Light-emitting device package

Patent metadata

Field	Value
Publication number	US-10396247-B2
Application number	US-201515319486-A
Country	US
Kind code	B2
Filing date	Jun 8, 2015
Priority date	Jun 18, 2014
Publication date	Aug 27, 2019
Grant date	Aug 27, 2019

Abstract

A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.

First claim

The invention claimed is:

1. A light-emitting device package, comprising:
a package body;
at least one light-emitting device in the package body;
an adhesive layer between the at least one light-emitting device and the package body, wherein an adhesive-layer-accommodating portion is formed in the package body for accommodating the adhesive layer therein;
first and second wire bonding pads disposed to be spaced apart from each other around the adhesive-layer-accommodating portion; and
first and second wires connecting first and second electrodes of the at least one light-emitting device and the first and second wire bonding pads to each other respectively,
wherein a cross section of the adhesive-layer-accommodating portion comprises:
a bottom surface; and
side surfaces extending from the bottom surface, the side surfaces being disposed to be inclined at an acute angle with respect to a plane including an optical axis,
wherein the adhesive-layer-accommodating portion includes an opening having a first width at a top side thereof,
wherein the first width is smaller than a second width of the bottom surface, and
wherein the package body includes a cavity, and the at least one light-emitting device, the adhesive layer, and the adhesive-layer-accommodating portion are located in the cavity.

2. The package according to claim 1 , wherein the adhesive layer includes at least one of Ag paste or Au paste.

3. The package according to claim 1 , wherein the package body is formed of an electrically conductive material.

4. The package according to claim 3 , wherein the adhesive-layer-accommodating portion is integrally formed with the package body.

5. The package according to claim 4 , wherein the adhesive-layer-accommodating portion is formed in the shape of a recess in a top of the package body.

6. The package according to claim 3 , wherein the at least one light-emitting device emits light in a wavelength band within a range from 200 nm to 405 nm.

7. The package according to claim 3 , wherein the package body includes first and second body portions, and
wherein the light-emitting device package further comprises an insulator for electrically insulating the first and second body portions.

8. The package according to claim 1 , wherein the adhesive-layer-accommodating portion has a depth that is equal to or greater than a height of the adhesive layer, and a result of subtracting the height of the adhesive layer from the depth of the adhesive-layer-accommodating portion is equal to or less than 0.25 times a height of the at least one light-emitting device.

9. The package according to claim 1 , wherein the adhesive-layer-accommodating portion has a circular, elliptical or polygonal plan shape.

10. The package according to claim 1 , wherein the adhesive-layer-accommodating portion and the first and second wire bonding pads are spaced apart from each other by a first distance, and the first and second wire bonding pads and a side surface of the cavity are spaced apart from each other by a second distance.

11. The package according to claim 1 , wherein the acute angle is equal to or less than 45 degrees.

12. The package according to claim 1 , wherein the adhesive layer has a paste form.

13. The package according to claim 1 , further comprising a molding member filled in the cavity.

14. A light-emitting device package, comprising:
a package body;
at least one light-emitting device above the package body;
an adhesive layer between the at least one light-emitting device and the package body;
a dam portion disposed on an upper surface of the package body to form an adhesive-layer-accommodating portion, the adhesive-layer-accommodating portion accommodating the adhesive layer therein;
first and second wire bonding pads disposed to be spaced apart from each other around the adhesive-layer-accommodating portion; and
first and second wires connecting first and second electrodes of the at least one light-emitting device and the first and second wire bonding pads to each other respectively,
wherein a cross section of the adhesive-layer-accommodating portion comprises:
a bottom surface being the upper surface of the package body; and
side surfaces extending from the bottom surface, the side surfaces being disposed to be inclined at an acute angle with respect to a plane including an optical axis,

wherein the adhesive-layer-accommodating portion includes an opening having a first width at a top side thereof,
wherein the first width is smaller than a second width of the bottom surface, and
wherein the package body includes a cavity, and the at least one light-emitting device, the adhesive layer, and the adhesive-layer-accommodating portion are located in the cavity.

15. The package according to claim 14 , wherein the dam portion and the package body are formed of the same material.

16. The package according to claim 14 , wherein the dam portion and the package body are formed of different materials.

17. The package according to claim 14 , wherein the package body is formed of an electrically insulative material.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Byung Mok
• Kodaira Hiroshi
• Kim Baek Jun
• Kim Ha Na
• Lee Jung Woo
• Hwang Sang Ung

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• F21V7/05

  plane · CPC title

• H05K1/0212

  Printed circuits or mounted components having integral heating means · CPC title

• H01L2224/48091

  Electricity · mapped topic

• H01L2924/00014

  Electricity · mapped topic