Three point mount for a vibration sensing apparatus

US10422667B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10422667-B2
Application numberUS-201715483302-A
CountryUS
Kind codeB2
Filing dateApr 10, 2017
Priority dateApr 10, 2017
Publication dateSep 24, 2019
Grant dateSep 24, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensing module apparatus is provided for monitoring a vibrating machine or structure, such as a pump, which include three mounting points on the apparatus for securely mounting the apparatus to the vibrating machine or structure. The three-point mount configuration provides the sensor module with a very rigid mount connection to virtually any surface condition, including flat, curved or irregular. All six degrees of freedom (X, Y, Z, theta-X, theta-Y and theta-Z) are properly constrained. The three-point mount also provides an air barrier or gap between the sensing module and the equipment surface, allowing the sensor to be mounted to higher surface temperature devices.

First claim

Opening claim text (preview).

We claim: 1. A sensing apparatus for mounting on a vibrating machine or structure, including a pump, comprising: a base comprising three mounting points configured to mount the sensing apparatus to the vibrating machine or structure, wherein the three mounting points comprise: a first mounting projection providing a first mounting point; a second mounting projection providing a second mounting point; and a third mounting projection providing a third mounting point, wherein the third mounting projection protrudes out from the base of the sensing apparatus and the third mounting projection comprises a rim surrounding an opening, wherein the opening is formed through a body of the sensing apparatus and the opening is configured to receive a fastener configured to secure the sensing apparatus to the vibrating machine or structure. 2. The sensing apparatus of claim 1 , wherein the first, second and third mounting projections are configured to constrain movement of the sensing apparatus in six degrees of freedom when the sensing apparatus is mounted to the vibrating machine or structure. 3. The sensing apparatus of claim 1 , wherein the first, second and third mounting projections are configured to form an air gap between the sensing apparatus and the vibrating machine or structure when the sensing apparatus is mounted to the vibrating machine or structure. 4. The sensing apparatus of claim 1 , wherein the first mounting projection and the second mounting projection are rounded projections extending from the base. 5. The sensing apparatus of claim 4 , wherein the first mounting projection and second mounting projection have the same diameter. 6. The sensing apparatus of claim 4 , wherein the first mounting projection and second mounting projection have the same height. 7. The sensing apparatus of claim 1 , wherein the base of the sensing apparatus is rectangular in shape, and the first and second mounting projections are positioned in separate corners of the base. 8. The sensing apparatus of claim 7 , wherein the first and second mounting projections are positioned in separate corners along a same edge of the base. 9. The sensing apparatus of claim 8 , wherein the third mounting projection is positioned in a location on the base of the sensing apparatus so as to form a triangular set of mounting projections on the base of the sensing apparatus. 10. The sensing apparatus of claim 1 , wherein the first mounting projection, second mounting projection and third mounting projection are positioned on the base of the sensing apparatus so as to form a set of mounting points on the base of the sensing apparatus arranged in a triangle. 11. The sensing apparatus of claim 10 , wherein the first mounting projection and the second mounting projection are positioned at extremities of the base of the sensing apparatus. 12. The sensing apparatus of claim 11 , wherein the triangle includes an angle at the third mounting position of approximately 120 degrees. 13. The sensing apparatus of claim 12 , wherein a pre-load force is positioned at a centroid of the triangle formed by the first mounting projection, second mounting projection and third mounting projection. 14. The sensing apparatus of claim 1 , wherein the first mounting projection and the second mounting projection are hemispherical projections extending from the base. 15. The sensing apparatus of claim 1 , wherein the first mounting projection and the second mounting projection are molded into the base. 16. The sensing apparatus of claim 1 , wherein the first mounting projection and the second mounting projection are secured to the base with a press fit, threading or an industrial adhesive. 17. The sensing apparatus of claim 1 , wherein the base comprises one or more cavities formed therein.

Assignees

Inventors

Classifications

  • Measuring {characteristics of} vibrations in solids by using direct conduction to the detector (G01H9/00, G01H11/00 take precedence) · CPC title

  • G01D11/245Primary

    Housings for sensors · CPC title

  • Testing machines, pumps, or pumping installations · CPC title

  • G01D11/305Primary

    Panel mounting of instruments · CPC title

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Frequently asked questions

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What does patent US10422667B2 cover?
A sensing module apparatus is provided for monitoring a vibrating machine or structure, such as a pump, which include three mounting points on the apparatus for securely mounting the apparatus to the vibrating machine or structure. The three-point mount configuration provides the sensor module with a very rigid mount connection to virtually any surface condition, including flat, curved or irreg…
Who is the assignee on this patent?
Itt Mfg Enterprises Llc
What technology area does this patent fall under?
Primary CPC classification G01D11/245. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 24 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).