Antenna system

Patent metadata

Field	Value
Publication number	US-10404656-B2
Application number	US-201515514026-A
Country	US
Kind code	B2
Filing date	Mar 16, 2015
Priority date	Sep 25, 2014
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

[Problem] To provide an antenna system that excellently dissipates heat to the outside of a housing, said heat having been generated by means of an electronic component. [Solution] An electronic circuit board 10 has an electronic component mounted thereon, and has an antenna that is formed on one surface. A protection member 20 covers the one surface of the electric circuit board 10. A heat transfer unit 30 transfers heat to the protection member 20, said heat having been generated by means of the electronic component mounted on the electric circuit board 10.

First claim

The invention claimed is:

1. An antenna system comprising:
an electric circuit board on which an electronic component is mounted, the electric circuit board including an antenna formed on one of surfaces of the electric circuit board;
a protection member covering the one of surfaces of the electric circuit board;
a heat transfer part which transfers heat generated by the electronic component mounted on the electric circuit board to the protection member, and
a sub resonator provided on an outer surface of the protection member.

2. An antenna system comprising:
an electric circuit board on which an antenna is formed, the electronic circuit board having a surface on which an electronic component is mounted;
a protection member covering at least part of another surface of the electric circuit board; and
a heat transfer part which transfer heat generated by the electronic component mounted on the electric circuit board,
wherein
at least part of heat generated by the electronic component is transferred to a side of the another surface via the heat transfer part and
the protection member is provided with a through hole that exposes the another surface of the electric circuit board for releasing the heat, which is transferred to the another surface, to outside.

3. The antenna system according to claim 2 , wherein the antenna formed on the electric circuit board is a slot antenna.

4. The antenna system according to claim 2 , wherein the protection member is made of a material with a higher thermal conductivity than that of plastic.

5. The antenna system according to claim 1 , wherein the heat transfer part includes a resin member formed in such a way that the one surface of the electric circuit board and the protection member are thermally coupled to each other.

6. The antenna system according to claim 1 wherein
resonance frequency of the sub resonator is equal to that of the antenna formed on the electric circuit board,
the heat transfer part includes a connection member by which the one surface of the electric circuit board and the sub resonator are thermally coupled to each other,
at least part of heat generated by the electronic component is transferred to the sub resonator via the connection member, and
the heat transferred to the sub resonator is released to outside.

7. The antenna system according to claim 1 , wherein the heat transfer part is provided in the electric circuit board and includes a via provided so as to transfer heat to a surface facing the protection member.

8. The antenna system according to claim 2 , wherein a surface of the electric circuit board which faces the protection member and the protection member are in contact with each other and thermally coupled to each other.

9. The antenna system according to claim 2 , wherein the heat transfer part is provided in the electric circuit board and includes a via provided so as to transfer heat to a surface facing the protection member.

Assignees

• Nec Corp

Inventors

• Mochizuki Takuji

Classifications

• H05K1/0204

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H01Q9/0414

  in a stacked or folded configuration · CPC title

• H01Q1/02 Primary

  Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} · CPC title

• H01Q23/00

  Antennas with active circuits or circuit elements integrated within them or attached to them · CPC title