CdTe-based double heterostructures and related light-conversion devices

US10396232B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10396232-B2
Application numberUS-201716090033-A
CountryUS
Kind codeB2
Filing dateMar 29, 2017
Priority dateMar 31, 2016
Publication dateAug 27, 2019
Grant dateAug 27, 2019

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  5. First independent claim

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Abstract

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Devices converting light to electricity (such as solar cells or photodetectors) including a heavily-doped p-type a-SiC y :H and an i-Mg x Cd 1-x Te/n-CdTe/N—Mg 0.24 Cd 0.76 Te double heterostructure (DH), with power conversion efficiency of as high as 17%, V oc as high as 1.096 V, and all operational characteristics being substantially better than those of monocrystalline solar cells known to-date. The a-SiC y :H layer is configured to enable high built-in potential while, at the same time, allowing the doped absorber to maintain a very long carry lifetime. In comparison, similar undoped CdTe/Mg x Cd 1-x Te DH designs reveal a long carrier lifetime of 3.6 μs and an interface recommendation velocity of 1.2 cm/s, which are lower than the record values reported for GaAs/Al 0.5 Ga 0.5 As (18 cm/s) and GaAs/Ga 0.5 In 0.5 P (1.5 cm/s) DHs.

First claim

Opening claim text (preview).

