Camera device

Patent metadata

Field	Value
Publication number	US-10412282-B2
Application number	US-201715448236-A
Country	US
Kind code	B2
Filing date	Mar 2, 2017
Priority date	Mar 3, 2016
Publication date	Sep 10, 2019
Grant date	Sep 10, 2019

Abstract

A camera device which includes a holder which retains an optical member therein and a circuit board on which an image sensor is mounted. The holder is joined to the circuit board using an adhesive agent. The circuit board at least partially includes a metallic layer and a resinous layer stacked in a thickness-wise direction of the circuit board. The circuit board has a metallic layer-absent portion in which the metallic layer is partially omitted. The metallic layer-absent portion is located so as to overlap the joint between the holder and the circuit board in the thickness-wise direction of the circuit board, thereby minimizing the transfer of heat of the adhesive agent to the metallic layer. This achieves effective hardening the adhesive agent, which will facilitate the ease with which the camera device is assembled.

First claim

What is claimed is:

1. A camera device comprising:
a circuit board which at least partially comprises a resinous layer and a metallic layer stacked in a thickness-wise direction thereof;
an image sensor which is disposed on the circuit board;
an optical member which works to direct light to said image sensor;
a holder which holds said optical member; and
a thermosetting adhesive agent which achieves a joint between said holder and said circuit board,
wherein said circuit board comprises a metallic layer-absent portion in which the metallic layer is partially omitted, the metallic layer-absent portion being located to overlap the joint in the thickness-wise direction of the circuit board,
wherein the metallic layer-absent portion is located in a region between opposing surfaces of the circuit board.

2. A camera device as set forth in claim 1 , wherein said circuit board at least partially includes the resinous layer and a plurality of metallic layers stacked in the thickness-wise direction thereof, the resinous layer being disposed between two of the metallic layers, and wherein the metallic layer-absent portion is made by partially omitting one of the metallic layers which is located closest to the joint between the holder and the circuit board.

3. A camera device as set forth in claim 1 , wherein said circuit board at least partially includes the resinous layer and a plurality of metallic layers stacked in the thickness-wise direction thereof, the resinous layer being disposed between two of the metallic layers, and wherein the metallic layer-absent portion is made by omitting a portion of each of the metallic layers which overlaps the joint between the holder and the circuit aboard in the thickness-wise direction.

4. A camera device as set forth in claim 1 , wherein the metallic layer is made of copper foil.

5. A camera device as set forth in claim 1 , wherein the thermosetting adhesive agent is an epoxy adhesive.

6. A camera device as set forth in claim 1 , wherein the metallic layer-absent portion lies in a region of the circuit board defined around a line aligned with the joint and the circuit board in the thickness-wise direction, the line extending in a direction substantially perpendicular to a surface of the circuit, wherein the metallic layer is located outside the region in a direction perpendicular to the thickness-wise direction of the circuit board.

7. A camera device as set forth in claim 1 , wherein the metallic layer is located at a predetermined distance from the joint in a direction perpendicular to the thickness-wise direction of the circuit board.

8. A camera device comprising:
a circuit board which at least partially comprises a resinous layer and a metallic layer stacked in a thickness-wise direction thereof;
an image sensor which is disposed on the circuit board;
an optical member which works to direct light to said image sensor;
a holder which holds said optical member; and
a thermosetting adhesive agent which achieves a joint between said holder and said circuit board,
wherein said circuit board comprises a metallic layer-absent portion in which the metallic layer is partially omitted, the metallic layer-absent portion being located to overlap the joint in the thickness-wise direction of the circuit board,
wherein the metallic layer-absent portion connects resinous layers in the thickness-wise direction.

9. A camera device comprising:
a circuit board which at least partially comprises a resinous layer and a metallic layer stacked in a thickness-wise direction thereof;
an image sensor which is disposed on the circuit board;
an optical member which works to direct light to said image sensor;
a holder which holds said optical member; and
a thermosetting adhesive agent which achieves a joint between said holder and said circuit board,
wherein said circuit board comprises a metallic layer-absent portion in which the metallic layer is partially omitted, the metallic layer-absent portion being located to overlap the joint in the thickness-wise direction of the circuit board,
wherein a thickness of the resinous layer increases in the thickness-wise direction within the metallic layer-absent portion.

10. A camera device comprising:
a circuit board which at least partially comprises a resinous layer and a metallic layer stacked in a thickness-wise direction thereof;
an image sensor which is disposed on the circuit board;
an optical member which works to direct light to said image sensor;
a holder which holds said optical member; and
a thermosetting adhesive agent which achieves a joint between said holder and said circuit board,
wherein said circuit board comprises a metallic layer-absent portion in which the metallic layer is partially omitted, the metallic layer-absent portion being located to overlap the joint in the thickness-wise direction of the circuit board,
wherein the metallic layer-absent portion comprises a portion of the circuit board in which at least a portion of the metallic layer is omitted from the metallic layer so as to not overlap the joint in the thickness-wise direction.

Assignees

• Denso Corp

Inventors

• Masui Soji
• Furutake Yasuki
• Takama Daisuke
• Yamaguchi Kazuma
• Aoki Takashi

Classifications

• H05K2201/2018

  Presence of a frame in a printed circuit or printed circuit assembly · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title