Flexible printed circuit and a method of fabricating a flexible printed circuit

US10420215B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10420215-B2
Application numberUS-201214396964-A
CountryUS
Kind codeB2
Filing dateJun 29, 2012
Priority dateJun 29, 2012
Publication dateSep 17, 2019
Grant dateSep 17, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.

First claim

Opening claim text (preview).

The invention claimed is: 1. A flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion, the electrically-conductive layer portion being superimposed over the substrate layer portion; wherein the substrate layer portion has an opening formed therein and part of the electrically-conductive layer portion is positioned over the opening to form a detachable tab, the tab being for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit, said another portion comprising at least one electric circuit, the at least one electric circuit comprising a plurality of electrically conductive traces, wherein the electrically-conductive layer portion comprises a notch adjacent to and over the opening of the substrate layer portion, the notch connecting the tab to an adjacent part of the electrically-conductive layer portion, the notch providing a localized area of weakness in the electrically-conductive layer portion and being for use in initiating detachment of the tab from the adjacent part of the electrically-conductive layer portion, and wherein the flexible printed circuit is configured such that said one portion is completely detachable from said another portion without damaging the at least one electric circuit by peeling the tab, said one portion comprising the tab. 2. The flexible printed circuit of claim 1 , wherein the electrically-conductive layer portion comprises a groove, the groove being configured in use to guide the separation of said one portion from said another portion. 3. The flexible printed circuit of claim 2 , wherein the groove of the electrically-conductive layer portion is additionally configured in use to guide partial detachment of the tab from an adjacent part of the electrically-conductive layer portion. 4. The flexible printed circuit of claim 1 , wherein the flexible printed circuit further comprises a cover layer portion, the cover layer portion being superimposed over the electrically-conductive layer portion, the electrically-conductive layer portion being positioned in-between the cover layer portion and the substrate layer portion. 5. The flexible printed circuit of claim 4 , wherein the cover layer portion comprises a groove, the groove being configured in use to guide the separation of said one portion from said another portion. 6. The flexible printed circuit of claim 5 , wherein the groove of the cover layer portion is additionally configured in use to guide partial detachment of the tab from an adjacent part of the electrically conductive layer portion. 7. The flexible printed circuit of claim 1 , wherein said one portion and said another portion are adjacent strips of flexible printed circuit joined together along their respective length portions, wherein the tab is positioned at a first end portion of said one portion. 8. The flexible printed circuit of claim 7 , wherein a second tab is positioned at a second end portion of said one portion, the first and second end portions being at opposite ends of said one portion. 9. A flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion, the electrically-conductive layer portion being superimposed over the substrate layer portion; wherein the substrate layer portion has a plurality of openings formed therein and a different part of the electrically-conductive layer portion is positioned over each opening to form a plurality of detachable tabs, each tab being for use in initiating separation of two portions of the flexible printed circuit from each other, one of the two portions comprising the tab, the other of the two portions comprising an electric circuit, the electric circuit comprising a plurality of electrically conductive traces, said one portion being completely detachable from said other portion without damaging the electric circuit by peeling the tab, and wherein for each tab in the plurality of detachable tabs, the electrically-conductive layer portion comprises a notch adjacent to and over the opening of the substrate layer portion, the notch connecting the tab to an adjacent part of the electrically-conductive layer portion, the notch providing a localized area of weakness in the electrically-conductive layer portion and being for use in initiating detachment of the tab from the adjacent part of the electrically-conductive layer portion. 10. A flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion disposed on the substrate layer portion, the electrically-conductive layer portion comprising a plurality of alternating electric circuit portions and discard portions, each of the discard portions comprising a partially detachable tab disposed over an opening in the substrate layer portion, and wherein for each tab in the plurality of discard portions, the electrically-conductive layer portion comprising a notch adjacent to and over the opening of the substrate layer portion, the notch connecting the tab to an adjacent part of the electrically-conductive layer portion, the notch providing a localized area of weakness in the electrically-conductive layer portion and being for use in initiating detachment of the tab from the adjacent part of the electrically-conductive layer portion, each of the discard portions being separated from an adjacent electric circuit portion by a groove in the electrically-conductive layer portion, each electric circuit portion comprising a plurality of electrically conductive traces. 11. The flexible printed circuit of claim 10 , wherein the discard portions are arranged in parallel rows. 12. The flexible printed circuit of claim 10 , wherein each electric circuit portion comprises a same arrangement of the electrically conductive traces. 13. The flexible printed circuit of claim 10 , wherein the flexible printed circuit further comprises a cover layer portion disposed on the electrically-conductive layer portion opposite the substrate layer portion.

Assignees

Inventors

Classifications

  • PCB or component having an integral separable or breakable part · CPC title

  • Integral conductive tabs, i.e. conductive parts partly detached from the substrate · CPC title

  • H05K1/118Primary

    specially for flexible printed circuits, e.g. using folded portions · CPC title

  • by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title

  • in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

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Frequently asked questions

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What does patent US10420215B2 cover?
Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a p…
Who is the assignee on this patent?
Foo Siang Sin, How Choong Meng, 3M Innovative Properties Co
What technology area does this patent fall under?
Primary CPC classification H05K1/118. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).