the plurality of walls;
wherein the window is adapted to pass infrared radiation from a scene in the external environment; and
wherein the focal plane array is adapted to receive the infrared radiation.

10. A thermal camera comprising the device of claim 9 .

11. A method of operating the device of claim 9 , the method comprising capturing a thermal image by the focal plane array.

12. A method of sealing the device of claim 1 , the method comprising:
providing the base and the walls of the vacuum package housing;
forming the aperture at the corner of the vacuum package housing;
soldering the tip-off tube to the vacuum package housing at the aperture while the tip-off tube is in the open state;
connecting the tip-off tube to a vacuum pump;
evacuating the interior of the vacuum package through the tip-off tube using the vacuum pump; and
changing the tip-off tube to the closed state to maintain a vacuum within the interior cavity.

13. The device of claim 1 , wherein portions of the walls defining the corner extend above and below the recess toward the external environment.

14. A method comprising:
providing a vacuum package housing comprising a base and a plurality of walls connected to the base, wherein the base and the walls define an interior cavity adapted to receive a focal plane array, and wherein at least two of the walls meet to define a corner of the vacuum package housing;
forming a recess formed in the at least two walls at the corner;
forming an aperture at the corner of the vacuum package housing and disposed within the recess, wherein the aperture extends through the at least two of the walls to provide a channel between the interior cavity of the vacuum package and an external environment, and wherein the aperture is adapted to receive a tip-off tube adapted to be changed from an open state to a closed state to maintain a vacuum within the interior cavity; and
wherein the recess is adapted to at least partially enclose the tip-off tube to limit protrusion of the tip-off tube into the external environment while the tip-off tube is in the closed state.

15. The method of claim 14 , further comprising connecting the tip-off tube to the vacuum package housing at the aperture.

16. The method of claim 15 , further comprising:
connecting the tip-off tube to the vacuum pump; and
operating the vacuum pump while the tip-off tube is in the open state to substantially evacuate the interior cavity of the vacuum package housing.

17. The method of claim 16 , further comprising sealing the tip-off tube to change the tip-off tube to the closed state.

18. The method of claim 14 , further comprising:
providing the focal plane array in the interior cavity of the vacuum package housing;
providing supporting electronics in the interior cavity of the vacuum package housing with the focal plane array, wherein the supporting electronics comprise a read out integrated circuit; and
providing a plurality of connecting pins extended from the interior cavity of the vacuum package through the base, wherein the connecting pins are adapted to connect the supporting electronics to external additional electronics.

19. The method of claim 18 , further comprising:
connecting a window to the plurality of walls, wherein the window is adapted to pass infrared radiation from a scene in the external environment, and wherein the focal plane array is adapted to receive the infrared radiation.

20. The method of claim 14 , wherein portions of the walls defining the corner extend above and below the recess toward the external environment.

Assignees

• Flir Systems

Inventors

• Clay Jr Royce Duane
• Williamson William
• Nuttman Michael

Classifications

• H04N23/51 Primary

  Housings · CPC title

• B65D11/10

  of polygonal cross-section and all parts being permanently connected to each other (B65D11/18 takes precedence) · CPC title

• H05K5/0095

  hermetically-sealed · CPC title

• G01J5/061

  by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats · CPC title

• B65D81/2015

  in an at least partially rigid container (B65D81/2038 takes precedence) · CPC title