Apparatus with a high heat capacity and method for producing the same

Patent metadata

Field	Value
Publication number	US-10377626-B2
Application number	US-201815957349-A
Country	US
Kind code	B2
Filing date	Apr 19, 2018
Priority date	Apr 21, 2017
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

The present disclosure relates to an apparatus comprising a substrate, wherein a MEMS module is arranged on a first side of the substrate, the output signal from said MEMS module changing in the event of a change in temperature. Furthermore, the apparatus has a housing structure which is arranged on a first side of the substrate and has a recess in which the MEMS module is arranged. The apparatus also has a layer which is applied to the housing structure and increases the heat capacity of the apparatus. The present disclosure also relates to a method for producing an apparatus of this kind.

First claim

What is claimed is:

1. An apparatus comprising:
a substrate, wherein a MEMS module is arranged on a first side of the substrate, the MEMS module configured to produce an output signal that changes in the event of a change in temperature,
a housing structure arranged on the first side of the substrate, the housing structure comprising a recess in which the MEMS module is arranged, and
a layer applied to the housing structure, the layer configured to increase a heat capacity of the apparatus, wherein a heat capacity of the layer is greater than a heat capacity of the housing structure by at least a factor of one and a half.

2. The apparatus as claimed in claim 1 , wherein the layer has a thermal conductivity of less than

0.2
·

10

-
6

⁢

m
2

s

.

3. The apparatus as claimed in claim 1 , wherein the layer comprises a potting compound cast on the housing structure, or wherein the layer comprises a shaped part arranged on the housing structure.

4. The apparatus as claimed in claim 1 , wherein the layer comprises at least one constituent part from the group consisting of silicates, polyimides or epoxides.

5. The apparatus as claimed in claim 1 , wherein the layer is arranged on at least one outer side of the housing structure.

6. The apparatus as claimed in claim 1 , wherein the layer completely covers all outer sides of the housing structure.

7. The apparatus as claimed in claim 1 , wherein the layer is arranged on at least one inner side of the housing structure.

8. The apparatus as claimed in claim 1 , wherein the layer completely covers all inner sides of the housing structure.

9. The apparatus as claimed in claim 1 , wherein the layer contains magnetic particles.

10. The apparatus as claimed in claim 1 , wherein the layer contains metal particles.

11. The apparatus as claimed in claim 1 , wherein the MEMS module is a MEMS microphone.

12. A wafer comprising a plurality of apparatuses as claimed in claim 1 .

13. A method comprising the following steps:
providing a wafer substrate comprising a plurality of MEMS modules arranged on a first side of the wafer substrate, wherein an output signal from each MEMS module of the plurality of MEMS modules changes in the event of a change in temperature, and comprising a plurality of housing structures arranged on the first side of the wafer substrate, wherein each housing structure of the plurality of housing structures has a recess in each of which one of the plurality of MEMS modules is arranged, and wherein the plurality of housing structures and the plurality of MEMS modules form a plurality of packages, each housing structure of the plurality of housing structures together with its respective MEMS module of the plurality of MEMS modules forming one package of the plurality of packages
applying a layer to at least one side of the housing structure of the plurality of packages, wherein the layer increases a heat capacity of each package of the plurality of packages, a heat capacity of the layer is greater than a heat capacity of the plurality of housing structures by at least a factor of one and a half, and
separating each of the plurality of packages.

14. The method as claimed in claim 13 , wherein the step of applying the layer comprises casting a potting compound over the housing structure of each package of the plurality of packages.

15. The method as claimed in claim 13 , wherein the step of applying the layer comprises arranging a shaped part on the housing structure of each package of the plurality of packages.

16. The method as claimed in claim 13 , wherein the step of applying the layer comprises arranging the layer on at least one outer side of the housing structure of each package of the plurality of packages.

17. The method as claimed in claim 13 , wherein applying the layer comprises arranging the layer on all outer sides of the housing structure of each package of the plurality of packages, wherein all outer sides of the housing structure of each package are completely covered by the layer.

18. The method as claimed in claim 13 , wherein applying the layer comprises arranging the layer on at least one inner side of the housing structure of each package of the plurality of packages.

19. The method as claimed in claim 13 , wherein applying the layer comprises arranging the layer on all inner sides of the housing structure of each package of the plurality of packages, wherein the layer completely covers all inner sides of the housing structure of each package.

20. The method as is claimed in claim 13 , wherein the layer contains magnetic particles.

21. An apparatus comprising:
a substrate, wherein a MEMS module is arranged on a first side of the substrate, the MEMS module configured to produce an output signal that changes in the event of a change in temperature,
a housing structure arranged on the first side of the substrate, the housing structure comprising a recess in which the MEMS module is arranged, and
a layer applied to the housing structure, the layer configured to increase a heat capacity of the apparatus, wherein the layer contains magnetic particles.

Assignees

• Infineon Technologies Ag

Inventors

• Goller Bernd
• Steiert Matthias

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H04R1/086

  Protective screens, e.g. all weather or wind screens · CPC title

• B81C1/0069

  Thermal properties, e.g. improve thermal insulation · CPC title