Decoupling inductor assembly, radio frequency receiving coil and magnetic resonance imaging apparatus

Patent metadata

Field	Value
Publication number	US-10395808-B2
Application number	US-201514813363-A
Country	US
Kind code	B2
Filing date	Jul 30, 2015
Priority date	Jul 31, 2014
Publication date	Aug 27, 2019
Grant date	Aug 27, 2019

Abstract

A decoupling inductor assembly, an RF receiving coil, and an MRI apparatus are provided. The decoupling inductor assembly includes a first inductor and a second inductor. The first inductor includes a first solenoid and a first port pair located at two ends of the first solenoid, and the second inductor includes a second solenoid and a second port pair located at two ends of the second solenoid. The first solenoid and the second solenoid are wound partially or completely overlapped. The first port pair includes at least one pair of first parallel connection interfaces, and the second port pair includes at least one pair of second parallel connection interfaces.

First claim

The invention claimed is:

1. A decoupling inductor assembly connectable to two adjacent coil units, the decoupling inductor assembly comprising:
a first inductor comprising a first solenoid and a first port pair located at two ends of the first solenoid; and
a second inductor comprising a second solenoid and a second port pair located at two ends of the second solenoid,
wherein the first solenoid and the second solenoid are wound partially or completely overlapped, and
wherein the first port pair comprises at least one pair of first parallel connection interfaces, and the second port pair comprises at least one pair of second parallel connection interfaces.

2. The decoupling inductor assembly of claim 1 , further comprising a capacitor connected in parallel between the first parallel connection interfaces or connected between the second parallel connection interfaces.

3. The decoupling inductor assembly of claim 1 , further comprising an inductor connected in parallel between the at least one pair of first parallel connection interfaces or connected between the at least one pair of second parallel connection interfaces.

4. The decoupling inductor assembly of claim 1 , further comprising a radio frequency (RF) component connected in parallel between the at least one pair of first parallel connection interfaces or between the at least one pair of second parallel connection interfaces.

5. The decoupling inductor assembly of claim 4 , wherein the RF component is a microstrip line.

6. The decoupling inductor assembly of claim 1 , further comprising an inductor support on which the first solenoid and the second solenoid are wound.

7. A radio frequency (RF) receiving coil comprising:
a plurality of coil units; and
a plurality of decoupling inductor assemblies, each decoupling inductor assembly of the plurality of decoupling inductor assemblies comprising:
a first inductor comprising a first solenoid and a first port pair located at two ends of the first solenoid; and
a second inductor comprising a second solenoid and a second port pair located at two ends of the second solenoid,

wherein the first solenoid and the second solenoid are wound partially or completely overlapped,
wherein the first port pair comprises at least one pair of first parallel connection interfaces, and the second port pair comprises at least one pair of second parallel connection interfaces, and
wherein two of the plurality of adjacent coil units are connected to the first port pair and the second port pair, respectively.

8. The RF receiving coil of claim 7 , wherein at least one decoupling inductor assembly of the plurality of decoupling inductor assemblies comprises a capacitor connected in parallel between the at least one pair of first parallel connection interfaces or connected between the at least one pair of second parallel connection interfaces.

9. The RF receiving coil of claim 7 , wherein at least one decoupling inductor assembly of the plurality of decoupling inductor assemblies comprises an inductor connected in parallel between the at least one pair of first parallel connection interfaces or connected between the at least one pair of second parallel connection interfaces.

10. The RF receiving coil of claim 7 , wherein at least one decoupling inductor assembly of the plurality of decoupling inductor assemblies comprises an RF component, connected in parallel between the at least one pair of first parallel connection interfaces or between the at least one pair of second parallel connection interfaces.

11. The RF receiving coil of claim 10 , wherein the RF component is a microstrip line.

12. The RF receiving coil of claim 7 , wherein at least one decoupling inductor assembly of the plurality of decoupling inductor assemblies comprises an inductor support on which the first solenoid and the second solenoid are wound.

13. A magnetic resonance imaging apparatus comprising:
a radio frequency (RF) receiving coil comprising:
a plurality of coil units; and
a plurality of decoupling inductor assemblies, each decoupling inductor assembly of the plurality of decoupling inductor assemblies comprising:
a first inductor comprising a first solenoid and a first port pair located at two ends of the first solenoid; and
a second inductor comprising a second solenoid and a second port pair located at two ends of the second solenoid,

wherein the first solenoid and the second solenoid are wound partially or completely overlapped,
wherein the first port pair comprises at least one pair of first parallel connection interfaces, and the second port pair comprises at least one pair of second parallel connection interfaces, and
wherein two of the plurality of adjacent coil units are connected to the first port pair and the second port pair, respectively.

14. The magnetic resonance imaging apparatus of claim 13 , wherein the decoupling inductor assembly comprises a capacitor connected in parallel between the at least one pair of first parallel connection interfaces or connected between the at least one pair of second parallel connection interfaces.

15. The magnetic resonance imaging apparatus of claim 13 , wherein the decoupling inductor assembly comprises an inductor connected in parallel between the at least one pair of first parallel connection interfaces or connected between the at least one pair of second parallel connection interfaces.

16. The magnetic resonance imaging apparatus of claim 13 , wherein the decoupling inductor assembly comprises an RF component, connected in parallel between the at least one pair of first parallel connection interfaces or between the at least one pair of second parallel connection interfaces.

17. The magnetic resonance imaging apparatus of claim 16 , wherein the RF component is a microstrip line.

18. The magnetic resonance imaging apparatus of claim 13 , wherein the decoupling inductor assembly comprises an inductor support on which the first solenoid and the second solenoid are wound.

Assignees

• Li wen ming
• Tong Tong
• Wang Jianmin
• Siemens Ag

Inventors

• Li wen ming
• Tong Tong
• Wang Jianmin

Classifications

• G01R33/3657 Primary

  Decoupling of multiple RF coils wherein the multiple RF coils do not have the same function in MR, e.g. decoupling of a transmission coil from a receive coil · CPC title

• H01F7/202

  Electromagnets for high magnetic field strength (for superconducting electromagnets H01F6/00; for transformers or inductances without a magnetic core H01F30/08) · CPC title

• H01F5/003

  Printed circuit coils · CPC title

• H01F7/20 Primary

  without armatures (cores H01F3/00; coils H01F5/00 {; shaping metal by applying magnetic forces B21D26/14; electromagnets specially adapted for NMR applications G01R33/381}) · CPC title