Leadframe inductor

Patent metadata

Field	Value
Publication number	US-10396016-B2
Application number	US-201615395429-A
Country	US
Kind code	B2
Filing date	Dec 30, 2016
Priority date	Dec 30, 2016
Publication date	Aug 27, 2019
Grant date	Aug 27, 2019

Abstract

One example includes a device that is comprised of a die, a leadframe, and an electrically conductive material. The die includes a circuit therein. The leadframe is coupled with the die and the circuit therein. The electrically conductive material is disposed in a space above the die opposite the leadframe, the electrically conductive material being coupled to the leadframe and configured as one or more turns thereof to form at least one inductor.

First claim

What is claimed is:

1. A device, comprising:
a die including a circuit therein;
a first leadframe connected to the die, the first leadframe having a plurality of leads on outer edges thereof; and
a second leadframe in a form of an electrically conductive clip at least partially encompassing the die, the die being positioned between the first and second leadframes, the second leadframe having one or more turns that form at least one inductor, and the second leadframe being connected to the first leadframe to electrically couple the at least one inductor with the circuit.

2. The device of claim 1 , further comprising a layer of magnetic material between the die and the electrically conductive clip.

3. The device of claim 2 , wherein the magnetic material is at least one of a ferrite plate, pressed metal powder, and a magnetic powder in an insulating binder.

4. The device of claim 3 , wherein the insulating binder is at least one of epoxy, resin, and plastic.

5. The device of claim 1 , wherein the electrically conductive clip includes a first winding member and a second winding member that are connected together as one or more of the turns that form the at least one inductor.

6. The device of claim 2 , wherein the magnetic material is a first magnetic material, and the device further comprises a second magnetic material, at least a portion of the electrically conductive clip being positioned between the second magnetic material and the first magnetic material.

7. The device of claim 1 , further comprising a package that encapsulates the die and the first and second leadframes.

8. A method, comprising:
connecting a first leadframe to a die, the die including a circuit therein, and the first leadframe having a plurality of leads on outer edges thereof;
disposing a second leadframe in a form of an electrically conductive clip at least partially encompassing the die, the die being positioned between the first and second leadframes, and the second leadframe having one or more turns that form at least one inductor; and
connecting the second leadframe to the first leadframe to electrically couple the at least one inductor with the circuit.

9. The method of claim 8 , further comprising depositing a layer of magnetic material between the die and the electrically conductive clip.

10. The method of claim 9 , wherein the magnetic material is at least one of a ferrite plate, pressed metal powder, and a magnetic powder in an insulating binder.

11. The method of claim 10 , wherein the insulating binder is at least one of epoxy, resin, and plastic.

12. The method of claim 8 , wherein the electrically conductive clip includes a first winding member and a second winding member, and the method further comprises:
connecting the first winding member and the second winding member together as one or more of the turns that form the at least one inductor.

13. The method of claim 8 , wherein connecting the second leadframe to the first leadframe comprises connecting the electrically conductive clip to the first leadframe via at least one connector that is deflected to form one or more of the turns that form the at least one inductor.

14. The method of claim 8 , further comprising overmolding the die and the first and second leadframes.

15. The device of claim 2 , wherein the electrically conductive clip includes a first winding member and a second winding member that are connected together as one or more of the turns that form the at least one inductor.

16. The device of claim 1 , wherein the electrically conductive clip is connected to the first leadframe via at least one connector that is deflected to form one or more of the turns that form the at least one inductor.

17. The method of claim 9 , wherein the magnetic material is a first magnetic material, and the method further comprises depositing a second magnetic material, at least a portion of the electrically conductive clip being positioned between the second magnetic material and the first magnetic material.

18. A device, comprising:
a die;
a first leadframe connected to the die, the first leadframe having a plurality of leads on outer edges thereof;
a second leadframe in a form of an electrically conductive clip at least partially encompassing the die, the die being positioned between the first and second leadframes, the second leadframe having one or more turns that form at least one inductor, and the second leadframe being connected to the first leadframe to electrically couple the at least one inductor with the circuit;
a magnetic core having portions on the second leadframe; and
a third leadframe having portions on the magnetic core, the third leadframe including a first winding member and a second winding member having portions shaped as clips, an end of the clip of the first winding member attached and electrically coupled to the first leadframe, and an end of the clip of the second winding member attached and electrically coupled to a portion of the second leadframe that extends beyond a periphery of the die.

19. The device of claim 18 , wherein the end of the clip of the first winding member and the end of the clip of the second winding member deflect towards a plane along a surface of the first leadframe.

Assignees

• Texas Instruments Inc

Inventors

• Mullenix Joyce Marie
• Massolini Roberto Giampiero
• Parrish Kristen Nguyen
• Lopez Osvalod Jorge
• Noquil Jonathan Almeria

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W70/464

  Additional interconnections in combination with leadframes · CPC title

• H10W70/041

  Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps · CPC title

• H10W70/40 Primary

  Leadframes · CPC title

• H10W44/501

  Inductive arrangements (H10W44/20 takes precedence) · CPC title