Bonding using conductive particles in conducting adhesives

Patent metadata

Field	Value
Publication number	US-10418504-B2
Application number	US-201816204257-A
Country	US
Kind code	B2
Filing date	Nov 29, 2018
Priority date	Jan 4, 2016
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

An anisotropic conducting adhesive is improved in conductivity without increasing the density of admixed conductive particles by inducing metallic fusion between the surfaces of the conducting particles and the surfaces being bonded. The metallic fusion may be promoted by physical/chemical interaction characteristic of certain materials at a compressed interface; by compression sufficient to deform the conductive particles in a manner that increases the mechanical contact area; by heating (with or without melting of a material), which may also serve to cure the adhesive matrix; or by acoustic vibration, e.g., ultrasonic vibration. The resulting metallic-fusion joint is stronger, as well as more conductive, than a joint in which the particles and surfaces are held in unfused mechanical contact.

First claim

What is claimed is:

1. A manufactured article comprising:
a first component, comprising a first conductive surface portion, formed by a first conductive material;
a second component, comprising a second conductive surface portion, formed by a second conductive material; and
an adhesive layer, disposed between the first conductive surface portion of the first component and the second conductive surface portion of the second component and attaching the first conductive surface portion of the first component to the second conductive surface portion of the second component,
wherein the adhesive layer comprises an adhesive matrix and one or more conductive particles, each comprising a polymer core and a conductive shell and embedded into the adhesive matrix,
wherein the conductive shell of each of the one or more conductive particles is metallically fused with the first conductive surface portion and the second conductive surface portion by diffusing the first conductive material and the second conductive material into the conductive shell thereby establishing a conductive path between the first conductive surface portion and the second conductive surface portion through the conductive shell, and
wherein each of the first conductive material and the second conductive material interdiffuses into the conductive shell at a temperature is less than a melting temperature of the conductive shell.

2. The manufactured article of claim 1 , wherein the adhesive matrix is electrically insulating.

3. The manufactured article of claim 1 , wherein the adhesive matrix is thermally insulating.

4. The manufactured article of claim 1 , wherein the polymer core is compressible.

5. The manufactured article of claim 1 , wherein a gap between the first conductive surface portion and the second conductive surface portion is between 1 micron and 50 microns.

6. The manufactured article of claim 1 , wherein a size of the conductive particles varies less than 20% from an average size.

7. The manufactured article of claim 1 , wherein the conductive particles occupy less than 1% of a bonded area between the first conductive surface portion and the second conductive surface portion.

8. The manufactured article of claim 1 , wherein the first conductive surface portion has a different coefficient of thermal expansion from the second conductive surface portion.

9. The manufactured article of claim 1 , wherein at least one of the first conductive surface portion or the second conductive surface portion has an RMS surface roughness between 1% and 50% of a diameter of the conductive particles.

10. The manufactured article of claim 1 , further comprising an interface layer disposed between the adhesive layer and one of the first conductive surface portion or the second conductive surface portion, wherein the interface layer comprises conductive bodies and a primer matrix.

11. The manufactured article of claim 10 , wherein the conductive bodies are different in size or shape from the conductive particles.

12. The manufactured article of claim 10 , wherein the conductive bodies are different in composition from the conductive particles.

13. The manufactured article of claim 1 , wherein each of the one or more conductive particles are compressed between the first conductive surface portion and the second conductive surface portion.

14. The manufactured article of claim 1 , wherein each of the first conductive material and the second conductive material comprises a first material, and wherein the conductive shell comprises the first material and a second material, such that the first material is substitutionally dissolved in the second material.

15. The manufactured article of claim 1 , wherein each of the first conductive material and the second conductive material comprises a first material, selected from the group consisting of gold, silver, copper, and platinum, and wherein the conductive shell comprises the first material and a second material, selected from the group consisting of indium, gallium, thallium, and aluminum.

16. The manufactured article of claim 14 , wherein the first conductive material is gold and the second material is indium.

17. The manufactured article of claim 16 , wherein each of the first component and the second component further comprises nickel.

18. The manufactured article of claim 17 , wherein nickel of the first component forms a layer disposed under the first conductive surface portion, blocking diffusion of gold into a remaining portion of the first component, interfacing the layer.

19. The manufactured article of claim 18 , wherein the remaining portion of the first component is a semiconductor layer.

20. The manufactured article of claim 1 , wherein the first component is a solar cell.

Assignees

• Boeing Co

Inventors

• Rehder Eric M

Classifications

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• Y02E10/50

  Photovoltaic [PV] energy · CPC title

• B32B2305/30

  Fillers, e.g. particles, powders, beads, flakes, spheres, chips · CPC title

• B32B15/01

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title

• B32B15/018

  one layer being formed of a noble metal or a noble metal alloy · CPC title