Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production method

Patent metadata

Field	Value
Publication number	US-10400085-B2
Application number	US-201414764828-A
Country	US
Kind code	B2
Filing date	Jan 30, 2014
Priority date	Jan 31, 2013
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

Provided are an electron beam curable resin composition including an olefin resin, a crosslinking agent, and a white pigment, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and the white pigment is blended in an amount of more than 200 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, a reflector resin frame using the resin composition, a reflector, a semiconductor light-emitting device, and a molding method using the resin composition.

First claim

The invention claimed is:

1. An electron beam curable resin composition comprising:
an olefin resin;
a crosslinking agent; and
a white pigment,
wherein the crosslinking agent has a saturated or unsaturated ring structure,
at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and
the white pigment is contained in an amount of more than 220 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, and
the crosslinking agent is contained in an amount of more than 2 parts by mass to 40 parts by mass or less with respect to 100 parts by mass of olefin resin, and
the olefin resin is a copolymer of 4-methylpentene-1 and an α-olefin having 2 to 20 carbon atoms.

2. The electron beam curable resin composition according to claim 1 ,
wherein at least two atoms among the atoms forming one ring of the crosslinking agent are each independently bonded to the allylic substituent.

3. The electron beam curable resin composition according to claim 2 ,
wherein the ring of the crosslinking agent is a six-membered ring,
at least two atoms among the atoms forming the ring are each independently bonded to the allylic substituent, and
another allylic substituent is bonded to an atom in a meta position with respect to an atom bonded with one allylic substituent.

4. The electron beam curable resin composition according to claim 1 ,
wherein the crosslinking agent is expressed by the following Formula (1):

where R 1 to R 3 are each independently any allylic substituent of an allyl group, a methallyl group, an allyl group through ester bonding, and a methallyl group through ester bonding.

5. The electron beam curable resin composition according to claim 1 , further comprising:
inorganic particles other than the white pigment.

6. The electron beam curable resin composition according to claim 5 ,
wherein the inorganic particles other than the white pigment are at least one of silica particles and glass fibers.

7. The electron beam curable resin composition according to claim 1 ,
wherein a dispersant or a resin modifier is blended.

8. A reflector resin frame comprising:
a cured product of the electron beam curable resin composition according to claim 1 .

9. The reflector resin frame according to claim 8 ,
wherein a thickness is 0.1 mm to 3.0 mm.

10. A reflector comprising:
a cured product of the electron beam curable resin composition according to claim 1 .

11. The electron beam curable resin composition according to claim 1 ,
wherein an average particle size of the white pigment is 0.10 μm to 0.50 μm.

12. The electron beam curable resin composition according to claim 1 ,
wherein the olefin resin is polymethylpentene.

13. The electron beam curable resin composition according to claim 1 ,
wherein a Reflectivity of an Initial stage of a cured product obtained by curing the electron beam curable resin composition is more than 91.6% or more at a wavelength of 450 nm.

14. An electron beam curable resin composition comprising:
an olefin resin;
a crosslinking agent; and
a white pigment,
wherein the crosslinking agent has a saturated or unsaturated ring structure,
at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and
the white pigment is contained in an amount of more than 220 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, and the olefin resin is a copolymer of 4-methylpentene-1 and an α-olefin having 2 to 20 carbon atoms, and
the crosslinking agent is contained in an amount of more than 2 parts by mass to 40 parts by mass or less with respect to 100 parts by mass of olefin resin,
wherein the crosslinking agent is expressed by the following Formula (2):

where R 1 to R 3 are each independently any allylic substituent of an allyl group, a methallyl group, an allyl group through ester bonding, and a methallyl group through ester bonding.

15. The electron beam curable resin composition according to claim 14 ,
wherein a Reflectivity of an Initial stage of a cured product obtained by curing the electron beam curable resin composition is 91.6% or more at a wavelength of 450 nm.

16. A semiconductor light-emitting device comprising:
an optical semiconductor element; and
a reflector which is provided in the vicinity of the optical semiconductor element and reflects light from the optical semiconductor element in a predetermined direction,
wherein the optical semiconductor element and the reflector are provided on a substrate, and
at least a part of the light reflecting surface of the reflector is made of a cured product of an electron beam curable resin composition,
wherein the electron beam curable resin composition comprises:
an olefin resin;
a crosslinking agent; and
a white pigment,

wherein the crosslinking agent has a saturated or unsaturated ring structure,
at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and
the white pigment is contained in an amount of more than 220 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, and the olefin resin is a copolymer of 4-methylpentene-1 and an α-olefin having 2 to 20 carbon atoms, and
the crosslinking agent is contained in an amount of more than 2 parts by mass to 40 parts by mass or less with respect to 100 parts by mass of olefin resin.

17. The semiconductor light-emitting device according to claim 16 ,
wherein a Reflectivity of an Initial stage of a cured product obtained by curing the electron beam curable resin composition is 91.6% or more at a wavelength of 450 nm.

18. A molded article production method comprising:
an injection molding process of performing injection molding on the electron beam curable resin composition at an injection temperature of 200° C. to 400° C. and at a mold temperature of 20° C. to 150° C.; and
an electron beam irradiation process of performing electron beam irradiation treatment before and after the injection molding process,
wherein the electron beam curable resin composition comprising:
an olefin resin;
a crosslinking agent; and
a white pigment,

wherein the crosslinking agent has a saturated or unsaturated ring structure,
at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and
the white pigment is contained in an amount of more than 220 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, and the olefin resin is a copolymer of 4-methylpentene-1 and an α-olefin having 2 to 20 carbon atoms, and
the crosslinking agent is contained in an amount of more than 2 parts by mass to 40 parts by mass or less with respect to 100 parts by mass of olefin resin.

19. The molded art

Assignees

• Dainippon Printing Co Ltd

Inventors

• Kimura Aki
• Sakayori Katsuya
• Sakai Toshiyuki
• Takarabe Toshimasa
• Amagai Kei
• Oda Kazunori
• Ooishi Megumi
• Sekiguchi Takeshi
• Kawai Kenzaburou
• Hashimoto Kurumi

Classifications

• C08K7/14

  Glass · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• C08F2/54

  by X-rays or electrons · CPC title

• C08K5/34926

  also containing heterocyclic groups other than triazine groups · CPC title