Bonding of heat-activated films including a plasticizer

US10399313B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10399313-B2
Application numberUS-26936008-A
CountryUS
Kind codeB2
Filing dateNov 12, 2008
Priority dateNov 13, 2007
Publication dateSep 3, 2019
Grant dateSep 3, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plasticizer.

First claim

Opening claim text (preview).

What is claimed is: 1. An article comprising: a heat-activated adhesive multilayer film comprising at least an inner layer, a center layer and an outer layer, wherein the center layer comprises a polymer comprising polyurethaneurea with a weight average molecular weight of from about 40,000 to about 250,000, the outer layer comprises polymer comprising a polyurethaneurea with a molecular weight of about 70,000 and the inner layer comprises polymer comprising a polyurethaneurea with a molecular weight of about 120,000; and a substrate to which the heat-activated adhesive multilayer film is bonded by application of heat and pressure in the presence of a plasticizer comprising water placed on the heat-activated adhesive multilayer film prior to or during bonding to a substrate. 2. The article of claim 1 , wherein said substrate comprises a fabric. 3. The article of claim 2 , wherein said fabric substrate is selected from the group consisting of nylon, cotton, polyester, wool, silk, and combinations thereof.

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Frequently asked questions

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What does patent US10399313B2 cover?
Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plasticizer.
Who is the assignee on this patent?
Covelli Carmen A, Farmer Douglas K, Masters Gavin N, and 1 more
What technology area does this patent fall under?
Primary CPC classification B32B37/0038. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 03 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).