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Additive for high-purity copper electrolytic refining and method of producing high-purity copper
US10407785B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10407785-B2 |
| Application number | US-201515509496-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 2, 2015 |
| Priority date | Oct 4, 2014 |
| Publication date | Sep 10, 2019 |
| Grant date | Sep 10, 2019 |
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- Title
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Abstract
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The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.
First claim
Opening claim text (preview).
The invention claimed is: 1. An additive for high-purity copper electrolytic refining which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, wherein the additive is a polyoxyethylene monophenyl ether of formula [1] or a polyoxyethylene naphthyl ether of formula [2] wherein n represents an added number of moles of the polyoxyalkylene group of 2 to 15. 2. A method of producing high-purity copper comprising: performing copper electrolysis using a copper electrolyte to which an additive is added which is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, wherein the additive is a polyoxyethylene monophenyl ether of formula [1] or a polyoxyethylene naphthyl ether of formula [2] wherein n represents an added number of moles of the polyoxyalkylene group of 2 to 15. 3. The method of producing high-purity copper according to claim 2 , wherein the copper electrolysis is performed while a concentration of the additive is maintained within a range of 2 to 500 mg/L. 4. The method of producing high-purity copper according to claim 2 , wherein the copper electrolyte is one of the group consisting of a copper sulfate solution, a copper nitrate solution, and a copper chloride solution. 5. The method of producing high-purity copper according to claim 2 , wherein the copper electrolyte is a copper sulfate solution having a sulfuric acid concentration of 10 to 300 g/L and a copper concentration of 5 to 90 g/L. 6. The method of producing high-purity copper according to claim 2 , wherein the copper electrolyte is a copper nitrate solution having a nitric acid concentration of 0.1 to 100 g/L and a copper concentration of 5 to 90 g/L. 7. The method of producing high-purity copper according to claim 2 , wherein high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less. 8. The method of producing high-purity copper according to claim 3 , wherein the copper electrolyte is one of the group consisting of a copper sulfate solution, a copper nitrate solution, and a copper chloride solution. 9. The method of producing high-purity copper according to claim 3 , wherein the copper electrolyte is a copper sulfate solution having a sulfuric acid concentration of 10 to 300 g/L and a copper concentration of 5 to 90 g/L. 10. The method of producing high-purity copper according to claim 4 , wherein the copper electrolyte is a copper sulfate solution having a sulfuric acid concentration of 10 to 300 g/L and a copper concentration of 5 to 90 g/L. 11. The method of producing high-purity copper according to claim 3 , wherein the copper electrolyte is a copper nitrate solution having a nitric acid concentration of 0.1 to 100 g/L and a copper concentration of 5 to 90 g/L. 12. The method of producing high-purity copper according to claim 4 , wherein the copper electrolyte is a copper nitrate solution having a nitric acid concentration of 0.1 to 100 g/L and a copper concentration of 5 to 90 g/L. 13. The method of producing high-purity copper according to claim 3 , wherein high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less. 14. The method of producing high-purity copper according to claim 4 , wherein high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less. 15. The method of producing high-purity copper according to claim 5 , wherein high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less. 16. The method of producing high-purity copper according to claim 6 , wherein high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.
Assignees
Inventors
Classifications
Polyalkylene oxides · CPC title
- C25C1/12Primary
of copper · CPC title
End-capping · CPC title
containing oxygen in addition to the ether group · CPC title
with organic compounds · CPC title
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Frequently asked questions
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- What does patent US10407785B2 cover?
- The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification C25C1/12. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Sep 10 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).