Wafer shipper with purge capability

Patent metadata

Field	Value
Publication number	US-10388554-B2
Application number	US-201715481031-A
Country	US
Kind code	B2
Filing date	Apr 6, 2017
Priority date	Apr 6, 2016
Publication date	Aug 20, 2019
Grant date	Aug 20, 2019

Abstract

A purge configurable wafer shipper. The container includes an enclosure portion with an open side or bottom, a door to sealing close the open side or bottom. One of the door and the container portion includes an opening formed in the enclosure portion to provide a fluid passageway from an interior of the wafer shipper to an exterior region. The opening may include a module receiving structure that defines the fluid passageway. A sealing member is included for insertion into the module receiving structure. The sealing member has a body portion including a support flange positioned proximate a lower portion of the body portion, a circumferential groove in the exterior surface of the body portion, and an O-ring positioned at least partially within the circumferential groove.

First claim

What is claimed is:

1. A purge configurable wafer shipper comprising:
an enclosure portion with an open side or bottom,
a door for sealing the open side or bottom, one of the door and the enclosure portion including:
an opening formed in the enclosure portion to provide a fluid passageway from an interior of the wafer shipper to an exterior region, wherein the opening includes a module receiving structure that defines the fluid passageway; and
a sealing member for insertion into the module receiving structure, the sealing member having a body portion with a shape corresponding to an interior surface of the module receiving structure, the body portion including:
a support flange positioned proximate a lower portion of the body portion, the support flange extending outwardly from an exterior surface of the body portion;
a circumferential groove in the exterior surface of the body portion and positioned proximate an upper portion of the body portion;
a substantially planar top surface, the top surface arranged substantially normal to a central axis through the body portion; and
an O-ring positioned at least partially within the circumferential groove; wherein, when fully inserted into the module receiving structure, the support flange abuts the module receiving structure thereby halting insertion and positioning the top surface substantially flush with an interior of the wafer shipper, and the O-ring forming an air-tight seal against the interior of the module receiving structure to seal the opening, preventing passage of fluid through the fluid passageway.

2. The wafer shipper of claim 1 , wherein the module receiving structure is a cylindrical structure and the body portion is a cylindrical body portion having a cylindrical exterior surface configured to engage with a cylindrical interior surface of the module receiving structure.

3. The wafer shipper of claim 2 wherein the cylindrical body portion has a tapered shape that extends from the lower portion to a tapered upper portion.

4. The wafer shipper of claim 1 , further comprising a connector lock configured to operably engage with the module receiving structure for locking the sealing member in the opening, wherein, when the sealing member is fully inserted into the module receiving structure, the connector lock is operably engaged with the module receiving structure thereby sandwiching the support flange between the module receiving structure and the connector lock to secure the sealing member in the module receiving structure.

5. The wafer shipper of claim 1 , wherein the wafer shipper is a 300 mm wafer shipper.

6. The wafer shipper of claim 1 , wherein the wafer shipper is a 450 mm wafer shipper.

7. The wafer shipper of claim 1 , wherein the container portion further includes a plurality of openings, and wherein at least one of the openings of the plurality of openings includes the sealing member, and another opening of the plurality of openings includes an operational component for purging of the wafer shipper.

8. The wafer shipper of claim 1 , wherein the opening is one of a plurality of openings formed in the enclosure portion, the plurality of openings positioned to correspond with a standard load port interface.

9. The wafer shipper of claim 1 , wherein the opening is formed on the bottom of the enclosure portion and wherein the wafer shipper further comprises a kinematic coupling plate attached to the bottom.

10. The wafer shipper of claim 1 , wherein the wafer shipper is a front opening shipping box.

11. A method of configuring a wafer shipper for purge capability, the wafer shipper including an enclosure portion with an open side or bottom and a door to seal the open side or bottom, one of the door and the enclosure portion including an opening with a module receiving structure that defines a fluid passageway from the interior of the wafer shipper to an exterior region, the wafer shipper including a sealing member inserted into the module receiving structure, the sealing member having a body portion including a support flange positioned proximate a lower portion of the sealing member, the support flange extending outwardly from an exterior surface of the body portion, the body portion including a circumferential groove in the exterior surface of the body portion positioned proximate an upper portion of the sealing member, the body portion including a substantially planar top surface, the top surface arranged substantially normal to a central axis through the body portion, and the body portion including an O-ring positioned at least partially within the circumferential groove, the method including:
removing the sealing member from the opening; and
inserting, in response to removing the sealing member, an operational component, for purging of the wafer shipper, into the opening.

12. The method of claim 11 , wherein the module receiving structure is a cylindrical structure and the body portion is a cylindrical body portion having a cylindrical exterior surface configured to engage with a cylindrical interior surface of the module receiving structure.

13. The method of claim 12 wherein the cylindrical body portion has a tapered shape that extends from the lower portion to a tapered upper portion.

14. The method of claim 11 , wherein the wafer shipper further includes a connector lock operably engaged with the module receiving structure and locking the sealing member in the opening.

15. The method of claim 11 , wherein the wafer shipper is a 300 mm wafer shipper.

16. The method of claim 11 , wherein the wafer shipper is a 450 mm wafer shipper.

17. The method of claim 11 , wherein the opening is one of a plurality of openings formed in the enclosure portion, the plurality of openings positioned to correspond with a standard load port interface.

18. The method of claim 11 , wherein the opening is formed on the bottom of the enclosure portion and wherein the wafer shipper further comprises a kinematic coupling plate attached to the bottom.

19. The method of claim 11 , wherein the wafer shipper is a front opening shipping box.

Assignees

• Entegris Inc

Inventors

• Gregerson Barry

Classifications

• H10P72/1926

  characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier · CPC title

• H10P72/1922

  characterised by the construction of the closed carrier · CPC title

• H10P72/1918 Primary

  characterised by coupling elements, kinematic members, handles or elements to be externally gripped · CPC title

• H10P72/1916

  characterised by sealing arrangements · CPC title

• H10P72/1914

  characterised by locking systems · CPC title