Hall sensor mounting in an implantable blood pump

Patent metadata

Field	Value
Publication number	US-10413650-B2
Application number	US-201615286449-A
Country	US
Kind code	B2
Filing date	Oct 5, 2016
Priority date	Aug 31, 2012
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.

First claim

What is claimed is:

1. A sensor mount assembly for insertion into a blood pump assembly, the sensor mount assembly comprising:
a printed circuit board having rigid and flexible portions, wherein the printed circuit board comprises a flexible ring-shaped outer portion with one or more extension portions projecting inwardly from the outer portion;
sensors having rigid material attached thereto; and
a rigid carrier for supporting the printed circuit board and the sensors, the carrier having rigid guide rails configured to locate the rigid material attached to the sensors.

2. The sensor mount assembly of claim 1 , wherein the rigid guide rails comprise slots that receive the rigid material attached to the sensors.

3. The sensor mount assembly of claim 2 , wherein the rigid portion of the printed circuit board comprises a breakaway tab configured to be detached from the printed circuit board after the rigid material is received in the slots of the rigid guide rails.

4. The sensor mount assembly of claim 3 , wherein the rigid portion of the printed circuit board comprises scoring marks that allow the breakaway tab to be detached from the printed circuit board.

5. The sensor mount assembly of claim 2 , wherein the sensors are arranged axi-symmetrically on the carrier when the rigid material attached to each of the sensors is received in the slots of the rigid guide rails.

6. The sensor mount assembly of claim 1 , wherein the rigid material attached to the sensors is attached to top edges of the sensors.

7. The sensor mount assembly of claim 1 , wherein the rigid material attached to the sensors comprises electrically neutral material.

8. The sensor mount assembly of claim 7 , wherein the electrically neutral material is masked with a static dissipative coating.

9. The sensor mount assembly of claim 1 , wherein the rigid material attached to each of the sensors is connected to a respective extension portion of the printed circuit board.

10. The sensor mount assembly of claim 1 , wherein the sensor mount assembly is configured to be inserted into an implantable blood pump assembly.

11. The sensor mount assembly of claim 10 , wherein the sensors are configured to transduce a position of a rotor of the implantable blood pump.

12. The sensor mount assembly of claim 1 , wherein the sensors are Hall sensors.

13. The sensor mount assembly of claim 1 , wherein the rigid material attached to each of one or more of the sensors extends transversely across at least two of the rigid guide rails.

14. The sensor mount assembly of claim 1 , wherein the rigid portion of the printed circuit board comprises a portion at an end of each of one or more of the extension portions that is configured to receive one of the sensors.

Assignees

• Tc1 Llc

Inventors

• Schimpf Samuel
• Mcchrystal Mark
• Stark Iii Joseph C
• Siebenhaar Andre

Classifications

• A61M2205/3334

  Measuring or controlling the flow rate · CPC title

• H05K1/119 Primary

  Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence) · CPC title

• G01B7/30

  for measuring angles or tapers; for testing the alignment of axes · CPC title

• H05K2201/052

  Branched · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title