Method for bonding composite materials and device for bonding composite materials

Patent metadata

Field	Value
Publication number	US-10414100-B2
Application number	US-201415322483-A
Country	US
Kind code	B2
Filing date	Jul 3, 2014
Priority date	Jul 3, 2014
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

A method is used for a pair of bonding composite materials that are each provided with a melting material and a heat-resistant material. Each heat-resistant material includes a heat-resistant member and a binder member. The ceramic separators have ceramic layers that face each other and that are bonded. An ultrasonic wave is applied to the composite materials while applying a pressure thereto with a processing member. Also heat is applied to the binder members with a heating member. Here, the heater heats the binder members to a temperature that is greater than or equal to the glass transition temperature of the binder members and less than the melting point of the binder members.

First claim

The invention claimed is:

1. A bonding method for bonding a pair of composite materials that are each provided with a melting material and a heat-resistant material, in which each of the heat-resistant materials includes a heat-resistant member having a higher melting temperature than the melting material and a binder member that binds the heat-resistant member to the melting material, with the heat-resistant materials facing each other, the bonding method comprising:
bonding the composite materials by applying an ultrasonic wave to the composite materials while applying pressure thereto with a processing member; and
applying heat to the binder members with a heating member to thereby move the heat-resistant members from a bonding portion to a surrounding area to bond the melting materials that are opposed to each other,
the applying of the heat to the binder members with the heating member to a temperature that is greater than or equal to a glass transition temperature of the binder members and less than melting point of the binder members.

2. The bonding method according to claim 1 , wherein
the applying of the heat to the binder members with the heating member being applied while the applying of the ultrasonic wave to the composite materials with the processing member.

3. The bonding method according to claim 1 , wherein
the applying of the heat to the binder members with the heating member being applied before the applying of the ultrasonic wave to the composite materials with the processing member.

4. The bonding method according to claim 1 , wherein
the applying of the ultrasonic wave being applied along a bonding surface between the heat-resistant members with the processing member.

5. The bonding method according to claim 1 , wherein
the temperature at which the binder members are heated with the heating member is less than the melting point of the melting material.

6. The bonding method according to claim 2 , wherein
the applying of the heat to the binder members with the heating member being applied before the applying of the ultrasonic wave to the composite materials with the processing member.

7. The bonding method according to claim 2 , wherein
the applying of the ultrasonic wave being applied along a bonding surface between the heat-resistant members with the processing member.

8. The bonding method according to claim 2 , wherein
the temperature at which the binder members are heated with the heating member is less than the melting point of the melting material.

9. The bonding method according to claim 3 , wherein
the applying of the ultrasonic wave being applied along a bonding surface between the heat-resistant members with the processing member.

10. The bonding method according to claim 3 , wherein
the temperature at which the binder members are heated with the heating member is less than the melting point of the melting material.

Assignees

• Nissan Motor

Inventors

• Nakano Takahiro
• Oorui Toshiaki
• Fujisawa Shinji

Classifications

• B29C66/961

  involving a feedback loop mechanism, e.g. comparison with a desired value · CPC title

• B29C66/91943

  higher than said glass transition temperature · CPC title

• B29C66/91935

  lower than said fusion temperature · CPC title

• B29C66/91421

  of the joining tools · CPC title

• B29C66/91411

  of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account · CPC title