Method for removing vapors generated by processing device

US10406474B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10406474-B2
Application numberUS-201715687615-A
CountryUS
Kind codeB2
Filing dateAug 28, 2017
Priority dateJun 8, 2017
Publication dateSep 10, 2019
Grant dateSep 10, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for removing vapors generated by a processing device presenting reduced risk to human handlers includes placing a vapor removing device in a feed area of the processing device. The vapor removing device includes a connecting plate and at least one vapor removing element each connected to one surface of the connecting plate. The vapor removing device is lifted robotically from the feed area and placed into the processing device. Then, the vapor removing element directly removes vapors generated by the processing device when the processing device starts to work, the device being robotically taken out of the processing device and placed back in the feed area.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for removing vapors generated by a processing device comprising: placing a vapor removing device in a feed area of the processing device, the vapor removing device comprising a connecting plate and at least one vapor removing element, each vapor removing element connected to one surface of the connecting plate; lifting the vapor removing device from the feed area and placing the vapor removing device into the processing device, so that the vapor removing element removes vapors generated by the processing device when the processing device starts to work; and taking the vapor removing device out of the processing device and placing the vapor removing device back in the feed area. 2. The method of claim 1 , wherein the connecting plate is an aluminum plate, and the vapor removing element is a sponge. 3. The method of claim 1 , wherein the vapor removing element is connected to the connecting plate by adhesive. 4. The method of claim 1 , wherein the vapor removing device has a length and a width equal to workpiece processed by the processing device. 5. The method of claim 1 , wherein the connecting plate comprises a connecting portion and at least one operating portion connected to the connecting portion, each operating portion protrudes from an edge of the connecting portion, and is coplanar with the connecting portion. 6. The method of claim 5 , wherein the connecting portion and the vapor removing element are both rectangular and have a same size. 7. The method of claim 5 , wherein the connecting plate further comprises at least one positioning portion connected to the connecting portion, each positioning portion protrudes from an edge of the connecting portion which forms no operating ring, and is coplanar with the connecting portion. 8. The method of claim 1 , wherein the processing device is a cold pressing device and presses the vapor removing element when the processing device starts to work, the vapor removing element after being pressed has a thickness less than or equal to a mold opening height of the processing device. 9. The method of claim 8 , wherein an original thickness of the vapor removing device and a thickness of the vapor removing device after being pressed is in a ratio of less than 50%. 10. The method of claim 1 , wherein the vapor removing device is lifted or taken by a robot. 11. A method for removing vapors generated by a processing device comprising: placing a vapor removing device in a feed area of the processing device, the vapor removing device comprising a connecting plate and two vapor removing elements connected to opposite surfaces of the connecting plate; lifting the vapor removing device from the feed area and placing the vapor removing device into the processing device, so that the vapor removing elements remove vapors generated by the processing device when the processing device starts to work; and taking the vapor removing device out of the processing device and placing the vapor removing device back in the feed area.

Assignees

Inventors

Classifications

  • F26B5/16Primary

    by contact with sorbent bodies, e.g. absorbent mould; by admixture with sorbent materials · CPC title

  • Component parts, details or accessories; Auxiliary operations · CPC title

  • Dust eliminating means; Mould or press ram cleaning means · CPC title

  • B01D53/04Primary

    with stationary adsorbents {(B01D53/025 takes precedence)} · CPC title

  • of articles of definite length, i.e. discrete articles {(B29C35/0227 takes precedence)} · CPC title

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What does patent US10406474B2 cover?
A method for removing vapors generated by a processing device presenting reduced risk to human handlers includes placing a vapor removing device in a feed area of the processing device. The vapor removing device includes a connecting plate and at least one vapor removing element each connected to one surface of the connecting plate. The vapor removing device is lifted robotically from the feed …
Who is the assignee on this patent?
Fu Tai Hua Ind Shenzhen Co Ltd, Hon Hai Prec Ind Co Ltd
What technology area does this patent fall under?
Primary CPC classification F26B5/16. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Sep 10 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).