Dielectric composition, dielectric element, electronic component and laminated electronic component

Patent metadata

Field	Value
Publication number	US-10388456-B2
Application number	US-201615577306-A
Country	US
Kind code	B2
Filing date	May 24, 2016
Priority date	May 27, 2015
Publication date	Aug 20, 2019
Grant date	Aug 20, 2019

Abstract

A dielectric composition, a dielectric element, an electronic component and a laminated electronic component are disclosed. In an embodiment the dielectric composition includes a perovskite compound comprising a main component having Bi, Na, Sr, Ln and Ti, wherein Ln is at least one type of a rare earth element, and wherein a mean crystal grain size is between 0.1 μm and 1 μm.

First claim

The invention claimed is:

1. A dielectric composition comprising:
a perovskite compound comprising a main component having Bi, Na, Sr, Ln and Ti,
wherein Ln is at least one type of a rare earth element, and
wherein a mean crystal grain size is between 0.1 μm and 0.89 μm.

2. The dielectric composition according to claim 1 ,
wherein the main component is represented by (Bi a Na b Sr c Ln d )TiO 3 , and
wherein a, b, c and d satisfy the following, respectively: 0<a<0.50, 0<b<0.50, 0<c≤0.80, 0<d≤0.20 and 0.90≤a+b+c+d≤1.05.

3. The dielectric composition according to claim 1 , wherein the dielectric composition comprises between 5 molar parts and 18 molar parts of at least one from the group consisting of Li and K as an auxiliary component, with respect to 100 molar parts of Ti contained in the main component.

4. The dielectric composition according to claim 1 , wherein the dielectric composition comprises between 0.2 molar parts and 1 molar part of at least one from the group consisting of Cu, Mn, Zn, Mg and Co as an auxiliary component, with respect to 100 molar parts of Ti contained in the main component.

5. A dielectric element comprising the dielectric composition according to claim 1 .

6. An electronic component including a dielectric layer comprising the dielectric composition according to claim 1 .

7. A laminated electronic component comprising a laminated portion, wherein the laminated portion is formed by alternately laminating an internal electrode layer and a dielectric layer comprising the dielectric composition according to claim 1 .

8. The laminated electronic component according to claim 7 , wherein the internal electrode layer comprises a conductive material, and wherein the conductive material is a noble metal or a base metal that acts essentially as an electrode.

9. The laminated electronic component according to claim 8 , wherein the noble metal or base metal comprises Cu or Cu alloy.

10. The laminated electronic component according to claim 7 , wherein the laminated electronic component comprises external electrodes formed of a metal.

11. The laminated electronic component according to claim 10 , wherein the external electrodes are formed of one type of metal selected from the group consisting of Ni, Pd, Ag, Au, Cu, Pt, Rh, Ru and Ir used alone or used as an alloy of two or more metals.

12. The laminated electronic component according to claim 7 , wherein the laminated electronic component is a laminated ceramic capacitor.

13. A dielectric composition comprising:
a perovskite compound comprising a main component having Bi, Na, Sr, Ln and Ti,
wherein Ln is at least one type of a rare earth element, and
wherein a mean crystal grain size is between 0.1 μm and 0.50 μm.

14. The dielectric composition according to claim 13 ,
wherein the main component is represented by (Bi a Na b Sr c Ln d )TiO 3 , and
wherein a, b, c and d satisfy the following, respectively: 0<a<0.50, 0<b<0.50, 0<c≤0.80, 0<d≤0.20 and 0.90≤a+b+c+d≤1.05.

15. The dielectric composition according to claim 13 , wherein the dielectric composition comprises between 5 molar parts and 18 molar parts of at least one from the group consisting of Li and K as an auxiliary component, with respect to 100 molar parts of Ti contained in the main component.

16. The dielectric composition according to claim 13 , wherein the dielectric composition comprises between 0.2 molar parts and 1 molar part of at least one from the group consisting of Cu, Mn, Zn, Mg and Co as an auxiliary component, with respect to 100 molar parts of Ti contained in the main component.

17. A laminated electronic component comprising a laminated portion, wherein the laminated portion is formed by alternately laminating an internal electrode layer and a dielectric layer comprising the dielectric composition according to claim 13 .

18. The laminated electronic component according to claim 17 , wherein the internal electrode layer comprises a conductive material, and wherein the conductive material is a noble metal or a base metal that acts essentially as an electrode.

19. The dielectric composition according to claim 1 , wherein the dielectric composition is configured to provide an insulation resistivity of 10 12 Ωcm or greater at a high temperature.

Assignees

• Tdk Electronics Ag

Inventors

• Imura Tomoya
• Terada Tomohiro

Classifications

• H01G4/1218 Primary

  based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

• C04B2235/785

  Submicron sized grains, i.e. from 0,1 to 1 micron · CPC title

• C04B2235/5445

  submicron sized, i.e. from 0,1 to 1 micron · CPC title

• C04B2235/3284

  Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof · CPC title

• C04B2235/3281

  Copper oxides, cuprates or oxide-forming salts thereof, e.g. CuO or Cu2O · CPC title