Circuit structure and electrical junction box

Patent metadata

Field	Value
Publication number	US-10398019-B2
Application number	US-201615771687-A
Country	US
Kind code	B2
Filing date	Oct 28, 2016
Priority date	Nov 16, 2015
Publication date	Aug 27, 2019
Grant date	Aug 27, 2019

Abstract

A circuit structure that includes: an insulating heat transfer member that transfers heat from a bus bar to a heat dissipating member, is insulating, and is provided between the bus bar and the heat dissipating member; and a restricting member that restricts movement of the insulating heat transfer member that is caused by an increase in the temperature of the insulating heat transfer member, and is provided between the bus bar and the heat dissipating member. The restricting member is provided with heat transfer openings for bringing the insulating heat transfer member into contact with the bus bar, and, the insulating heat transfer member 80 has a smaller area than an opening area of the heat transfer openings, in a state of being in contact with the bus bar.

First claim

The invention claimed is:

1. A circuit structure comprising:
a circuit board provided with a connection opening;
a bus bar provided on a lower surface side of the circuit board;
an electronic component electrically connected to the bus bar via the connection opening, from an upper surface side of the circuit board;
a heat dissipating member that dissipates heat from the bus bar, and is provided on a surface side of the bus bar that is opposite to the surface that faces the circuit board;
an insulating heat transfer member that transfers heat from the bus bar to the heat dissipating member, is insulating, and is provided between the bus bar and the heat dissipating member; and
a restricting member that restricts movement of the insulating heat transfer member that is caused by an increase in the temperature of the insulating heat transfer member, and is provided between the bus bar and the heat dissipating member,
wherein the restricting member is provided with a heat transfer opening for bringing the insulating heat transfer member into contact with the bus bar, and
the insulating heat transfer member has a smaller area than an opening area of the heat transfer opening, in a state of being in contact with the bus bar.

2. The circuit structure according to claim 1 ,
wherein the lower surface of the bus bar includes a first lower surface that has a component region that is a region of the bus bar on the lower surface side thereof and corresponds to a region of the bus bar on the upper surface side thereof where the electronic component is arranged,
the heat transfer opening includes a first heat transfer opening that is open to the first lower surface, and
the insulating heat transfer member is in contact with at least the first lower surface including the component region, via the first heat transfer opening.

3. A circuit structure according to claim 2 ,
wherein the lower surface of the bus bar includes a second lower surface that does not include the component region,
the heat transfer opening further includes a second heat transfer opening that is open to the second lower surface
and the insulating heat transfer member is in contact with the second lower surface via the second heat transfer opening.

4. The circuit structure according claim 1 ,
wherein the insulating heat transfer member has a peripheral portion located at an edge portion of the heat transfer opening, in a state of being in contact with the bus bar.

5. The circuit structure according to claim 1 ,
wherein the restricting member is a frame plate that is insulating,
the frame plate includes a frame portion that forms an edge portion of the heat transfer opening, and has a protruding portion that protrudes toward the heat dissipating member, and
the heat dissipating member has a groove into which the protruding portion of the frame portion is embedded.

6. The circuit structure according to claim 1 , wherein the insulating heat transfer member is formed using a room temperature setting adhesive.

7. An electrical junction box comprising:
the circuit structure according to claim 1 ; and
a case that houses the circuit structure.

Assignees

• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems
• Sumitomo Electric Industries

Inventors

• Kobayashi Takehito

Classifications

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

• H05K2201/10272

  Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K1/181

  associated with surface mounted components · CPC title