Electronic device, liquid ejection head, and method of manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-10377135-B2
Application number	US-201615735884-A
Country	US
Kind code	B2
Filing date	Jul 1, 2016
Priority date	Jul 28, 2015
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.

First claim

The invention claimed is:

1. An electronic device comprising a joined-structure assembly in which a plurality of structures are joined together, wherein
at least one of the plurality of structures includes a movable region,
a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and
the adhesive agent includes an organo-siloxane compound with a heterocyclic group in a backbone thereof, with three or more chains extending therefrom, providing three or more reaction points for cross-linking the organo-siloxane compound.

2. The electronic device according to claim 1 , wherein the adhesive agent includes, as the heterocyclic group, an isocyanurate group in the backbone.

3. The electronic device according to claim 2 , wherein the adhesive agent includes an epoxy group or an oxetanyl group.

4. The electronic device according to claim 1 , wherein the adhesive agent includes a component including hydrosilane in a constituent molecule, a component including a vinyl group, and a platinum catalyst.

5. The electronic device according to claim 4 , wherein the movable region is a driven region or an active region.

6. The electronic device according to claim 4 , wherein the movable region is provided with a piezoelectric element that functions as a part of the movable region.

7. A liquid ejection head including the electronic device according to claim 2 , comprising:
a first plate as one of the structures in which a pressure chamber is formed as the space communicating with a nozzle from which a liquid is to be ejected; and
a second plate as another one of the structures in which a space communicating with the pressure chamber is formed, wherein
one surface forming the pressure chamber is a flexible surface that functions as a part of the movable region.

8. The liquid ejection head according to claim 7 , wherein the second plate is a communicating plate in which a nozzle communicating port allowing the pressure chamber and the nozzle to communicate with each other which is formed as the space.

9. The liquid ejection head according to claim 8 , wherein the communicating plate is a stacked body in which a plurality of plates are stacked and joined together with the adhesive agent, and an opening to constitute a part of the nozzle communicating port is formed in each of the plurality of plates.

10. A method of manufacturing an electronic device which includes a joined-structure assembly formed by joining a plurality of structures together, in which at least one of the plurality of structures includes a movable region, and a part of a liquid adhesive agent applied between the structures faces, a space communicating with the movable region, the method comprising:
applying the liquid adhesive agent to a transfer sheet, the adhesive agent including an organo-siloxane compound with three or more chains extending from a backbone, providing three or more reaction points for cross-linking the organo-siloxane compound;
increasing a viscosity of the liquid adhesive agent by incompletely curing the liquid adhesive agent applied to the transfer sheet; and
transferring the liquid adhesive agent to a surface of one of the structures in each joint pair.

11. The method of manufacturing an electronic device according to claim 10 , wherein
the liquid adhesive agent is an addition-type silicone resin, and
the increasing of a viscosity is performed by a heat treatment.

12. The method of manufacturing an electronic device according to claim 11 , further comprising curing the liquid adhesive agent by a heat treatment after the transferring of the adhesive agent.

13. The electronic device according to claim 2 , wherein the adhesive agent includes an oxetanyl group.

14. The electronic device according to claim 2 , wherein the adhesive agent is an organo-siloxane compound with an isocyanurate group in the backbone thereof, and where one of the three or more chains includes an epoxy group.

15. The electronic device according to claim 1 , wherein the heterocyclic group in the backbone comprises an isocyanurate, an imidazole, a pyrazole, a pyrazine, a 1,3,5-triazine, a benzimidazole, or a benzofuran.

Assignees

• Seiko Epson Corp

Inventors

• Matsuo Yasuhide
• Otsuka Kenji
• Tsuchiya Hiroyuki
• Tadachi Kei
• Takahashi Wataru

Classifications

• B41J2002/14241

  having a cover around the piezoelectric thin film element · CPC title

• B41J2002/14362

  Assembling elements of heads · CPC title

• B41J2/161

  of film type, deformed by bending and disposed on a diaphragm · CPC title

• B41J2/14233 Primary

  of film type, deformed by bending and disposed on a diaphragm · CPC title

• B41J2/14209 Primary

  of finger type, chamber walls consisting integrally of piezoelectric material · CPC title