Method and system to passively align and attach fiber array to laser array or optical waveguide array

Patent metadata

Field	Value
Publication number	US-10409004-B2
Application number	US-201716316683-A
Country	US
Kind code	B2
Filing date	Jul 19, 2017
Priority date	Jul 21, 2016
Publication date	Sep 10, 2019
Grant date	Sep 10, 2019

Abstract

Disclosed is a method and system for passively aligning optical fibers ( 4 ), a first waveguide array ( 62 ), and a second waveguide array ( 42 ) using chip-to-chip vertical evanescent optical waveguides ( 44 ) and ( 64 ), that can be used with fully automated die bonding equipment. The assembled system ( 2, 30, 60 ) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.

First claim

The invention claimed is:

1. A system comprising:
a first substrate having first and second ends, the first substrate including an optical fiber in a groove;
a second substrate having first and second ends, the second substrate including a first waveguide having first and second ends, wherein the first end of the second substrate is positioned proximate to the first end of first substrate; and
a third substrate having first and second ends, the third substrate including a second waveguide having first and second ends, wherein:
the second and third substrates are arranged with the first ends of the first and second waveguides overlapping in spaced parallel or substantially parallel relation; and
the first and second substrates are arranged with the second end of the second waveguide in optical alignment with an end face of the optical fiber.

2. The system of claim 1 , wherein:
the first waveguide proximate the first end thereof tapers to a point; and
the second waveguide proximate the first end thereof tapers to a point.

3. The system of claim 1 , wherein the first ends of the first and second waveguides overlap by 300 micrometers±30 micrometers.

4. The system of claim 1 , wherein a center-to-center distance between the overlapping first ends of the first and second waveguides is less than or equal to 2 micrometers.

5. The system of claim 1 , wherein:
the first and second waveguides are configured whereupon light propagating to the first end of the first or second waveguide forms an evanescent light field that is received by the first end of the other of the first or second waveguide; and
the light received by the first end of the other of the first or second waveguide propagates away from the first end of the other of the first or second waveguide.

6. The system of claim 1 , wherein the third substrate overlays a part of the first substrate and a part of the second substrate.

7. The system of claim 1 , wherein:
the first substrate includes a step having a face where the end face of the optical fiber is exposed; and
at least a part of the second end of the third substrate abuts the face of the step of the first substrate.

8. The system of claim 1 , wherein the groove is V-shaped.

9. The system of claim 1 , wherein:
the first end of the first substrate includes interconnect nodules;
the first end of the second substrate includes interconnect nodules; and
the interconnect nodules on the first end of the first substrate and the first end of the second substrate are mated with each other.

10. The system of claim 9 , wherein the interconnect nodules on the first end of the first substrate and the first end of the second substrate are mated (a) with their end faces abutting, (b) in an interdigitated manner, (c) in a friction fit manner, (d) in an interlocking manner, or (e) some combination of (a)-(d).

11. The system of claim 9 , wherein each interconnect nodule, individually, is flush with or extends beyond a surface of the first end of the corresponding first or second substrate.

12. The system of claim 1 , wherein the first ends of the first and second waveguides overlapping in spaced substantially parallel relation have their longitudinal axes aligned ±2°.

13. The system of claim 1 , wherein:
the first substrate includes a plurality of optical fibers, each optical fiber disposed in a separate groove;
the second substrate includes a plurality of first waveguides; and
the third substrate includes a plurality of second waveguides.

14. The system of claim 1 , wherein a spacing between adjacent second waveguides increases toward the second end of the third substrate.

15. The system of claim 1 , further including mating alignment features on at least two of the substrates.

Assignees

• Indiana Integrated Circuits Llc
• Rochester Institute Tech
• Mrsi Systems Llc

Inventors

• Kulick Jason M
• Qian Yi
• Preble Stefan
• Steidle Jeffrey
• Fanto Michael
• Lu Tian

Classifications

• G02B2006/12147

  Coupler · CPC title

• G02B6/43

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• G02B6/4291

  by accessing the evanescent field of the light guide · CPC title

• G02B6/368

  with pitch conversion between input and output plane, e.g. for increasing packing density · CPC title

• G02B6/29331

  operating by evanescent wave coupling · CPC title