Low application temperature hot melt adhesive composition

US10414957B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10414957-B2
Application numberUS-201615071959-A
CountryUS
Kind codeB2
Filing dateMar 16, 2016
Priority dateMar 16, 2015
Publication dateSep 17, 2019
Grant dateSep 17, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This invention claims low application temperature hot melt adhesive compositions including at least about 15% by weight of a first styrene block copolymer with a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 10% by weight.

First claim

Opening claim text (preview).

What is claimed is: 1. A hot melt adhesive composition comprising: a first styrene block copolymer having an unsaturated midblock, a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 10% by weight, the hot melt adhesive composition having a viscosity of no greater than about 15,000 cps at 121° C. 2. The hot melt adhesive composition of claim 1 wherein the hot melt adhesive composition has a viscosity of no greater than about 7,500 cps at 121° C. 3. The hot melt adhesive composition of claim 1 wherein the first styrene block copolymer is the only styrene block copolymer present in the hot melt adhesive. 4. The hot melt adhesive composition of claim 1 wherein the first styrene block copolymer has a diblock content of no greater than about 5% by weight. 5. The hot melt adhesive composition of claim 1 wherein the first styrene block copolymer has a melt flow rate of from about 15 g/10 minutes (190° C. 2.16 kgs) to about 200 g/10 minutes (190° C., 2.16 kgs). 6. The hot melt adhesive of claim 1 further comprising a tackifying agent. 7. The hot melt adhesive of claim 6 further comprising a plasticizer. 8. The hot melt adhesive of claim 7 wherein the first styrene block copolymer, the tackifying agent and the plasticizer comprise at least about 80% by weight of the adhesive. 9. The hot melt adhesive composition of claim 7 wherein the hot melt adhesive is a pressure sensitive adhesive. 10. An adhesive tape or label comprising the hot melt adhesive of claim 7 . 11. The hot melt adhesive composition of claim 1 wherein the first styrene block copolymer has a tri-block configuration. 12. The hot melt adhesive composition of claim 1 wherein the Peel Force to Cotton is at least about 50 grams force (coat weight=25 gsm) when the adhesive is applied at 121° C. 13. The hot melt adhesive composition of claim 1 wherein the Spiral Spray T-Peel is at least about 50 grams force (coat weight=6.2 gsm) when the adhesive is applied at 121° C. 14. A disposable absorbent article comprising the hot melt adhesive of claim 1 . 15. The disposable absorbent article of claim 14 selected from the group consisting of diaper, adult incontinence article, and sanitary hygiene article. 16. A hot melt adhesive composition comprising: a.) at least about 15% by weight of a first styrene block copolymer with a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs), a diblock content of no greater than about 10% by weight, and a styrene content of from about 25% by weight to about 35% by weight, b.) a tackifying agent, and c.) a plasticizer, the hot melt adhesive composition having a viscosity of no greater than about 15,000 cps at 121° C. 17. The hot melt adhesive composition of claim 16 where the sum of a.), b.) and c.) is at least 90% of the composition. 18. A disposable absorbent article comprising: a topsheet; a backsheet; an absorbent core disposed between the topsheet and the backsheet; a garment-facing surface; and the hot melt adhesive composition of claim 16 disposed on the garment-facing surface of the absorbent article. 19. A disposable absorbent article comprising: a first substrate and a second substrate; and a hot melt adhesive composition applied to at least one of the first or second substrates, said hot melt adhesive composition comprising: a first styrene block copolymer, having an unsaturated midblock, a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 3% by weight, a tackifying agent, and a plasticizer, the hot melt adhesive composition having a viscosity of no greater than about 7,500 cps at 121° C. 20. The disposable absorbent article of claim 19 wherein the hot melt adhesive composition is used in the disposable article for an application selected from the group consisting of construction, back sheet lamination and positioning.

Assignees

Inventors

Classifications

  • Block-copolymers · CPC title

  • Diapers or napkins · CPC title

  • of paper or cardboard · CPC title

  • Thermoplastic elastomer material · CPC title

  • Resin or rubber layer containing a blend of at least two different polymers · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10414957B2 cover?
This invention claims low application temperature hot melt adhesive compositions including at least about 15% by weight of a first styrene block copolymer with a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 10% by weight.
Who is the assignee on this patent?
Fuller H B Co
What technology area does this patent fall under?
Primary CPC classification C09J153/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).