Airflow control in data centers utilizing hot aisle containment

US10375864B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10375864-B2
Application numberUS-201715670275-A
CountryUS
Kind codeB2
Filing dateAug 7, 2017
Priority dateAug 7, 2017
Publication dateAug 6, 2019
Grant dateAug 6, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Examples disclosed herein relate to airflow control in data centers utilizing hot aisle containment. Consistent with some embodiments disclosed herein, a first differential pressure sensor may be located in a contained hot aisle in a data center and a second differential pressure sensor may be located in an above-ceiling hot air return plenum connected to the contained hot aisle. Pressure sensor data obtained from the differential pressure sensors may be used to maintain a near-neutral pressure in the contained hot aisle and a set negative pressure in the hot air return plenum.

First claim

Opening claim text (preview).

The invention claimed is: 1. A portion of a data center utilizing hot aisle containment, comprising: at least one row of enclosures housing IT equipment, backs of the enclosures facing a contained hot aisle into which the IT equipment exhausts hot air; a first differential pressure sensor located in the contained hot aisle; an active damper located in the contained hot aisle above the first differential pressure sensor; the contained hot aisle extending vertically upward and connecting to a hot air return plenum located in a suspended ceiling of the data center; a second differential pressure sensor located in the hot air return plenum; a cooling unit connected to the hot air return plenum; and an active hot aisle containment (HAC) controller to: maintain a near-neutral pressure in the contained hot aisle by modulating the active damper based on pressure sensor data received from the first differential pressure sensor; maintain a set negative pressure in the hot air return plenum based on pressure sensor data received from the second differential pressure sensor; increase an amount the active damper is opened in response to detecting an increase in pressure in the contained hot aisle using the first differential pressure sensor; and decrease the amount the active damper is opened in response to detecting a decrease in pressure in the contained hot aisle using the first differential pressure sensor. 2. The portion of the data center of claim 1 , wherein: the cooling unit includes a fan; and the active HAC controller is to maintain the set negative pressure in the hot air return plenum by modulating the fan in the cooling unit based on pressure sensor data received from the second differential pressure sensor. 3. The portion of the data center of claim 2 , wherein the active HAC controller is to: increase a fan speed of the fan in the cooling unit in response to detecting an increase in pressure in the hot air return plenum using the second differential pressure sensor; and decrease the fan speed of the fan in the cooling unit in response to detecting a decrease in pressure in the hot air return plenum using the second differential pressure sensor. 4. A data center cooling system, comprising: a first differential pressure sensor located in a first contained hot aisle; a second differential pressure sensor located in an above-ceiling hot air return plenum connected to the first contained hot aisle; a first active damper ceiling panel located in the first contained hot aisle; a third differential pressure sensor located in a second contained hot aisle; a second active damper located in the second contained hot aisle; a cooling unit connected to the hot air return plenum; and an active hot aisle containment (HAC) controller to: modulate the first active damper to maintain a near-neutral pressure in the first contained hot aisle based on pressure sensor data received from the first differential pressure sensor; and modulate a fan in the cooling unit to maintain a set negative pressure in the hot air return plenum based on pressure sensor data received from the second differential pressure sensor. 5. The data center cooling system of claim 4 , wherein the active HAC controller is to: modulate the second active damper to maintain a near-neutral pressure in the second contained hot aisle based on pressure sensor data received from the third differential pressure sensor. 6. The data center cooling system of claim 4 , wherein the cooling system comprises: a second cooling unit connected to the hot air return plenum. 7. The data center cooling system of claim 6 , wherein the active HAC controller is to: modulate the fan in the cooling unit and a second fan in the second cooling unit to maintain a set negative pressure in the hot air return plenum based on pressure sensor data received from the second differential pressure sensor. 8. The data center cooling system of claim 7 , wherein: the cooling system comprises a fourth differential pressure sensor located in the hot air return plenum; and the active HAC controller is to: modulate the fan in the cooling unit to maintain a set negative pressure in the hot air return plenum based on pressure sensor data received from the second differential pressure sensor; and modulate the second fan in the second cooling unit to maintain a set negative pressure in the hot air return plenum based on pressure sensor data received from the fourth differential pressure sensor.

Assignees

Inventors

Classifications

  • Thermal management, e.g. server temperature control · CPC title

  • within rooms for removing heat from cabinets, e.g. by air conditioning device · CPC title

  • within cabinets for removing heat from server blades · CPC title

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Frequently asked questions

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What does patent US10375864B2 cover?
Examples disclosed herein relate to airflow control in data centers utilizing hot aisle containment. Consistent with some embodiments disclosed herein, a first differential pressure sensor may be located in a contained hot aisle in a data center and a second differential pressure sensor may be located in an above-ceiling hot air return plenum connected to the contained hot aisle. Pressure senso…
Who is the assignee on this patent?
Panduit Corp
What technology area does this patent fall under?
Primary CPC classification H05K7/20836. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 06 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).