Device for detecting the level of a medium
US-2019128726-A1 · May 2, 2019 · US
US10422672B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-10422672-B1 |
| Application number | US-201815915452-A |
| Country | US |
| Kind code | B1 |
| Filing date | Mar 8, 2018 |
| Priority date | Mar 8, 2018 |
| Publication date | Sep 24, 2019 |
| Grant date | Sep 24, 2019 |
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A method, structure and system for capacitive sensing is provided. The structure includes: one or more first conductive lines arranged in a first arrangement in relation to a first substrate, one or more second conductive lines connected arranged in a second arrangement in relation to a second substrate, one or more first vias embedded on the first substrate and connecting one or more first electrodes to each respective one of the one or more first conductive lines; and one or more second vias embedded on the second substrate and connecting the one or more second electrodes to each respective one of the one or more second conductive lines, where the one or more first conductive electrodes and the second one or more electrodes are parallel and overlapping with respect to one another, and, where i) the first conductive electrodes and ii) the second conductive electrodes form a two-dimensional configuration.
Opening claim text (preview).
What is claimed is: 1. A structure for sensing material movement, comprising: one or more first conductive lines arranged in a first arrangement in relation to a first substrate, one or more second conductive lines connected arranged in a second arrangement in relation to a second substrate; one or more first vias embedded on the first substrate and connecting one or more first electrodes to each respective one of the one or more first conductive lines; and one or more second vias embedded on the second substrate and connecting the one or more second electrodes to each respective one of the one or more second conductive lines, wherein the one or more first conductive electrodes and the second one or more electrodes are parallel and overlapping with respect to one another, and wherein i) the one or more first conductive electrodes and ii) the one or more second conductive electrodes form a two-dimensional sensing configuration. 2. The structure according to claim 1 , wherein the one or more first vias are in a distinct plane in relation to both the one or more first electrodes and the one or more first conducting lines, and wherein each one of the first one or more electrodes and each corresponding one of the second one or more electrodes forms one or more electrode pairs configured to receive at least one particle for capacitive sensing. 3. The structure according to claim 2 , wherein the one or more second vias are in a distinct plane in relation to both the one or more second electrodes and the one or more second conductive lines. 4. The structure according to claim 3 , wherein the each one of the first substrate and the second substrate comprises an opaque material. 5. The structure according to claim 3 , wherein each one of the first substrate and the second substrate comprises a transparent material. 6. The structure according to claim 4 , wherein each one of the first substrate and the second substrate comprises a metal, and wherein an interface oxide layer coats each substrate at a respective interface where each one of the one or more first vias exits the first substrate and where each one of the one or more second via exits the second substrate. 7. The structure according to claim 3 , wherein the first substrate is a ground plane that electrically isolates each one of the one or more second conductive lines from communicating with another one of the one or more second conductive lines. 8. The structure according to claim 7 , wherein the second substrate is a ground plane that electrically isolates each one of the one or more first conductive lines from communicating with another one of the one or more first conductive lines. 9. The structure according to claim 8 , wherein each one of the first substrate and the second substrate form a faraday cage that prohibits parasitic interference among i) each of the one or more first conductive lines and another one of the one or more first conductive lines, ii) each one of the one or more second conductive lines and another one of the one or more second conductive lines, and iii) each one of the one or more first conductive lines and each one of the one or more second conductive lines. 10. The structure according to claim 9 , wherein each one of the first substrate and the second substrate form a faraday cage that prohibits parasitic interference among i) each of the one or more first conductive electrodes and another one of the one or more first conductive electrodes, ii) each one of the one or more second conductive electrodes and another one of the one or more second conductive electrodes, and iii) each one of the one or more first conductive electrodes and each one of the one or more second conductive electrodes. 11. A method comprising: depositing at least one particle for capacitive sensing through a cross section of a two-dimensional structure, wherein the two-dimensional structure comprises: i) a first plane associated with a first substrate containing one or more first conductive electrodes and ii) a second plane associated with a second substrate containing one or more second conductive electrodes, wherein the one or more first conductive electrodes and the one or more second electrodes are overlapping with respect to one another, and wherein the i) one or more first conductive electrodes and ii) the one or more second conductive electrodes form a two-dimensional sensing configuration; connecting, respectively, the one or first conductive electrodes to one or more first conductive lines by one or more first vias; and connecting, respectively, the one or second conductive electrodes to one or more second conductive lines by one or more second vias, wherein each one of the one or more first electrodes and each corresponding one of the one or more second electrodes forms one or more electrode pairs configured to receive at least one particle for sensing. 12. The method according to claim 11 comprising: reducing parasitic interference by placing the one or more first vias on a distinct plane from both the one or more first conductive lines and the one or more first electrodes. 13. The method according to claim 12 comprising: reducing parasitic interference by placing the one or more second vias on a distinct plane from both the one or more second conductive lines and the one or more second electrodes. 14. The method according to claim 13 , wherein the reduced parasitic interference associated with both substrates enables a linear n/2 number of sensing measurements with respect to the at least one particle, where n refers to a total number of electrodes associated with the two-dimensional sensing structure. 15. The method according to claim 14 , wherein the first substrate is a ground plane that electrically insulates each one of the one or more first conductive lines from communicating with another one of the one or more first conductive lines. 16. The method according to claim 15 , wherein second substrate is a ground plane that electrically insulates each one of the one or more second conductive lines from communicating with another one of the one or more first conductive lines. 17. The method according to claim 16 , wherein each one of the first substrate and the second substrate form a faraday cage that prohibits parasitic interference among i) each of the one or more first conductive lines and another one of the one or more first conductive lines, ii) each one of the one or more second conductive lines and another one of the one or more second conductive lines, and iii) each one of the one or more first conductive lines and each one of the one or more second conductive lines. 18. The method according to claim 17 , wherein each one of the first substrate and the second substrate form a faraday cage that prohibits parasitic interference among I) each of the one or more first conductive electrodes and another one of the one or more first conductive electrodes, ii) each one of the one or more second conductive electrodes and another one of the one or more second conductive electrodes, and iii) each one of the one or more first conductive electrodes and each one of the one or more second conductive electrodes. 19. A system comprising: a two-dimensional electrode structure comprising: one or more first conductive electrodes in a first plane associated with a first substrate, one or more second conductive electrodes in a second plane associated with a second substrate, one or more dielectric materials between the first plane and the second plane, one or more first conductive lines co
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