Hydrofluoroether olefins and methods of using same

Patent metadata

Field	Value
Publication number	US-10385249-B2
Application number	US-201816012811-A
Country	US
Kind code	B2
Filing date	Jun 20, 2018
Priority date	Jul 16, 2014
Publication date	Aug 20, 2019
Grant date	Aug 20, 2019

Abstract

A hydrofluoroether compound represented by the following general formula:

First claim

What is claimed is:

1. A working fluid comprising a hydrofluoroether compound represented by the following general formula (II):

wherein,
Rf 5 and Rf 6 (i) are each independently perfluoroalkyl groups having 1-8 carbon atoms and optionally comprising at least one catenated heteroatom, or (ii) are bonded together to form a ring structure having 4-8 carbon atoms and optionally comprising one or more catenated heteroatoms;
Rfh 1 is a linear, branched, cyclic, or acyclic alkylene or fluoroalkylene group having from 1 to 8 carbon atoms and optionally comprising one or more catenated heteroatoms; and
each of Rf 7 , Rf 8 , Rf′ 7 , and Rf′ 8 is independently a F or CF 3 group, with the proviso that when:
Rf 7 is F, Rf 5 is CF 3 ,
Rf 8 is F, Rf 7 is CF 3 ,
Rf′ 7 is F, Rf′ 8 is CF 3 , and
Rf′ 8 is F, Rf′ 7 is CF 3 ;

wherein the hydrofluoroether compound is present in the working fluid at an amount of at least 50% by weight based on the total weight of the working fluid.

2. An apparatus for heat transfer comprising:
a device; and
a mechanism for transferring heat to or from the device, the mechanism comprising the working fluid according to claim 1 .

3. An apparatus for heat transfer according to claim 2 , wherein the device is selected from a microprocessor, a semiconductor wafer used to manufacture a semiconductor device, a power control semiconductor, an electrochemical cell, an electrical distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, and a laser.

4. An apparatus according to claim 2 , wherein the mechanism for transferring heat is a component in a system for maintaining a temperature or temperature range of an electronic device.

5. A method of transferring heat comprising:
providing a device; and
transferring heat to or from the device using the working fluid according to claim 1 .

Assignees

• 3M Innovative Properties Co

Inventors

• Bulinski Michael J
• Costello Michael G
• Lamanna William M
• Teverovskiy Georgiy
• Smith Kiah A

Classifications

• H10P72/0431

  Apparatus for thermal treatment · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• C09K5/04

  the change of state being from liquid to vapour or vice versa · CPC title

• C07D265/30

  not condensed with other rings · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title