Low-profile power and data contacts

US10418741B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10418741-B2
Application numberUS-201816214121-A
CountryUS
Kind codeB2
Filing dateDec 9, 2018
Priority dateSep 8, 2015
Publication dateSep 17, 2019
Grant dateSep 17, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device comprising: a device enclosure having a plurality of openings; a plurality of electrical contacts, each electrical contact located in a corresponding one of the plurality of openings in the device enclosure such that a gap exists between an outside edge of each contact and an inside edge of the corresponding opening in the device enclosure, each electrical contact having a contacting surface for mating with a contact on a corresponding device when the electronic device and corresponding device are mated; a housing comprising a plurality of insulating rings, each of the plurality of insulating rings filling the gap between the outside edge of an electrical contact and the inside edge of the corresponding opening in the device enclosure, the housing further comprising a plurality of alignment features on a back side; and a flexible circuit board attached to the back side of the housing, the flexible circuit board comprising a plurality of openings, each opening to align with a corresponding alignment feature. 2. The electronic device of claim 1 wherein each of the plurality of electrical contacts are soldered to the flexible circuit board. 3. The electronic device of claim 2 further comprising a bracket positioned such that the plurality of electrical contacts are between the bracket and the device enclosure. 4. The electronic device of claim 3 wherein the bracket comprises fastener openings at opposing ends, and further comprising a plurality of fasteners, each passing through a corresponding fastener opening and into a corresponding fastener opening in the device enclosure. 5. The electronic device of claim 1 wherein the contacting surface of each of the plurality of electrical contacts is flat and is at least substantially flush with an outside surface of the device enclosure. 6. The electronic device of claim 1 wherein the contacting surface of each of the plurality of electrical contacts is at least substantially flush with an outside surface of the device enclosure. 7. The electronic device of claim 1 wherein the flexible circuit board is attached to the housing using an adhesive. 8. An electronic device comprising: a device enclosure having a plurality of openings; a plurality of electrical contacts, each electrical contact located in a corresponding one of the plurality of openings in the device enclosure, each electrical contact having a contacting surface for mating with a contact on a corresponding device when the electronic device and corresponding device are mated; a housing comprising a plurality of insulating rings, each insulating ring between a contact and the device enclosure, the housing further comprising a plurality of alignment features on a back side; and a flexible circuit board attached to the back side of the housing, the flexible circuit board comprising a plurality of openings, where each of the alignment features pass through a corresponding opening in the plurality of openings in the flexible circuit board. 9. The electronic device of claim 8 further comprising a bracket positioned such that the plurality of electrical contacts are between the bracket and the device enclosure. 10. The electronic device of claim 9 further comprising a silicone gasket between the housing and the device enclosure. 11. The electronic device of claim 8 wherein the contacting surface of each of the plurality of electrical contacts is at least substantially flush with an outside surface of the device enclosure. 12. The electronic device of claim 8 wherein the contacting surface of each of the plurality of electrical contacts is flat and is at least substantially flush with an outside surface of the device enclosure. 13. An electronic device comprising: a device enclosure having a plurality of openings; a plurality of electrical contacts, each electrical contact having a contacting surface on a first side and a contacting portion on a second side opposing the first side, each contacting surface for mating with a contact on a corresponding device when the electronic device and corresponding device are mated, and each electrical contact located in a corresponding one of the plurality of openings in the device enclosure; a housing comprising a plurality of insulating rings, each insulating ring around an outside of a corresponding one the plurality of electrical contacts, wherein the housing fits in a recess in the device enclosure; a bracket having fastener openings at opposing ends; a flexible circuit board attached to a rear surface of the housing such that the flexible circuit board is between the housing and the bracket; and a plurality of fasteners, each passing through a corresponding fastener opening in the bracket and into a corresponding fastener opening in the device enclosure. 14. The electronic device of claim 13 wherein the housing is formed of plastic. 15. The electronic device of claim 14 further comprising a seal between the housing and the device enclosure, wherein the seal is a gasket. 16. The electronic device of claim 15 wherein the flexible circuit board is attached to contacting portions of each of the plurality of electrical contacts, and wherein the flexible circuit board is attached to the housing using a heat-activated film. 17. The electronic device of claim 16 wherein the housing further comprises a plurality of posts and wherein the flexible circuit board comprises a plurality of openings, each of the posts extending through a corresponding one of the openings in the flexible circuit board. 18. The electronic device of claim 17 further comprising a shim between the housing and the device enclosure. 19. The electronic device of claim 13 wherein the contacting surface of each of the plurality of electrical contacts is at least substantially flush with an outside surface of the device enclosure. 20. The electronic device of claim 13 wherein the contacting surface of each of the plurality of electrical contacts is flat and is at least substantially flush with an outside surface of the device enclosure.

Assignees

Inventors

Classifications

  • for flexible printed circuits, flat or ribbon cables or like structures · CPC title

  • G06F1/1656Primary

    Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

  • with a panel or printed circuit board · CPC title

  • Soldering or welding · CPC title

  • Contacts for co-operating by abutting · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10418741B2 cover?
Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification G06F1/1656. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).