Apparatus for aligning magnetic wire and method for aligning the same

Patent metadata

Field	Value
Publication number	US-10418176-B2
Application number	US-201715805852-A
Country	US
Kind code	B2
Filing date	Nov 7, 2017
Priority date	Aug 10, 2017
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

Apparatus for aligning magnetic wire aligns magnetic wires on a wire alignment substrate along its base lines, which are positions the magnetic wires are aligned with, with a small interval and without inducing torsional stresses. A microscope is used to detect misplacement between the base line and a reference line that is the magnetic wire taking a form of a straight line under application of tensile force and pulled out by a wire chuck. The misplacement is corrected using a position adjustment device of a substrate attaching base to which the wire alignment substrate is attached. The magnetic wires are temporarily fixed to the wire alignment substrate by magnetic power, and then permanently fixed to the wire alignment substrate using resin while free from the torsional stresses.

First claim

What is claimed is:

1. A method of aligning a magnetic wire on a wire alignment substrate, comprising:
providing apparatus that comprises: a wire supply device comprising a wire bobbin, a wire reel, a wire tensile force loading device, and a wire holding part that holds a magnetic wire; a wire alignment device comprising a wire chuck for pulling out the magnetic wire from the wire supply device, an intermediate wire holding part that holds the magnetic wire at an intermediate position between the wire holding part and the wire chuck, a wire alignment substrate on which the magnetic wire is aligned, a substrate attaching base to which the wire alignment substrate is attached, and a cutter that cuts the magnetic wire; a misplacement detection device that detects misplacement between a reference line that is determined by a longitudinal direction of the magnetic wire pulled out to be under a proper tension and a base line that indicates a predetermined position for aligning the magnetic wire on the wire alignment substrate, wherein the substrate attaching base comprises a position adjustment device that can move horizontally and vertically and can rotate so as to adjust a position of the substrate attaching base in order to align the base line of the magnetic wire pulled out to be under the proper tension with the base line of the wire alignment substrate, and a magnetic power generation device that generates magnetic power to have the magnetic wire adhere to the wire alignment substrate at the base line;
configuring the apparatus to perform a continuous wire alignment feeding operation to control the wire supply device, the wire alignment device and the misplacement detection device so that the pulling out of the magnetic wire by the wire chuck, the alignment of the magnetic wire on the wire alignment substrate, and the cutting of the aligned magnetic wire are performed in succession;
moving the base line of the wire alignment substrate to the reference line determined by the longitudinal direction of the magnetic wire pulled out using the position adjustment device;
holding the magnetic wire which is pulled out to be under the proper tension, to avoid misplacement from the base line of the wire alignment substrate, using the wire chuck, the wire holding portion and the intermediate wire holding portion;
having the magnetic wire adhere to the wire alignment substrate using the magnetic power generated by the magnetic power generation device of the substrate attaching base during the holding of the magnetic wire;
cutting the magnetic wire while internal stresses induced in the magnetic wire are equal in the magnetic wire during the holding and the adhering of the magnetic wire; the cutting of the magnetic wire being performed at a position between the wire holding portion and the intermediate wire holding portion;
temporarily fixing, using the magnetic power generated by the magnetic power generation device, the magnetic wire to the wire alignment substrate along the base line free from torsional stresses by releasing the holding of the magnetic wire by the wire chuck, the wire holding part and the intermediate wire holding part.

2. The method of claim 1 , further comprising fixing the magnetic wire to the wire alignment substrate without the torsional stresses, by applying resin to the wire alignment substrate and curing the resin on the wire alignment substrate.

3. The method of claim 1 , wherein the intermediate wire holding part comprises, as a wire guide, a groove which the magnetic wire passes through, so that the magnetic wire is held without misplacement at a position between an edge of the wire alignment substrate on the side of the wire supply device and a position in which the magnetic wire is cut by the cutter.

4. The method of claim 1 , wherein the wire holding part comprises, as a wire guide, a groove which the magnetic wire passes through, so that the magnetic wire is held without misplacement at a position between an edge of the wire holding part on the side of the wire bobbin and a position in which the magnetic wire is cut by the cutter.

Assignees

• Aichi Steel Corp

Inventors

• Nishihata Katsuhiko

Classifications

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F41/0206

  Manufacturing of magnetic cores by mechanical means (magnetic cores per se H01F27/24) · CPC title

• H01F1/15391

  Elongated structures, e.g. wires · CPC title

• G01R33/063

  Magneto-impedance sensors; Nanocristallin sensors · CPC title

• B65H2701/36

  Wires · CPC title