Oxazine compound, composition and cured product

Patent metadata

Field	Value
Publication number	US-10399312-B2
Application number	US-201615781869-A
Country	US
Kind code	B2
Filing date	Nov 8, 2016
Priority date	Dec 16, 2015
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.

First claim

The invention claimed is:

1. An oxazine compound which is represented by General Formula (1-1):

(in Formula (1-1), R 1 's each independently represent a functional group represented by General Formula (2) or (3), and R 8 and R 9 each independently represent a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, or a substituted or unsubstituted aromatic group)

(in Formula (2), X 1 , X 2 , and Y 1 each independently represent a single bond or a divalent linking group, R 2 , R 3 , and R 4 each independently represent a hydrogen atom, a hydrocarbon group, or a hydrocarbon group in which one or more hydrogen atoms contained in the hydrocarbon group are substituted with any one of a hydroxyl group, an alkoxy group, and a halogen atom, and a 1 represents a bonding point to General Formula (1-1))

(in Formula (3), n represents an integer of 2 to 6, X 3 and X 4 each independently represent a single bond or a divalent linking group, Y 2 represents a linking group having a valence of n+1, R 5 , R 6 , and R 7 each independently represent a hydrogen atom, a hydrocarbon group, or a hydrocarbon group in which one or more hydrogen atoms contained in the hydrocarbon group are substituted with any one of a hydroxyl group, an alkoxy group, and a halogen atom, and a 2 represents a bonding point to General Formula (1-1)).

2. The oxazine compound according to claim 1 , wherein the ring A is a substituted or unsubstituted benzene ring or a substituted or unsubstituted naphthalene ring.

3. A composition comprising the oxazine compound according to claim 1 .

4. The composition according to claim 3 , further comprising a reactive compound.

5. The composition according to claim 4 , wherein the reactive compound is a compound having a maleimide group.

6. The composition according to claim 3 , further comprising a filler.

7. The composition according to claim 3 , further comprising a fibrous substrate.

8. A cured product, which is obtained by curing the composition according to claim 3 .

9. A laminate comprising:
a base material; and
a layer of the cured product according to claim 8 .

10. A composition for a heat-resistant material, comprising the composition according to claim 3 .

11. A heat-resistant member comprising the cured product according to claim 8 .

12. A composition for an electronic material, comprising the composition according to claim 3 .

13. An electronic member comprising the cured product according to claim 8 .

14. A semiconductor sealing material comprising the composition according to claim 3 .

15. A prepreg comprising the composition containing a fibrous substrate according to claim 7 .

16. A circuit board further comprising the prepreg according to claim 15 and a copper foil layer.

17. The laminate according to claim 9 , which is a build-up film.

18. A build-up substrate comprising the build-up film according to claim 17 .

Assignees

• Dainippon Ink & Chemicals

Inventors

• Otsu Masato
• Shimono Tomohiro
• Arita Kazuo
• Yamaguchi Junji

Classifications

• H10W74/47 Primary

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/30

  Die-attach connectors · CPC title

• H10W70/69

  Insulating materials thereof · CPC title

• H10W40/251

  Organics · CPC title