Ceramic housing

Patent metadata

Field	Value
Publication number	US-10401911-B2
Application number	US-201415516456-A
Country	US
Kind code	B2
Filing date	Nov 6, 2014
Priority date	Nov 6, 2014
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

According to one example, a ceramic housing for an electronic device includes a surface and an elastomer, where the elastomer covers from ten percent to eighty-five percent of a total surface area of the surface.

First claim

What is claimed:

1. A housing for an electronic device comprising:
a ceramic surface that houses components of the electronic device; and
an elastomer, wherein the elastomer has a median thickness from 0.01 millimeters to 1.00 millimeter and covers from ten percent to eighty-five percent of a total surface area of the surface.

2. The housing of claim 1 , wherein the elastomer is a thermoset polymer.

3. The housing of claim 1 , wherein the elastomer is a thermoplastic polymer.

4. The housing of claim 1 , wherein the elastomer is selected from the group consisting of polyisoprene, styrene-butadiene, polybutadiene, acetonitrile-butadiene, isobutylene-isoprene, ethylene-propylene monomer, ethylene-propylene-diene monomer, polychloroprene, thermoplastic urethane elastomers, styrenic block copolymers, copolyether ester elastomers, polyester amide elastomers, alkyl acrylate copolymer, chlorinated polyethylene, epichlorohydrin, fluoropolymer, hydrogenated nitrile, polysulphide, nitrile, polyurethane, silicone, tetrafluoroethylene propylene, and combinations thereof.

5. The housing of claim 1 , further including a deposition layer formed on the ceramic surface of the housing.

6. A system comprising:
an electronic device; and
a ceramic housing including a ceramic surface, wherein the ceramic housing houses components of the electronic device, wherein an elastomer has a median thickness from 0.01 millimeters to 1.00 millimeter and covers from ten percent to eighty-five percent of a total surface area of an exterior surface of the surface.

7. The system of claim 6 , wherein the ceramic housing includes a ceramic selected from the group consisting of alumina, zirconia, titanium carbide, silicon carbide, boron nitride, and porcelain.

8. The system of claim 6 , wherein the ceramic housing is radio transparent.

9. The system of claim 6 , wherein the surface is an exterior surface of the ceramic housing and covers the exterior surface in a non-random arrangement.

10. The system of claim 6 , wherein the surface is an exterior surface of the ceramic housing and covers the exterior surface in a random arrangement.

11. The system of claim 6 , wherein the surface is an exterior surface of the ceramic housing and covers the exterior surface in a combination of a non-random arrangement and a random arrangement.

12. A method for forming a ceramic housing for an electronic device comprising:
adhering an elastomer to a surface of the ceramic housing that houses components of the electronic device, wherein the elastomer has a median thickness from 0.01 millimeters to 1.00 millimeter and covers from ten percent to eighty-five percent of a total surface area of the surface; and
forming a deposition layer on the surface of the ceramic housing.

13. The method of claim 12 , wherein forming the deposition layer on the surface of the ceramic housing includes utilizing a physical vapor deposition process selected from the group consisting of ion-beam sputtering, reactive sputtering, ion-assisted deposition, high-target-utilization sputtering, high-power impulse magnetron sputtering, gas flow sputtering, and chemical vapor deposition.

14. The substrate of claim 13 , including forming a functional coating layer on the surface of the ceramic housing subsequent to formation of the deposition layer.

15. A housing for an electronic device comprising:
a ceramic surface that houses components of the electronic device; and
an elastomer, wherein the elastomer covers from ten percent to eighty-five percent of a total surface area of the surface, and wherein the elastomer is selected from the group consisting of polyisoprene, styrene-butadiene, polybutadiene, acetonitrile-butadiene, isobutylene-isoprene, ethylene-propylene monomer, ethylene-propylene-diene monomer, polychloroprene, thermoplastic urethane elastomers, styrenic block copolymers, copolyether ester elastomers, polyester amide elastomers, alkyl acrylate copolymer, chlorinated polyethylene, epichlorohydrin, fluoropolymer, hydrogenated nitrile, polysulphide, nitrile, polyurethane, silicone, tetrafluoroethylene propylene, and combinations thereof.

16. The housing of claim 15 , wherein the elastomer is a thermoset polymer.

17. The housing of claim 15 , wherein the elastomer is a thermoplastic polymer.

18. The housing of claim 15 , further including a deposition layer formed on the ceramic surface of the housing.

19. A system comprising:
an electronic device; and
a ceramic housing including a ceramic surface, wherein the ceramic housing houses components of the electronic device, wherein an elastomer covers from ten percent to eighty-five percent of a total surface area of an exterior surface of the surface, and wherein the elastomer is selected from the group consisting of polyisoprene, styrene-butadiene, polybutadiene, acetonitrile-butadiene, isobutylene-isoprene, ethylene-propylene monomer, ethylene-propylene-diene monomer, polychloroprene, thermoplastic urethane elastomers, styrenic block copolymers, copolyether ester elastomers, polyester amide elastomers, alkyl acrylate copolymer, chlorinated polyethylene, epichlorohydrin, fluoropolymer, hydrogenated nitrile, polysulphide, nitrile, polyurethane, silicone, tetrafluoroethylene propylene, and combinations thereof.

20. The system of claim 19 , wherein the ceramic housing includes a ceramic selected from the group consisting of alumina, zirconia, titanium carbide, silicon carbide, boron nitride, and porcelain.

21. The system of claim 19 , wherein the ceramic housing is radio transparent.

22. The system of claim 19 , wherein the surface is an exterior surface of the ceramic housing and covers the exterior surface in a non-random arrangement.

23. The system of claim 19 , wherein the surface is an exterior surface of the ceramic housing and covers the exterior surface in a random arrangement.

24. The system of claim 19 , wherein the surface is an exterior surface of the ceramic housing and covers the exterior surface in a combination of a non-random arrangement and a random arrangement.

25. A method for forming a ceramic housing for an electronic device comprising:
adhering an elastomer to a surface of the ceramic housing that houses components of the electronic device, wherein the elastomer covers from ten percent to eighty-five percent of a total surface area of the surface, and wherein the elastomer is selected from the group consisting of polyisoprene, styrene-butadiene, polybutadiene, acetonitrile-butadiene, isobutylene-isoprene, ethylene-propylene monomer, ethylene-propylene-diene monomer, polychloroprene, thermoplastic urethane elastomers, styrenic block copolymers, copolyether ester elastomers, polyester amide elastomers, alkyl acrylate copolymer, chlorinated polyethylene, epichlorohydrin, fluoropolymer, hydrogenated nitrile, polysulphide, nitrile, polyurethane, silicone, tetrafluoroethylene propylene, and combinations thereof; and
forming a deposition layer on the surface of the ceramic housing.

26. The method of claim 25 , wherein forming the deposition layer on the surface of the ceramic housing includes utilizing a physical vapor deposition process selected from the group consisting of ion-beam sputtering, reactive sputtering, ion-assisted deposition, high-target-utilization sputtering, high-power impulse magnetron sputtering, gas flow sputtering, and chemical vapor deposition.

27. The substrate of claim 2

Assignees

• Hewlett Packard Development Co

Inventors

• Wu Kuan-Ting
• Chang Chi Hao
• Liao Cheng-Feng

Classifications

• G06F1/1616

  with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position · CPC title

• G06F1/1656 Primary

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• C04B41/83

  Macromolecular compounds · CPC title

• B29C45/14336

  Coating a portion of the article, e.g. the edge of the article (B29C45/14573 and B29C45/14598 take precedence) · CPC title

• C23C14/22

  characterised by the process of coating · CPC title