Cover plate, method for manufacturing cover plate and electronic device

Patent metadata

Field	Value
Publication number	US-10414103-B2
Application number	US-201715667897-A
Country	US
Kind code	B2
Filing date	Aug 3, 2017
Priority date	Aug 8, 2016
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

A cover plate, a method of manufacturing the cover plate, and an electronic device having the cover plate are provided. The cover plate includes a substrate, at least one slot defined in the substrate and penetrating through the substrate, and a filling layer received in the slot including an insulating layer and a gel layer located on the insulating layer.

First claim

What is claimed is:

1. A cover plate for covering an antenna of an electronic device, comprising:
a substrate;
at least one slot, defined in the substrate and penetrating through the substrate in a thickness direction of the substrate; and
a filling layer, received in the at least one slot, comprising an insulating layer and a layer with gel cured, the layer with the gel cured being disposed on the insulating layer, and the layer with the gel cured having a larger width than the insulating layer.

2. The cover plate of claim 1 , wherein the layer with the gel cured comprises at least one selected from the group consisting of silver powder and pigment.

3. The cover plate of claim 2 , wherein the layer with the gel cured comprises 5-20% silver powder by weight.

4. The cover plate of claim 3 , wherein the layer with the gel cured comprises 15% silver powder by weight.

5. The cover plate of claim 2 , wherein the layer with the gel cured comprises 0.2% yellow pigment by weight and 0.1% red pigment by weight.

6. The cover plate of claim 1 , wherein the width of the layer with the gel cured is 0.02-0.06 mm larger than that of the insulating layer.

7. The cover plate of claim 1 , wherein the layer with the gel cured has a thickness of 0.4-0.8 mm.

8. A method for manufacturing a cover plate for covering an antenna of an electronic device, comprising:
forming at least one slot in a substrate and filling the at least one slot with an insulating material, wherein the at least one slot penetrates through the substrate in a thickness direction of the substrate;
forming an insulating layer in the at least one slot by removing a part of the insulating material and forming a groove on the insulating layer, wherein the groove is adjacent to an outer surface of the substrate;
filling the groove with gel; and
curing the gel so as to form a layer with the gel cured, the layer with the gel cured having a larger width than the insulating layer.

9. The method of claim 8 , wherein the forming the insulating layer in the at least one slot by removing the part of the insulating material and forming the groove on the insulating layer comprises:
removing a part of the insulating material adjacent to the outer surface of the substrate and a part of the substrate adjacent to the part of the insulating material such that the remaining insulating material forms the insulating layer and the groove has a width larger than the insulating layer.

10. The method of claim 8 , wherein the gel comprises at least one selected from the group consisting of silver powder and pigment.

11. The method of claim 10 , wherein the gel comprises 5-20% silver powder by weight.

12. The method of claim 11 , wherein the gel comprises 15% silver powder by weight.

13. The method of claim 10 , wherein the gel comprises 0.2% yellow pigment by weight and 0.1% red pigment by weight.

14. The method of claim 8 , wherein the gel has an initial viscosity of 3000-10000 mPa·s.

15. The method of claim 14 , wherein the initial viscosity of the gel comprises 7000 mPa·s.

16. The method of claim 8 , further comprising:
horizontally cutting an outer surface of the cover plate.

17. The method of claim 8 , wherein the substrate is made of metal, and the method further comprises forming an anodized layer on the outer surface of the substrate.

18. An electronic device, comprising a cover plate and an antenna covered by the cover plate, wherein the cover plate comprises:
a substrate;
at least one slot, defined in the substrate, penetrating through the substrate in a thickness direction of the substrate, and aligned with the antenna; and
a filling layer, received in the at least one slot, comprising an insulating layer and a layer with gel cured, the layer with the gel cured being disposed on the insulating layer, and the layer with the gel cured having a larger width than the insulating layer.

19. The cover plate of claim 1 , further comprising an anodized layer disposed on the substrate, wherein the anodized layer is adjacent to and aligned with the layer with the gel cured.

20. The electronic device of claim 18 , wherein the cover plate further comprises an anodized layer disposed on the substrate, wherein the anodized layer is adjacent to and aligned with the layer with the gel cured.

Assignees

• Guangdong Oppo Mobile Telecommunications Corp Ltd

Inventors

• Li Jing
• Yang Guangming
• Gong Qingguo

Classifications

• B29L2031/3481

  Housings or casings incorporating or embedding electric or electronic elements · CPC title

• B29L2031/3456

  Antennas, e.g. radomes · CPC title

• B29C70/74 Primary

  Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding {(B29C70/845 takes precedence)} · CPC title

• B29C39/10

  incorporating preformed parts or layers, e.g. casting around inserts or for coating articles {(coating a surface by casting in general B05D1/30, B29C39/126 takes precedence)} · CPC title

• H04M1/185

  Improving the shock resistance of the housing, e.g. by increasing the rigidity · CPC title