Radiation detector assembly and method of making the same

Patent metadata

Field	Value
Publication number	US-10422889-B2
Application number	US-201715856303-A
Country	US
Kind code	B2
Filing date	Dec 28, 2017
Priority date	Dec 29, 2016
Publication date	Sep 24, 2019
Grant date	Sep 24, 2019

Abstract

A radiation detector assembly and a method of manufacturing the same are provided. The radiation detector assembly includes a base and an outer encapsulation layer. The base includes a scintillator having a light-entering surface and a light-exiting surface on both ends thereof, respectively; a reflection layer provided on the light-entering surface and an outer peripheral surface of the scintillator; a photosensor comprising a photosensitive surface and an encapsulation housing, the photosensitive surface is coupled to the light-exiting surface via an optical adhesive; and an inner encapsulation layer adhered to an outer surface of the reflection layer and hermetically encapsulates a coupling portion where the scintillator and the photosensor connected with each other. The outer encapsulation layer is provided on the outer surface of the base.

First claim

What is claimed is:

1. A radiation detector assembly, comprising:
a base, comprising:
a scintillator, having a light-entering surface and a light-exiting surface on both ends thereof, respectively;
a reflection layer, provided on the light-entering surface and an outer peripheral surface of the scintillator;
a photosensor, comprising a photosensitive surface and an encapsulation housing, wherein the photosensitive surface is coupled to the light-exiting surface via an optical adhesive; and
an inner encapsulation layer, adhered to an outer surface of the reflection layer and hermetically encapsulating a coupling portion where the scintillator and the photosensor connected with each other, wherein the inner encapsulation layer encapsulates the photosensor; and

an outer encapsulation layer, provided on the outer surface of the base.

2. The radiation detector assembly according to claim 1 , wherein the outer encapsulation layer is chemically deposited on the outer surface of the base.

3. The radiation detector assembly according to claim 2 , wherein the inner encapsulation layer encloses a cofferdam protruding from the light-exiting surface on the scintillator, and the optical adhesive is disposed in the cofferdam, the photosensor is disposed in the optical adhesive, and the photosensitive surface of the photosensor is attached to the light-exiting surface, the optical adhesive covers the encapsulating housing of the photosensor and is flush with the top end portion of the cofferdam.

4. The radiation detector assembly according to claim 1 , wherein the outer encapsulation layer is an organic thin film formed by means of low-pressure chemical deposition.

5. The radiation detector assembly according to claim 4 , wherein the inner encapsulation layer encloses a cofferdam protruding from the light-exiting surface on the scintillator, and the optical adhesive is disposed in the cofferdam, the photosensor is disposed in the optical adhesive, and the photosensitive surface of the photosensor is attached to the light-exiting surface, the optical adhesive covers the encapsulating housing of the photosensor and is flush with the top end portion of the cofferdam.

6. The radiation detector assembly according to claim 1 , wherein the inner encapsulation layer comprises at least one metal film layer and/or organic film layer.

7. The radiation detector assembly according to claim 6 , wherein the inner encapsulation layer encloses a cofferdam protruding from the light-exiting surface on the scintillator, and the optical adhesive is disposed in the cofferdam, the photosensor is disposed in the optical adhesive, and the photosensitive surface of the photosensor is attached to the light-exiting surface, the optical adhesive covers the encapsulating housing of the photosensor and is flush with the top end portion of the cofferdam.

8. The radiation detector assembly according to claim 1 , wherein the inner encapsulation layer has a thickness less than 0.1 mm; and/or the outer encapsulation layer has a thickness of not less than 10 μm.

9. The radiation detector assembly according to claim 8 , wherein the inner encapsulation layer encloses a cofferdam protruding from the light-exiting surface on the scintillator, and the optical adhesive is disposed in the cofferdam, the photosensor is disposed in the optical adhesive, and the photosensitive surface of the photosensor is attached to the light-exiting surface, the optical adhesive covers the encapsulating housing of the photosensor and is flush with the top end portion of the cofferdam.

10. The radiation detector assembly according to claim 1 , wherein the scintillator is a cuboid having a rectangular cross section.

11. The radiation detector assembly according to claim 10 , wherein the inner encapsulation layer encloses a cofferdam protruding from the light-exiting surface on the scintillator, and the optical adhesive is disposed in the cofferdam, the photosensor is disposed in the optical adhesive, and the photosensitive surface of the photosensor is attached to the light-exiting surface, the optical adhesive covers the encapsulating housing of the photosensor and is flush with the top end portion of the cofferdam.

12. The radiation detector assembly according to claim 1 , wherein the inner encapsulation layer encloses a cofferdam protruding from the light-exiting surface on the scintillator, and the optical adhesive is disposed in the cofferdam, the photosensor is disposed in the optical adhesive, and the photosensitive surface of the photosensor is attached to the light-exiting surface, the optical adhesive covers the encapsulating housing of the photosensor and is flush with the top end portion of the cofferdam.

13. A method of manufacturing a radiation detector assembly, comprising:
forming a base, wherein the base comprises a scintillator, a photosensor and an inner encapsulation layer; the scintillator has a light-entering surface and a light-exiting surface on both ends thereof, respectively; and a reflection layer is provided on the light-entering surface and an outer peripheral surface of the scintillator; the photosensor is coupled to the light-exiting surface of the scintillator via an optical adhesive; the inner encapsulation layer is adhered to the outer surface of the reflection layer and hermetically encapsulates the coupling portion between the scintillator and the photosensor, and the inner encapsulation layer encapsulates the photosensor; and
forming an outer encapsulation layer on the outer surface of the base by chemical deposition.

14. The method of manufacturing the radiation detector assembly according to claim 13 , wherein forming an organic thin film on the outer surface of the base by means of a chemical deposition while forming the outer encapsulation layer.

15. The method of manufacturing the radiation detector assembly according to claim 14 , wherein forming an organic thin film on the outer surface of the base by means of a low-pressure chemical deposition while forming the outer encapsulation layer.

16. The method of manufacturing the radiation detector assembly according to claim 13 , wherein the inner encapsulation layer comprises at least one metal film layer and/or organic film layer.

17. The method of manufacturing the radiation detector assembly according to claim 13 , wherein when the substrate is formed, firstly, the inner encapsulation layer encloses a cofferdam protruding from the light-exiting surface on the scintillator, and then the scintillator is presented in a erected state so that the light-exiting surface is above the light-entering surface, optical adhesive is added into the cofferdam, and the light sensitive device is disposed in the optical adhesive so that the photosensitive surface of the photosensor is attached to the light-exiting surface, and the optical adhesive covers a encapsulating housing of the photosensor and is flush with the top end portion of the cofferdam.

Assignees

• Nuctech Co Ltd

Inventors

• Zhao Bozhen
• Zhang Qingjun
• Zhao Ziran
• Li Shuwei
• Sun Lifeng
• Zhang Wenjian

Classifications

• G01T1/20 Primary

  with scintillation detectors · CPC title

• G01T1/2006 Primary

  using a combination of a scintillator and photodetector which measures the means radiation intensity · CPC title

• G01T1/2002

  Optical details, e.g. reflecting or diffusing layers · CPC title

• G01T1/2018

  Scintillation-photodiode combinations · CPC title

• H10F39/10 Primary

  Integrated devices · CPC title