Hybrid electrical connector

Patent metadata

Field	Value
Publication number	US-10411392-B2
Application number	US-201816009430-A
Country	US
Kind code	B2
Filing date	Jun 15, 2018
Priority date	Feb 20, 2017
Publication date	Sep 10, 2019
Grant date	Sep 10, 2019

Abstract

A hybrid electrical connector includes a housing having a central opening, a carrier plate supported by the housing within the central opening, and electrically conductive pins supported within the housing by the carrier plate. The housing is formed of a first plastic material, and the carrier plate is formed of a second plastic material having properties that make it more dimensionally stable than the first plastic material. In addition, a sealing layer is applied to one surface of the carrier plate, the sealing layer formed of a third plastic material and serving to secure the carrier plate to the housing and to secure the pins within the carrier plate. A method of forming the electrical connector is also described.

First claim

What is claimed is:

1. A method of fabricating an electrical connector comprising
providing electrically conductive pins arranged in an array in which each pin is spaced apart from and parallel to adjacent pins of the array;
performing a first overmolding procedure on the pins in which a carrier plate is provided, the carrier plate formed of a first plastic material that supports the pins in the arrayed configuration;
performing a second overmolding procedure on the carrier plate in which a housing is provided, the housing formed of a second plastic material and surrounding a periphery of the carrier plate in such a way that an outer periphery of the carrier plate engages an inner periphery of the housing; and
following the second overmolding procedure, applying a sealing layer formed of a third plastic material to one side of the carrier plate in such a way as to seal the pins to the carrier plate and seal the carrier plate to the housing.

2. The method of claim 1 wherein the first overmolding procedure is performed in a first apparatus, the second overmolding procedure is performed in a second apparatus, and the carrier plate is transferred between the first apparatus and the second apparatus following the first overmolding procedure, whereby cooling of the carrier plate occurs between the first overmolding procedure and the second overmolding procedure.

3. The method of claim 1 wherein the first over folding procedure and the second overmolding procedure are performed in a first apparatus, and the carrier plate is remains in the first apparatus for both the first overmolding procedure and the second overmolding procedure, and the second overmolding procedure is performed immediately following the first overmolding procedure, whereby a portion of a first material used in the first overmolding procedure forms a chemical bond with a portion of a second material used in the second overmolding procedure.

4. The method of claim 1 wherein the array of pins is provided prior to the step of performing a first overmolding procedure on the pins whereby the carrier plate is formed with the array of pins in place.

5. The method of claim 1 wherein the array of pins is provided following the step of performing a second overmolding procedure on the carrier plate in which a housing is provided, and the pins are inserted into preexisting openings in the carrier plate.

6. A method of fabricating an electrical connector comprising
providing electrically conductive pins arranged in an array in which each pin is spaced apart from and parallel to adjacent pins of the array;
performing a first overmolding procedure on the pins in which a carrier plate is provided, the carrier plate formed of a first plastic material that supports the pins in the arrayed configuration;
performing a second overmolding procedure on the carrier plate in which a housing is provided, the housing formed of a second plastic material and surrounding a periphery of the carrier plate in such a way that, an outer periphery of the carrier plate engages an inner periphery of the housing; and
following the second overmolding procedure, applying a sealing layer formed of a third plastic material to one side of the carrier plate in such a way as to seal the pins to the carrier plate and seal the carrier plate to the housing,

wherein
the first overmolding procedure is performed in a first apparatus, the second overmolding procedure is performed in a second apparatus, and the carrier plate is transferred between the first apparatus and the second apparatus following the first overmolding procedure, whereby cooling of the carrier plate occurs between the first overmolding procedure and the second overmolding procedure.

7. A method of fabricating an electrical connector comprising
providing electrically conductive pins arranged in an array in which each pin is spaced apart from and parallel to adjacent pins of the array;
performing a first overmolding procedure on the pins in which a carrier plate is provided, the carrier plate formed of a first plastic material that supports the pins in the arrayed configuration;
performing a second overmolding procedure on the carrier plate in which a housing is provided, the housing formed of a second plastic material and surrounding a periphery of the carrier plate in such a way that an outer periphery of the carrier plate engages an inner periphery of the housing; and
following the second overmolding procedure, applying a sealing layer formed of a third plastic material to one side of the carrier plate in such a way as to seal the pins to the carrier plate and seal the carrier plate to the housing,

wherein
the first overmolding procedure and the second overmolding procedure are performed in a first apparatus, and the carrier plate is remains in the first apparatus for both the first overmolding procedure and the second overmolding procedure, and the second overmolding procedure is performed immediately following the first overmolding procedure, whereby a portion of a first material used in the first overmolding procedure forms a chemical bond with a portion of a second material used in the second overmolding procedure.

Assignees

• Robert Bosch Llc
• Bosch Gmbh Robert

Inventors

• Manushi Ligor
• Reyes Mario
• Avalos Hiram
• Ryskamp Mark
• Mcinnis Allison
• Oberender Jens
• Schoenfeld Michael
• Moore Alexander
• Keller Robert

Classifications

• H01R13/5219

  Sealing means between coupling parts, e.g. interfacial seal · CPC title

• H01R13/5202

  Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings · CPC title

• H01R43/24

  Assembling by moulding on contact members · CPC title

• H01R13/405

  Securing in non-demountable manner, e.g. moulding, riveting · CPC title

• H01R43/18

  for manufacturing bases or cases for contact members · CPC title