Electronic device packages with attenuated electromagnetic interference signals

Patent metadata

Field	Value
Publication number	US-10403581-B2
Application number	US-201715721729-A
Country	US
Kind code	B2
Filing date	Sep 29, 2017
Priority date	Sep 29, 2017
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.

First claim

What is claimed is:

1. An electronic device package, comprising:
a package substrate;
an active layer operably coupled to the package substrate;
a metallic stiffener; and
a magnetic lossy bonding layer coupling the stiffener to the package substrate;
wherein either:
the metallic stiffener is electrically floating: or
the package substrate comprises:
a ground layer defining a plane configured to ground the electronic device package;
a dielectric layer coupled to the ground layer;
a signal layer coupled to the dielectric layer; and
a solder mask coupled to the signal layer.

2. The electronic device package of claim 1 , wherein the magnetic lossy bonding layer comprises a bonding material including an adhesive and a plurality of magnetic particles.

3. The electronic device package of claim 2 , wherein the adhesive is a resin.

4. The electronic device package of claim 2 , wherein the adhesive is an epoxy.

5. The electronic device package of claim 2 , wherein the magnetic particles attenuate an electromagnetic signal.

6. The electronic device package of claim 2 , wherein the magnetic particles include a member of the group consisting of: nickel (Ni), cobalt (Co), zinc (Zn), copper (Cu), zirconium (Zr), barium (Ba), strontium (Sr), neodymium (Nd), tantalum (Ta), ferrites, iron (Fe), ferrosilicon (FeSi), iron oxides, and mixtures thereof.

7. The electronic device package of claim 2 , wherein the magnetic particles are present in the bonding material in an amount of up to 70 percent by volume.

8. The electronic device package of claim 2 , wherein the magnetic particles are present in the bonding material in an amount of from 50 to 60 percent by volume.

9. The electronic device package of claim 1 , wherein the magnetic lossy bonding layer is substantially free of non-magnetic particles.

10. The electronic device package of claim 1 , wherein the magnetic lossy bonding layer is substantially free of silver particles.

11. The electronic device package of claim 1 , wherein the active layer comprises at least one electromagnetic signal-generating component.

12. A method for manufacturing an electronic device package, comprising:
providing a substrate defining a plane;
coupling an active layer to the substrate; and
coupling a stiffener layer to the substrate with a magnetic lossy bonding layer;

wherein the metallic stiffener is electrically floating.

13. The method of claim 12 , wherein the magnetic lossy bonding layer comprises a bonding material including an adhesive and a plurality of magnetic particles.

14. The method of claim 13 , wherein the adhesive is a resin.

15. The method of claim 13 , wherein the adhesive is an epoxy.

16. The method of claim 13 , wherein the magnetic particles attenuate an electromagnetic signal.

17. The method claim 13 , wherein the magnetic particles include a member of the group consisting of: nickel (Ni), cobalt (Co), zinc (Zn), copper (Cu), zirconium (Zr), barium (Ba), strontium (Sr), neodymium (Nd), tantalum (Ta), ferrites, iron (Fe), ferrosilicon (FeSi), iron oxides, and mixtures thereof.

18. The method of claim 13 , wherein the magnetic particles are present in the bonding material in an amount of up to 70 percent by volume.

19. The method of claim 13 , wherein the magnetic particles are present in the bonding material in an amount of from 50 to 60 percent by volume.

20. The method of claim 12 , wherein the magnetic lossy bonding layer is substantially free of non-magnetic particles.

21. The method of claim 12 , wherein the magnetic lossy bonding layer is substantially free of silver particles.

22. A method for attenuating electromagnetic signals in an electronic device package, comprising:
coupling a stiffener to a substrate of the electronics device package with a magnetic lossy bonding layer, such that the stiffener is shielded from at least a portion of any electromagnetic signals generated during operation of the electronic device package;

wherein the electromagnetic signals are generated by at least one layer in the substrate.

23. The method of claim 22 , wherein the electromagnetic signals are generated by an active layer in the electronic device package.

24. The method of claim 22 , wherein the electromagnetic signals are reduced in an amount greater than 20 db.

Assignees

• Intel Corp

Inventors

• Lee Jaejin
• Hsu Hao-Han
• Chen Chung-Hao J
• Han Dong-Ho

Classifications

• H10W42/287

  materials for magnetic shielding, e.g. ferromagnetic materials · CPC title

• H10P14/6302

  Non-deposition formation processes · CPC title

• H10W44/248

  for antennas · CPC title

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

• H10W74/129

  forming a chip-scale package [CSP] · CPC title