Electronic device

Patent metadata

Field	Value
Publication number	US-10418165-B2
Application number	US-201615232978-A
Country	US
Kind code	B2
Filing date	Aug 10, 2016
Priority date	Feb 24, 2014
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

An electronic device includes an insulating layer, a plurality of upper wiring electrode patterns formed on an upper surface of the insulating layer, and a plurality of lower wiring electrode patterns formed on a lower surface of the insulating layer. The upper wiring electrode patterns and the lower wiring electrode patterns each include an underlying electrode layer formed of a conductive paste and a plating electrode layer formed on the underlying electrode layer. With this configuration, the resistivity of the upper and lower wiring electrode patterns and can be made lower than that of the upper and lower wiring electrode patterns and each including only the underlying electrode layer formed of a conductive paste.

First claim

The invention claimed is:

1. An electronic device comprising:
an insulating layer;
a wiring electrode pattern on the insulating layer; and
a columnar conductor disposed in the insulating layer and connected at a first end face thereof to the wiring electrode pattern,
wherein the wiring electrode pattern includes an underlying electrode layer comprising a conductive paste and a plating electrode layer on the underlying electrode layer,
wherein the underlying electrode of the wiring electrode pattern covers, with an end portion thereof, a part of the first end face of the columnar conductor, and
wherein a remaining part of the first end face not covered by the underlying electrode layer is covered by the plating electrode layer.

2. The electronic device according to claim 1 , wherein the wiring electrode pattern is linear in shape, and a width of the end portion of the underlying electrode layer covering the first end face of the columnar conductor is smaller than a width of the first end face of the columnar conductor.

3. The electronic device according to claim 2 , further comprising:
an annular coil core embedded in the insulating layer; and
a coil electrode disposed in and on the insulating layer, the coil electrode being wound around the coil core,
wherein in the coil electrode,
a plurality of metal pins, each serving as the columnar conductor, are arranged side by side on each of inner and outer sides of the coil core such that the plurality of metal pins are in pairs on the inner and outer sides, and the first end faces of metal pins in each pair on the inner and outer sides of the coil core are connected to each other by one of a plurality of wiring electrode patterns; and
a second end face of each of the metal pins on the outer side is connected by a connecting portion to a second end face of a corresponding one of the metal pins on the inner side, the corresponding one being adjacent on a predetermined side to one of the metal pins on the inner side, the one being paired with the metal pin on the outer side.

4. The electronic device according to claim 2 , further comprising:
a coil core embedded in the insulating layer; and
a coil electrode disposed in and on the insulating layer, the coil electrode being wound around the coil core,
wherein in the coil electrode,
a plurality of metal pins, each serving as the columnar conductor, are arranged side by side on each of first and second sides of the coil core such that the metal pins are in pairs on the first and second sides, and the first end faces of metal pins in each pair on the first and second sides of the coil core are connected to each other by one of a plurality of wiring electrode patterns; and
a second end face of each of the metal pins on the first side is connected by a connecting portion to a second end face of a corresponding one of the metal pins on the second side, the corresponding one being adjacent on a predetermined side to one of the metal pins on the second side, the one being paired with the metal pin on the first side.

5. The electronic device according to claim 1 , wherein the wiring electrode pattern is on a principal surface of the insulating layer;
the insulating layer has a recessed portion provided in a region of the principal surface where the wiring electrode pattern is provided; and
the wiring electrode pattern is provided to fill in the recessed portion.

6. The electronic device according to claim 3 , wherein a cross-sectional area of each of the metal pins on the outer side is greater than a cross-sectional area of each of the metal pins on the inner side.

7. The electronic device according to claim 3 , wherein a bonding wire serves as the connecting portion.

8. The electronic device according to claim 7 , wherein a plurality of bonding wires serve as the connecting portion.

9. The electronic device according to claim 1 , wherein the wiring electrode pattern is a shielding ground electrode pattern.

10. The electronic device according to claim 1 , wherein the insulating layer comprises resin.

11. The electronic device according to claim 1 , wherein the wiring electrode pattern is on a principal surface of the insulating layer;
the insulating layer has a recessed portion provided in a region of the principal surface where the wiring electrode pattern is provided; and
the wiring electrode pattern is provided to fill in the recessed portion.

12. The electronic device according to claim 2 , wherein the wiring electrode pattern is on a principal surface of the insulating layer;
the insulating layer has a recessed portion provided in a region of the principal surface where the wiring electrode pattern is provided; and
the wiring electrode pattern is provided to fill in the recessed portion.

13. The electronic device according to claim 3 , wherein the wiring electrode pattern is on a principal surface of the insulating layer;
the insulating layer has a recessed portion provided in a region of the principal surface where the wiring electrode pattern is provided; and
the wiring electrode pattern is provided to fill in the recessed portion.

14. The electronic device according to claim 4 , wherein the wiring electrode pattern is on a principal surface of the insulating layer;
the insulating layer has a recessed portion provided in a region of the principal surface where the wiring electrode pattern is provided; and
the wiring electrode pattern is provided to fill in the recessed portion.

15. The electronic device according to claim 4 , wherein a bonding wire serves as the connecting portion.

16. The electronic device according to claim 5 , wherein a bonding wire serves as the connecting portion.

17. The electronic device according to claim 6 , wherein a bonding wire serves as the connecting portion.

18. The electronic device according to claim 1 , wherein the wiring electrode pattern is a shielding ground electrode pattern.

19. The electronic device according to claim 1 , wherein the insulating layer comprises resin.

Assignees

• Murata Manufacturing Co

Inventors

• Banba Shinichiro
• Mizushiro Masaaki

Classifications

• H05K2203/049

  Wire bonding · CPC title

• H05K2201/10363

  Jumpers, i.e. non-printed cross-over connections · CPC title

• H05K2201/086

  for inductive purposes, e.g. printed inductor with ferrite core · CPC title

• H05K2201/0347

  Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias · CPC title

• H05K3/246

  Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating · CPC title