Carrier assembly for blood pressure module

US10405758B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10405758-B2
Application numberUS-201514934834-A
CountryUS
Kind codeB2
Filing dateNov 6, 2015
Priority dateNov 7, 2014
Publication dateSep 10, 2019
Grant dateSep 10, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A carrier assembly includes a sub-assembly including a pump, at least one solenoid valve, and a check valve. The pump, the at least one solenoid valve, and the check valve are in fluid communication with each other and with at least one pressure transducer via a manifold. Also, the carrier assembly is configured to be mounted to a medical device's main assembly board.

First claim

Opening claim text (preview).

What is claimed is: 1. A blood pressure module, comprising: a blood pressure cuff connector; a main printed circuit assembly; a manifold positioned on the main printed circuit assembly and forming a fluid connection with the blood pressure cuff connector; at least one pressure transducer positioned on the main printed circuit assembly; and a carrier configured to be mounted to the main printed circuit assembly, wherein the carrier supports: a pump; at least one solenoid valve positioned adjacent to the pump; a check valve positioned adjacent to both the pump and the at least one solenoid valve, wherein the pump, the at least one solenoid valve and the check valve are in fluid communication with each other and with the at least one pressure transducer via the manifold; a speaker; a wireless radio; and an integrated wire harness holding at least one wire for each of: the pump, the at least one solenoid valve, the check valve, the speaker, and the wireless radio; wherein the main printed circuit assembly has a first surface area on a top surface of the main printed circuit assembly; and wherein the components supported by the carrier occupy an amount of surface area on the top surface that is at least less than half of the first surface area. 2. The blood pressure module of claim 1 , wherein the carrier is carried on the main printed circuit assembly. 3. The blood pressure module of claim 2 , wherein the carrier and the main printed circuit assembly form an integrated assembly. 4. The blood pressure module of claim 1 , wherein the carrier comprises pump retention snaps for supporting the pump. 5. The blood pressure module of claim 1 , wherein the carrier includes a speaker mount for the speaker and a wireless radio mount for the wireless radio. 6. The blood pressure module of claim 1 , wherein the carrier includes an integrated pump/valve harness.

Assignees

Inventors

Classifications

  • The other DC source being a battery actively interacting with the first one, i.e. battery to battery charging (with circuits for polarity protection H02J7/68) · CPC title

  • Manufacturing methods specially adapted for producing sensors for in-vivo measurements · CPC title

  • Holes or slots in insulating substrate not used for electrical connections · CPC title

  • associated with components mounted in and supported by recessed areas of the PCBs · CPC title

  • Non-printed inductor · CPC title

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Frequently asked questions

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What does patent US10405758B2 cover?
A carrier assembly includes a sub-assembly including a pump, at least one solenoid valve, and a check valve. The pump, the at least one solenoid valve, and the check valve are in fluid communication with each other and with at least one pressure transducer via a manifold. Also, the carrier assembly is configured to be mounted to a medical device's main assembly board.
Who is the assignee on this patent?
Welch Allyn Inc
What technology area does this patent fall under?
Primary CPC classification H05K1/0216. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 10 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).