What is claimed is: 1. A device configured to convert light to electricity, the device comprising: an InSb substrate, and a double-heterojunction (DH) structure carried on said InSb substrate, said DH structure including a CdTe-containing absorber layer sandwiched between first and second MgxCd 1-x Te-containing barrier layers, wherein the first and second barrier layers are configured to confine minority carriers to said absorber layer, and wherein said DH structure is characterized by an open-circuit voltage that exceeds 1 V, and further comprising a layer of a-Si:H on the DH structure, said a-Si:H layer configured as a p-type doped electrical contact layer, and wherein a barrier layer from the first and second barrier layers contains a spatial doping material profile that is not uniform across the thickness of said barrier layer. 2. The device according to claim 1 , further comprising an electrode layer and a p-typed doped contact layer configured between said electrode layer and said DH structure. 3. The device according to claim 1 , wherein said p-type doped contact layer is a p-aSiC y :H contact layer, wherein a value of y is within a range between zero and 0.5, inclusive of zero. 4. The device according to claim 1 , characterized by an effective radiative lifetime of carriers, in said DH structure, that exceeds 2 microseconds. 5. The device according to claim 1 , characterized by an effective radiative lifetime of carriers, in said DH structure, that exceeds 3 microseconds. 6. The device according to claim 1 , wherein an absolute value of interface recombination velocity (IRV) of carriers in said DH structure is lower than a first IRV of carriers characterizing a first material interface and lower than a second IRV of carriers characterizing a second material interface, the first material interface including a GaAs/Al 0.5 Ga 0.5 As material interface and the second material interface including a GaA/Ga 0.5 In 0.5 P material interface. 7. The device according to claim 1 , wherein an absolute value of IRV of carriers in said DH structure is lower than 1.5 m/s. 8. The device according to claim 1 , wherein said DH structure includes a p-type ZnTe doping material. 9. The device according to claim 1 , further comprising a p-type doped contact layer on said DH structure, said p-type contact layer containing a layer of aSiC y :H and an immediately neighboring aSi:H layer, wherein y is about 6%, wherein the first barrier layer is a 10 nm thick undoped Mg 0.30 Cd 0.70 Te barrier layer, the first barrier layer being the closest of the first and second barrier layers to the p-type doped contact layer, wherein the absorber layer has an approximately 1 micron thickness and is doped with n-type In doping at a level of about 3e 16 cm −3 . 10. The device according to claim 1 , further comprising a p-type doped contact layer on said DH structure, said p-type contact layer including a layer of aSi:H, wherein the first barrier layer is a 10 nm thick undoped Mg 0.30 Cd 0.70 Te barrier layer, the first barrier layer being the closest, of the first and second barrier layers, to the p-type doped contact layer, and wherein the absorber layer has an approximately 1.4 micron thickness and is doped with n-type In at a first level of about 1e 16 cm −3 in a first portion of said absorber layer and at a second level of about 5e 17 cm −3 in a second portion of said absorber, the first portion being about 1 micron thick, the second portion being spatially complementary to said first portion. 11. The PV cell according to claim 10 , wherein the second portion of the absorber layer is separated from said contact layer by the first portion of said absorber layer. 12. A device configured to convert light to electricity, the device comprising: an InSb substrate, and a double-heterojunction (DH) structure carried on said InSb substrate, said DH structure including a CdTe-containing absorber layer sandwiched between first and second Mg x Cd 1-x Te-containing barrier layers, wherein the first and second barrier layers are configured to confine minority carriers to said absorber layer, and wherein a pn-junction is formed outside of the absorber layer, and further comprising a layer of a-Si:H on the DH structure, said a-Si:H layer configured as a p-type doped electrical contact layer, and wherein a barrier layer from the first and second barrier layers contains a spatial doping material profile that is not uniform across the thickness of said barrier layer. 13. A device according to claim 12 , wherein said DH structure is characterized by an open-circuit voltage that exceeds 1 V. 14. A device according to claim 12 , wherein said p-type doped contact layer is a p-aSiC y :H contact layer, wherein a value of y is within a range between and inclusive of zero and 0.5. 15. The device according to claim 12 , characterized by an effective radiative lifetime of carriers, in said DH structure, that exceeds 2 microseconds. 16. The device according to claim 12 , wherein an absolute value of interface recombination velocity (IRV) of carriers in said DH structure is lower than a first IRV of carriers characterizing a first material interface and lower than a second IRV of carriers characterizing a second material interface, the first material interface including a GaAs/Al 0.5 Ga 0.5 As material interface and the second material interface including a GaA/Ga 0.5 In 0.5 P material interface. 17. The device according to claim 12 , wherein at least one of the following conditions is satisfied: (i) an absolute value of IRV of carriers in said DH structure is lower than 1.5 m/s and (ii) wherein said DH structure includes a p-type ZnTe doping material. 18. The device according to claim 12 , further comprising a p-type doped contact layer on said DH structure, said p-type contact layer containing a layer of aSiC y :H and an immediately neighboring aSi:H layer, wherein y is about 6%, wherein the first barrier layer is a 10 nm thick undoped Mg 0.30 Cd 0.70 Te barrier layer, the first barrier layer being the closest of the first and second barrier layers to the p-type doped contact layer, wherein the absorber layer has an approximately 1 micron thickness and is doped with n-type In doping at a level of about 3e 16 cm −3 . 19. The device according to claim 12 , further comprising a p-type doped contact layer on said DH structure, said p-type contact layer including a layer of aSi:H, wherein the first barrier layer is a 10 nm thick undoped Mg 0.30 Cd 0.70 Te barrier layer, the first barrier layer being the closest, of the first and second barrier layers, to the p-type doped contact layer, and wherein the absorber layer has an approximately 1.4 micron thickness and is doped with n-type In at a first level of about 1e 16 cm −3 in a first portion of said absorber layer and at a second level of about 5e 17 cm −3 in a second portion of said absorber, the first portion being about 1 micron thick, the second portion being spatially complementary to said first portion. 20. The PV cell according to claim 19 , wherein the second portion of the absorber layer is separated from said contact layer by the first portion of said absorber layer.

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What does patent US10396232B2 cover?
Devices converting light to electricity (such as solar cells or photodetectors) including a heavily-doped p-type a-SiC y :H and an i-Mg x Cd 1-x Te/n-CdTe/N—Mg 0.24 Cd 0.76 Te double heterostructure (DH), with power conversion efficiency of as high as 17%, V oc as high as 1.096 V, and all operational characteristics being substantially better than those of monocrystalline solar cells known to-…
Who is the assignee on this patent?
Univ Arizona State
What technology area does this patent fall under?
Primary CPC classification H01L31/073. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 27 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).