Imprinting method and imprinting apparatus, sample shot extraction method, and article manufacturing method using same

Patent metadata

Field	Value
Publication number	US-10416552-B2
Application number	US-201715481540-A
Country	US
Kind code	B2
Filing date	Apr 7, 2017
Priority date	Jun 17, 2010
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

An imprinting method is capable of strictly interpolating application distribution of uncured resin material being applied to a substrate for each shot and interpolating application distribution of uncured resin material for each shot while reducing workload in a generation step. The imprinting apparatus includes a mold; a mold driving unit; a dispenser that applies uncured resin material to the substrate; a light source that cures uncured resin material as a pattern; a dispenser control unit that controls the dispenser by generating the application distribution of the uncured resin material to the resin pattern for each of a plurality of shots; and a main control unit that interpolates application distribution of uncured resin material, which has been generated by the dispenser control unit, using shot layout information of relative position among positions of a plurality of shots, the dispenser, and the light source with respect to the substrate, as variables.

First claim

What is claimed is:

1. A generating device that is available to an imprinting apparatus for forming a resin pattern on each of a plurality of shots arranged on a substrate using a mold and generates an application distribution of an uncured resin for a target shot of the plurality of shots, the device comprising:
a giving unit configured to give a feature corresponding to a volatility of the uncured resin to each of a plurality of regions into which each of the plurality of shots is divided, based on layout information of the plurality of shots;
an extracting unit configured to extract a combination of sample shots out of the plurality of shots, such that the combination of sample shots includes all of the given features given by the giving unit to the target shot and each of the combination of sample shots is different from the target shot of the plurality of the shots; and
a generating unit configured to generate first information about the application distribution of the uncured resin on each of the extracted plurality of sample shots extracted by the extracting unit, and then generate second information about application distribution of the uncured resin on the target shot based on the generated first information.

2. The device according to claim 1 , wherein the giving unit gives the feature based on the layout information and information about a flow rate of gas to be dissolved into the uncured resin.

3. The device according to claim 1 , wherein the plurality of shots are all of shots on the substrate.

4. The device according to claim 1 , wherein the extracting unit extracts the combination of sample shots such that a number of sample shots is minimized.

5. The device according to claim 1 , wherein the extracting unit extracts the combination of sample shots such that the combination of sample shots includes all features given to the plurality of shots by the giving unit.

6. The device according to claim 1 , wherein the giving unit gives the feature to each of a plurality of regions into which each of the plurality of shots is divided, further based on flow rate of helium gas to be dissolved into the uncured resin.

7. The device according to claim 1 , wherein the extracting unit extracts the combination of sample shots which includes first sample shot and second sample shot, wherein the first sample shot includes a feature which is not given to the second sample shot, and the second sample shot includes a feature which is not given to the first sample shot.

Assignees

• Canon Kk

Inventors

• Aihara Sentaro

Classifications

• B05D3/12

  by mechanical means · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title

• B82Y10/00

  Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

• B05D7/26

  synthetic lacquers or varnishes (B05D7/08, B05D7/16 take precedence) · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title