Manufacturing method for airtight package

US10377086B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10377086-B2
Application numberUS-201615576922-A
CountryUS
Kind codeB2
Filing dateMay 16, 2016
Priority dateMay 28, 2015
Publication dateAug 13, 2019
Grant dateAug 13, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of producing a hermetic package includes forming a first sealing material layer on a first glass substrate, and arranging a frame body having an opening on its top so that a bottom portion of the frame body and the first sealing material layer are in contact, followed by sealing the frame body and the first glass substrate with each other via the first sealing material layer. The method further includes forming a second sealing material layer on an upper edge portion of the frame body, housing, in the frame body, a member, and arranging a second glass substrate to be in contact with the second sealing material layer, followed by sealing the second glass substrate and the frame body with each other via the second sealing material layer by irradiating the second sealing material layer with laser light from a second glass substrate side.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of producing a hermetic package, the method comprising the steps of: preparing a first glass substrate and forming a first sealing material layer on the first glass substrate; preparing a frame body having an opening on top thereof and arranging the frame body and the first glass substrate so that a bottom portion of the frame body and the first sealing material layer are brought into contact with each other, followed by sealing the frame body and the first glass substrate with each other through intermediation of the first sealing material layer; forming a second sealing material layer on an upper edge portion of the frame body after sealing the frame body and the first glass substrate with each other through intermediation of the first sealing material layer; housing, in the frame body, a member to be housed after forming the second sealing material layer on the upper edge portion of the frame body; and preparing a second glass substrate and arranging the second glass substrate so that the second glass substrate and the second sealing material layer are brought into contact with each other, followed by sealing the second glass substrate and the frame body with each other through intermediation of the second sealing material layer by irradiating the second sealing material layer with laser light from a second glass substrate side, to thereby provide a hermetic package. 2. The method of producing a hermetic package according to claim 1 , wherein the forming of the first sealing material layer comprises applying a paste containing a first sealing material onto the first glass substrate, followed by firing, to thereby form a first sealing material layer formed of a sintered body of the first sealing material. 3. The method of producing a hermetic package according to claim 2 , wherein the method further comprises using, as a first sealing material, a sealing material comprising 55 vol % to 95 vol % of bismuth-based glass powder and 5 vol % to 45 vol % of refractory filler powder. 4. The method of producing a hermetic package according to claim 3 , wherein the method further comprises using, as the frame body, a sintered body of a green sheet. 5. The method of producing a hermetic package according to claim 3 , wherein the sealing of the frame body and the first glass substrate with each other comprises firing the first sealing material layer. 6. The method of producing a hermetic package according to claim 2 , wherein the method further comprises using, as the frame body, a sintered body of a green sheet. 7. The method of producing a hermetic package according to claim 2 , wherein the sealing of the frame body and the first glass substrate with each other comprises firing the first sealing material layer. 8. The method of producing a hermetic package according to claim 6 , wherein the sealing of the frame body and the first glass substrate with each other comprises firing the first sealing material layer. 9. The method of producing a hermetic package according to claim 1 , wherein the method further comprises using, as a first sealing material, a sealing material comprising 55 vol % to 95 vol % of bismuth-based glass powder and 5 vol % to 45 vol % of refractory filler powder. 10. The method of producing a hermetic package according to claim 9 , wherein the method further comprises using, as the frame body, a sintered body of a green sheet. 11. The method of producing a hermetic package according to claim 10 , wherein the sealing of the frame body and the first glass substrate with each other comprises firing the first sealing material layer. 12. The method of producing a hermetic package according to claim 9 , wherein the sealing of the frame body and the first glass substrate with each other comprises firing the first sealing material layer. 13. The method of producing a hermetic package according to claim 1 , wherein the method further comprises using, as the frame body, a sintered body of a green sheet. 14. The method of producing a hermetic package according to claim 13 , wherein the sealing of the frame body and the first glass substrate with each other comprises firing the first sealing material layer. 15. The method of producing a hermetic package according to claim 1 , wherein the forming of the second sealing material layer comprises applying a paste containing a second sealing material onto the upper edge portion of the frame body, followed by firing, to thereby form a second sealing material layer formed of a sintered body of the second sealing material. 16. The method of producing a hermetic package according to claim 15 , wherein the method further comprises using, as the second sealing material, a sealing material comprising 55 vol % to 95 vol % of bismuth-based glass powder, 5 vol % to 45 vol % of refractory filler powder, and 1 vol % to 15 vol % of a heat-resistant pigment. 17. The method of producing a hermetic package according to claim 1 , wherein the sealing of the frame body and the first glass substrate with each other comprises firing the first sealing material layer. 18. The method of producing a hermetic package according to claim 1 , wherein the second sealing material layer has an average thickness of less than 10 μm. 19. The method of producing a hermetic package according to claim 1 , wherein the method further comprises using, as the member to be housed, a piezoelectric vibrator element or a resin having dispersed therein phosphor particles.

Assignees

Inventors

Classifications

  • Details · CPC title

  • Layered products essentially comprising sheet glass, or glass, slag, or like fibres · CPC title

  • containing titanium compounds; containing zirconium compounds · CPC title

  • C03C8/24Primary

    Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders · CPC title

  • the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device · CPC title

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What does patent US10377086B2 cover?
A method of producing a hermetic package includes forming a first sealing material layer on a first glass substrate, and arranging a frame body having an opening on its top so that a bottom portion of the frame body and the first sealing material layer are in contact, followed by sealing the frame body and the first glass substrate with each other via the first sealing material layer. The metho…
Who is the assignee on this patent?
Nippon Electric Glass Co
What technology area does this patent fall under?
Primary CPC classification C03C8/24. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 13 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).