Halogen-free and phosphorus-free silicone resin composition, prepreg, laminate board, copper-clad plate using the same, and printed circuit board

Patent metadata

Field	Value
Publication number	US-10414136-B2
Application number	US-201515539291-A
Country	US
Kind code	B2
Filing date	Jul 6, 2015
Priority date	Dec 26, 2014
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

First claim

The invention claimed is:

1. A silicone resin composition, wherein in parts by weight of the solids, the silicone resin composition comprises:
50-90 parts by weight of an organic silicone resin;
20-80 parts by weight of a vinyl-terminated silicone oil;
0.0001-0.5 part by weight of a platinum catalyst; and
0.00001-0.1 part by weight of an inhibitor; and
0.1-5 parts of a tackifier;

wherein the catalyst has a viscosity of 100-10,000 mPa·s, and
wherein the tackifier is an organic compound containing any one or a combination of at least two of —OCH 3 , —OCH 2 CH 3 ,

or —CH═CH 2 .

2. The silicone resin composition according to claim 1 , wherein the organic silicone resin comprises at least one member selected from the group consisting of a methyl vinyl silicone resin and a methylphenylvinyl silicone resin, and
wherein the mass fraction of the vinyl in the organic silicone resin is 0.5-8.0%.

3. The silicone resin composition according to claim 1 , wherein the silicone resin composition further comprises a crosslinking agent, and
wherein the crosslinking agent comprises at least one member selected from the group consisting of methyl hydrogen silicone oil, methylphenyl hydrogen silicone oil, methyl hydrogen silicone resin and methylphenyl hydrogen silicone resin.

4. The silicone resin composition according to claim 3 , wherein the molar ratio of Si—H in the crosslinking agent to the Si-Vi in the organic silicone resin composition is 1.0-1.7.

5. The silicone resin composition according to claim 3 , wherein the mass fraction of the hydrogen contained in the crosslinking agent is 0.5-1.6%.

6. The silicone resin composition according to claim 5 , wherein, the vinyl-terminated silicone oil comprises at least one member selected from the group consisting of a methyl vinyl-terminated silicone oil and a methylphenyl vinyl-terminated silicone oil having a viscosity of 200-10,000 mPa·s.

7. The silicone resin composition according to claim 1 , wherein the silicone resin composition contains 5 parts of the tackifier.

8. The silicone resin composition according to claim 1 , wherein, the tackifier is —OCH 3 .

9. The silicone resin composition according to claim 1 , wherein the silicone resin composition further comprises 0-60 parts of a filler.

10. The silicone resin composition according to claim 9 , wherein, the filler comprises at least one member selected from the group consisting of alumina, aluminum hydroxide, silica, zinc oxide, mica powder, aluminum nitride, boron nitride, silicon carbide, barium sulfate, titanium dioxide, zinc borate, fumed silica, talc powder, magnesium hydroxide and boehmite.

11. The silicone resin composition according to claim 9 , wherein the filler has a particle size of 10 μm or less.

12. The silicone resin composition according to claim 1 , wherein the catalyst is a platinum-methyl vinyl complex and/or a platinum-methylphenylvinyl complex.

13. The silicone resin composition according to claim 1 , wherein the inhibitor comprises at least one member selected from the group consisting of an alkynyl-containing compound, a polyvinyl group-containing compound, a N-containing organic compound, a P-containing organic compound and an S-containing organic compound.

14. The silicone resin composition according to claim 1 , wherein the silicone resin composition comprises by weight fraction of:
50-90 parts of the organic silicone resin;
20-80 parts of the vinyl-terminated silicone oil;
0.1-5 parts of a tackifier;
0-60 parts of a filler;
0.0001-0.5 part of the platinum catalyst; and
0.00001-0.1 part of the inhibitor;

wherein the crosslinking agent of the organic silicone resin at least one member selected from the group consisting of methyl hydrogen silicone oil, methylphenyl hydrogen silicone oil, methyl hydrogen silicone resin or methylphenyl hydrogen silicone resin; and
wherein the molar ratio of Si—H in the crosslinking agent to the Si-Vi in the organic silicone resin is 1.0-1.7; and
wherein the catalyst has a viscosity of 100-10,000 mPa·s.

15. A resin glue solution, wherein it is obtained by dissolving or dispersing the silicone resin composition according to claim 1 in a solvent.

16. A prepreg comprising a reinforcing material and the silicone resin composition according to claim 1 attached to the reinforcing material after impregnation and drying.

17. A laminate, wherein the laminate comprises at least one prepreg according to claim 16 .

18. A copper-clad laminate, wherein the copper-clad laminate comprises at least one laminated prepreg according to claim 16 and a copper foil pressed on one side or both sides of the laminated prepreg.

19. A printed circuit board, wherein the printed circuit board comprises at least one prepreg according to claim 16 .

Assignees

• Shengyi Technology Co Ltd

Inventors

• Su Xiaosheng
• Ye Suwen
• Tang Guofang

Classifications

• H05K1/03

  Use of materials for the substrate · CPC title

• B32B15/08

  of synthetic resin · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2307/546

  Flexural strength; Flexion stiffness · CPC title

• B32B2307/204

  Di-electric · CPC title