Self-healing thermal interface materials

Patent metadata

Field	Value
Publication number	US-10377877-B2
Application number	US-201715619863-A
Country	US
Kind code	B2
Filing date	Jun 12, 2017
Priority date	Aug 30, 2016
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

A self-healing thermal interface material includes a reactive silicone-based material and a thermally conductive filler material. The reactive silicone-based material is modified to include one or more hydrogen bonding functional groups.

First claim

What is claimed is:

1. A process of forming a self-healing thermal interface material, the process comprising:
forming a blend, the blend including:
a silicone-based material that includes a hydrogen bonding functional group; and
a thermally conductive filler material that includes a thymine functional group, an adenine functional group, or a combination thereof; and
forming a self-healing thermal interface material that includes the blend.

2. The process of claim 1 , wherein the thermally conductive filler material includes the thymine functional group, and wherein the hydrogen bonding functional group includes the adenine functional group.

3. The process of claim 2 , wherein the thermally conductive filler material includes an alumina particle having the thymine functional group chemically bonded to a surface of the alumina particle.

4. The process of claim 2 , wherein the silicone-based material includes a silicone polymer, and wherein the adenine functional group is chemically bonded to a polymer backbone of the silicone polymer.

5. The process of claim 1 , wherein the thermally conductive filler material includes the adenine functional group, and wherein the hydrogen bonding functional group includes the thymine functional group.

6. The process of claim 5 , wherein the thermally conductive filler material includes an alumina particle having the adenine functional group chemically bonded to a surface of the alumina particle.

7. The process of claim 5 , wherein the silicone-based material includes a silicone polymer, and wherein the thymine functional group is chemically bonded to a polymer backbone of the silicone polymer.

8. The process of claim 1 , wherein the silicone-based material includes a blend of a first silicone polymer that includes the adenine functional group and a second silicone polymer that includes the thymine functional group.

9. A process of forming a self-healing thermal interface material, the process comprising:
forming a blend, the blend including:
a silicone-based material;
a first thermally conductive filler material that includes a thymine functional group; and
a second thermally conductive filler material that includes an adenine functional group; and

forming a self-healing thermal interface material that includes the blend.

10. The process of claim 9 , wherein the first thermally conductive filler material includes an alumina particle having the thymine functional group chemically bonded to a surface of the alumina particle.

11. The process of claim 9 , wherein the second thermally conductive filler material includes an alumina particle having the adenine functional group chemically bonded to a surface of the alumina particle.

12. The process of claim 9 , wherein the silicone-based material includes a silicone polymer having a hydrogen bonding functional group chemically bonded to a polymer backbone of the silicone polymer.

13. The process of claim 12 , wherein the hydrogen bonding functional group includes the thymine functional group, the adenine functional group, or a combination thereof.

14. The process of claim 9 , wherein the silicone-based material includes a blend of a first silicone polymer that includes the adenine functional group and a second silicone polymer that includes the thymine functional group.

15. A process of forming an apparatus that includes a self-healing thermal interface material, the process comprising:
disposing a self-healing thermal interface material on a heat generating component; and
disposing a heat dissipating component on the self-healing thermal interface material,
wherein the self-healing thermal interface material includes a blend of a silicone-based material and at least one thermally conductive filler material, the at least one thermally conductive filler material including:
a thermally conductive filler material that includes a thymine functional group, an adenine functional group, or a combination thereof; or
a first thermally conductive filler material that includes a thymine functional group and a second thermally conductive filler material that includes an adenine functional group.

16. The process of claim 15 , wherein the heat generating component includes a die or a lidded die.

17. The process of claim 15 , wherein the heat dissipating component includes a heat sink or a cold plate.

18. The process of claim 15 , wherein the silicone-based material includes a silicone polymer having a hydrogen bonding functional group chemically bonded to a polymer backbone of the silicone polymer.

19. The process of claim 18 , wherein the hydrogen bonding functional group includes the thymine functional group, the adenine functional group, or a combination thereof.

20. The process of claim 15 , wherein the silicone-based material includes a blend of a first silicone polymer that includes the adenine functional group and a second silicone polymer that includes the thymine functional group.

Assignees

• IBM

Inventors

• Czaplewski Sarah K
• Kuczynski Joseph
• Wertz Jason T
• Zhang Jing

Classifications

• C08L83/08

  containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen · CPC title

• C09K5/14 Primary

  Solid materials, e.g. powdery or granular · CPC title

• C08G77/26

  nitrogen-containing groups · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

• C08K2003/2227

  of aluminium · CPC title