Breaking-in and cleaning method and apparatus for wafer-cleaning brush
US-2024066566-A1 · Feb 29, 2024 · US
US10376928B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10376928-B2 |
| Application number | US-201615550040-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 21, 2016 |
| Priority date | Jun 24, 2015 |
| Publication date | Aug 13, 2019 |
| Grant date | Aug 13, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Disclosed is a cleaning blade, having an elastic body formed of a rubber base material molded product, and a surface treatment layer on at least an area of the elastic body to be brought into contact with a cleaning object. The surface treatment layer is formed by impregnating a surface portion of the elastic body with a surface treatment liquid containing an isocyanate compound and an organic solvent, and hardening the liquid. The surface treatment layer has an indentation elastic modulus of 21 MPa to 56 MPa. The elastic body has an indentation elastic modulus greater than 20 MPa and 35 MPa or less. The difference in indentation elastic modulus between the surface treatment layer and the elastic body is 1 MPa to 21 MPa.
Opening claim text (preview).
The invention claimed is: 1. A cleaning blade, having an elastic body formed of a rubber base material molded product, and a surface treatment layer on at least an area of the elastic body to be brought into contact with a cleaning object, characterized in that: the surface treatment layer is formed by impregnating a surface portion of the elastic body with a surface treatment liquid containing an isocyanate compound and an organic solvent, and hardening the liquid; the surface treatment liquid concentration of the surface treatment layer has such a profile that the impregnation concentration gradually decreases from the surface toward the depth direction; the surface treatment layer has an elastic modulus of 60 MPa or lower; the elastic body has an elastic modulus of 3 MPa to 35 MPa; the difference in elastic modulus between the surface treatment layer and the elastic body is 1 MPa to 25 MPa; and index M, which is calculated from a breaking elongation (%) of the elastic body at 23° C., a tan δ (1 Hz) peak temperature (° C.) of the elastic body, and an impregnation depth (μm) of the surface treatment liquid by the following formula: Index M =[breaking elongation (%) of the elastic body at 23° C.]×[tan δ (1 Hz) peak temperature (° C.)]×(−1)/[impregnation depth (μm) of the surface treatment liquid] is 1 to 1,100. 2. A cleaning blade according to claim 1 , wherein the impregnation depth is 10 μm to 600 μm. 3. A cleaning blade according to claim 2 , wherein the breaking elongation of the elastic body at 23° C. is 250% to 450%. 4. A cleaning blade according to claim 2 , wherein the 1-Hz tan δ peak temperature of the elastic body is lower than 0° C. 5. A cleaning blade according to claim 3 , wherein the 1-Hz tan δ peak temperature of the elastic body is lower than 0° C. 6. A cleaning blade according to claim 1 , wherein the breaking elongation of the elastic body at 23° C. is 250% to 450%. 7. A cleaning blade according to claim 6 , wherein the 1-Hz tan δ peak temperature of the elastic body is lower than 0° C. 8. A cleaning blade according to claim 1 , wherein the 1-Hz tan δ peak temperature of the elastic body is lower than 0° C.
Related publications grouped by family.
Answers are generated from the same data shown on this page.