Thermoplastic resin composition, molded product, and method of producing molded product

Patent metadata

Field	Value
Publication number	US-10400103-B2
Application number	US-201615368677-A
Country	US
Kind code	B2
Filing date	Dec 5, 2016
Priority date	Dec 9, 2015
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

The thermoplastic resin composition contains (A) a polyamide, (B) a polyphenylene ether, and (C) a compatibilizer. When the thermoplastic resin composition is molded into a specimen, a continuous phase containing the polyamide (A) and a dispersed phase containing the polyphenylene ether (B) are formed in the specimen, and E-20 represents a mean ellipticity of the dispersed phase in region I extending from a surface of the hinge portion to a depth of 20 μm in the thickness direction, and E-mid represents a mean ellipticity of the dispersed phase in region II extending from a distance, measured along the thickness direction from the surface, equal to 48% of the thickness to a distance, measured along the thickness direction from the surface, equal to 52% of the thickness, the following formula (1) is satisfied:

4.0≤( E -20)/( E -mid)  (1).

First claim

The invention claimed is:

1. A molded product comprising:
a specimen, the specimen having two structural parts and a hinge portion;
the hinge portion having a width of 3 mm to 5 mm, a length of 5 mm to 25 mm, and a thickness of 0.3 mm to 0.7 mm for connecting the two structural parts, wherein
the hinge portion is comprised of a thermoplastic resin composition, the thermoplastic resin composition comprising (A) a polyamide, (B) a polyphenylene ether, and (C) a compatibilizer;

the specimen having a continuous phase wherein the continuous phase is comprised of the polyamide (A), the specimen also having a dispersed phase wherein the dispersed phase is comprised of the polyphenylene ether (B);
a region I extends for a first distance t 1 , the first distance t 1 extending from a first surface of the hinge portion to a depth of 20 μm in the thickness direction of the hinge portion, and wherein
region I comprises E-20, such that E-20 represents a mean ellipticity of the dispersed phase;

a region II extends for a second distance t 2 such that the second distance t 2 extends from a second surface of the hinge portion and the second distance t 2 is between 48% and 52% of the first distance t 1 , and wherein
region II comprises E-mid, such that E-mid represents a mean ellipticity of the dispersed phase; and

the following formula (1) is satisfied:
4.0≤( E -20)/( E -mid)  (1).

2. The molded product according to claim 1 , wherein
region I further comprises S-20, such that S-20 represents an area fraction of the dispersed phase; and
region II further comprises S-mid, such that S-mid represents an area fraction of the polyphenylene ether (B) in the dispersed phase; and
the following formula (2) is satisfied:
1.10≤( S -20)/( S -mid)  (2).

3. The molded product according to claim 1 , wherein the thermoplastic resin composition comprises 40 to 90 parts by mass of the polyamide (A) and 60 to 10 parts by mass of the polyphenylene ether (B), per 100 parts by mass in total of the polyamide (A) and the polyphenylene ether (B).

4. The molded product according to claim 1 , wherein
the compatibilizer (C) is at least one selected from the group consisting of maleic anhydride, maleic acid, citric acid, and fumaric acid, and
the thermoplastic resin composition comprises 0.03 to 10.0 parts by mass of the compatibilizer (C) per 100 parts by mass in total of the polyamide (A) and the polyphenylene ether (B).

5. The molded product according to claim 1 , further comprising (D) an impact modifier.

6. The molded product according to claim 1 , wherein the the specimen is a part of an automotive part.

7. The molded product according to claim 6 , wherein the the specimen is part of a relay block.

8. A method of producing the molded product as recited in claim 1 with a mold having a gate with a gate thickness of 1.0 mm or less, at a molding temperature of 270° C. to 290° C., a mold temperature of 30° C. to 60° C., and an injection rate of 45 cm 3 /sec or higher.

9. The method of producing a molded product according to claim 8 , wherein the thermoplastic resin composition is in the form of pellets with a moisture percentage of 150 mass ppm to 500 mass ppm.

Assignees

• Asahi Chemical Ind

Inventors

• Maeda chihiro
• Umei Yuo
• Yamamoto Mihoko

Classifications

• B29L2031/34

  Electrical apparatus, e.g. sparking plugs or parts thereof · CPC title

• B29K2105/0088

  Blends of polymers · CPC title

• B29C45/0081

  of objects with parts connected by a thin section, e.g. hinge, tear line · CPC title

• C08L77/06 Primary

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• B29C45/0001

  characterised by the choice of material · CPC title