Oscillation module, electronic apparatus, and vehicle

Patent metadata

Field	Value
Publication number	US-10374575-B2
Application number	US-201715412629-A
Country	US
Kind code	B2
Filing date	Jan 23, 2017
Priority date	Feb 2, 2016
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

An oscillation module includes an SAW filter, and a high-pass filter formed in an integrated circuit, the high-pass filter has a coil part, a capacitance part, and a first interconnection adapted to connect the coil part and the capacitance part to each other, and the capacitance part includes a capacitance array.

First claim

What is claimed is:

1. An oscillation module comprising:
an SAW filter; and
a high-pass filter formed in an integrated circuit,
wherein the high-pass filter has a coil part, a capacitance part, and a first interconnection adapted to connect the coil part and the capacitance part to each other, and
the capacitance part includes a capacitance array, wherein
the coil part is disposed in a second wiring layer thicker than a first wiring layer in which the first interconnection is disposed.

2. The oscillation module according to claim 1 , wherein the second wiring layer is stacked above the first wiring layer.

3. The oscillation module according to claim 1 , wherein
the capacitance array includes a first capacitance, and
at least one electrode of the first capacitance is disposed in a first wiring layer in which the first interconnection is disposed.

4. The oscillation module according to claim 2 , wherein
the capacitance array includes a first capacitance, and
at least one electrode of the first capacitance is disposed in a first wiring layer in which the first interconnection is disposed.

5. The oscillation module according to claim 3 , wherein
the other electrode of the first capacitance is disposed so as to straddle a second wiring layer and a third wiring layer, and
the second wiring layer and the third wiring layer are configured so as to sandwich the first wiring layer in which the one electrode is disposed.

6. The oscillation module according to claim 4 , wherein
the other electrode of the first capacitance is disposed so as to straddle a second wiring layer and a third wiring layer, and
the second wiring layer and the third wiring layer are configured so as to sandwich the first wiring layer in which the one electrode is disposed.

7. The oscillation module according to claim 5 , further comprising:
a first terminal connected to the coil part; and
a second terminal connected to an outside of the high-pass filter,
wherein the first interconnection electrically connects the one electrode and the first terminal to each other, and
a second interconnection disposed in the second wiring layer and a third interconnection disposed in the third wiring layer electrically connect the other electrode and the second terminal to each other.

8. The oscillation module according to claim 3 , wherein
the capacitance array further includes a second capacitance, and
one electrode of the second capacitance is connected to the one electrode of the first capacitance with the first interconnection.

9. The oscillation module according to claim 8 , wherein
a capacitance value of the first capacitance and a capacitance value of the second capacitance are roughly equal to each other.

10. The oscillation module according to claim 8 , wherein
a capacitance value of the second capacitance is higher than a capacitance value of the first capacitance.

11. The oscillation module according to claim 8 , wherein
a wiring length of the first interconnection from the first terminal to the first capacitance is shorter than a wiring length of the first interconnection from the first terminal to the second capacitance.

12. The oscillation module according to claim 8 , wherein
the capacitance array further includes a third capacitance, and
one electrode of the third capacitance is connected to the one electrode of the first capacitance and the one electrode of the second capacitance with the first interconnection.

13. An oscillation module comprising:
an SAW filter; and
a high-pass filter formed in an integrated circuit,
wherein the high-pass filter includes a coil part and a capacitance part including a capacitance array,
the capacitance array includes a first terminal connected to the coil part, a first capacitance, and a second capacitance,
a capacitance value of the first capacitance is lower than a capacitance value of the second capacitance, and
a wiring length in a case in which the first capacitance and the first terminal are connected to each other is shorter than a wiring length in a case in which the second capacitance and the first terminal are connected to each other.

14. An oscillation module comprising:
an SAW filter; and
a high-pass filter formed in an integrated circuit,
wherein the high-pass filter includes a coil part and a capacitance part including a capacitance array,
the capacitance array includes a first terminal connected to the coil part, a first array of n capacitances connected to each other, and a second array of m capacitances connected to each other,
a total capacitance value of the first array is lower than a total capacitance value of the second array, and
a wiring length in a case in which one of the capacitances belonging to the first array and the first terminal are connected to each other is shorter than a wiring length in a case in which one of the capacitances belonging to the second array and the first terminal are connected to each other.

15. The oscillation module according to claim 14 , wherein n=2 and m=1.

16. An electronic apparatus comprising:
the oscillation module according to claim 1 .

17. A vehicle comprising:
the oscillation module according to claim 1 .

Assignees

• Seiko Epson Corp

Inventors

• Nomura Masataka
• Sasayama Shigeki
• Nakada Akira

Classifications

• H10D64/011

  of electrodes ohmically coupled to a semiconductor · CPC title

• H03H9/64 Primary

  using surface acoustic waves · CPC title

• H01F2017/0026

  Multilayer LC-filter · CPC title

• H01F17/0006

  Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K) · CPC title

• H03H2001/0085

  Multilayer, e.g. LTCC, HTCC, green sheets · CPC title