Heat spreaders for use with semiconductor devices

Patent metadata

Field	Value
Publication number	US-10410950-B1
Application number	US-201815977760-A
Country	US
Kind code	B1
Filing date	May 11, 2018
Priority date	May 11, 2018
Publication date	Sep 10, 2019
Grant date	Sep 10, 2019

Abstract

Memory devices having heat spreaders are disclosed herein. In one embodiment, a memory device includes first memories coupled to a front side of a substrate, second memories coupled to a back side of the substrate, and a flexible heat spreader. The flexible heat spreader can include graphite and is coupled to back side surfaces of the first and second memories to dissipate heat generated by the first and second memories.

First claim

I claim:

1. A heat spreader for use with a dual in-line memory module (DIMM), the heat spreader comprising:
a graphite member; and
a plastic covering enveloping the graphite member,
wherein the heat spreader is configured to be coupled to at least one of
a plurality of first memories electrically coupled to and arranged in one or more rows at a front side of a substrate of the DIMM, and
a plurality of second memories electrically coupled to and arranged in one or more rows at a back side of the substrate of the DIMM, and

wherein the graphite member includes
a first opening configured to be generally positioned over a first circuit component attached to the front side of the substrate of the DIMM, wherein the first opening is configured to inhibit a thermal path through the graphite member between the first circuit component and the first memories, and
a second opening configured to be generally positioned over a second circuit component attached to the front side of the substrate of the DIMM, wherein the second opening is configured to inhibit a thermal path through the graphite member between the second circuit component and the first memories.

2. The heat spreader of claim 1 , wherein the first circuit component is a power management integrated circuit (PMIC).

3. The heat spreader of claim 1 , wherein the second circuit component is a registering clock driver (RCD).

4. The heat spreader of claim 1 , wherein:
the first circuit component is a PMIC,
the second circuit component is a RCD,
the first opening has a first cross-sectional dimension, and
the second opening has a second cross-sectional dimension, less than the first cross-sectional dimension.

5. The heat spreader of claim 1 wherein the plastic covering includes a thermoplastic material.

6. The heat spreader of claim 5 wherein the thermoplastic material is polyethylene terephthalate.

7. The heat spreader of claim 1 , wherein the first circuit component is a voltage regulator.

8. The heat spreader of claim 1 wherein the first opening has a generally rectangular shape having a length of about 15 mm and a width of about 10 mm.

9. The heat spreader of claim 1 wherein the heat spreader is flexible, and wherein the heat spreader is configured to be attached to both the first and second memories such that it curves around an edge of the substrate.

10. The heat spreader of claim 9 wherein the heat spreader has a first length along a first edge of between about 120-130 mm, and a second length along a second edge of between about 45-55 mm, wherein the first edge is generally perpendicular to the second edge.

11. The heat spreader of claim 1 wherein
the graphite member is of a first heat spreader portion,
the first heat spreader portion is configured to be attached to substantially an entire back side of each of the first memories,
the heat spreader further comprises a graphite member of a second heat spreader portion, and
the second heat spreader portion is configured to be attached to substantially an entire back side of each of the second memories.

12. The heat spreader of claim 11 wherein the first and second heat spreader portions each have a rectangular shape with a length of between about 120-130 mm and a width of between about 20-30 mm.

Assignees

• Micron Technology Inc

Inventors

• Pax George E

Classifications

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W42/271

  the arrangements being between stacked chips · CPC title