Method of forming semiconductor devices
US-2024387980-A1 · Nov 21, 2024 · US
US10374307B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10374307-B2 |
| Application number | US-201715468623-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 24, 2017 |
| Priority date | Mar 31, 2016 |
| Publication date | Aug 6, 2019 |
| Grant date | Aug 6, 2019 |
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A high-frequency antenna element that is easily downsized even when an electromagnetic wave absorber is used, and is capable of protecting a receiving antenna unit by covering the receiving antenna unit, and provides a high-frequency antenna module including the high-frequency antenna element. The high-frequency antenna element includes a substrate, a dielectric layer, a receiving antenna unit, and a coating layer, in which the dielectric layer is laminated on the substrate, the receiving antenna unit is mounted on the dielectric layer, the coating layer covers a surface of the dielectric layer in a portion in which the receiving antenna unit is not mounted while the coating layer is in contact with entire side surfaces of the receiving antenna unit, and the coating layer covers at least a part of an upper surface of the receiving antenna unit.
Opening claim text (preview).
What is claimed is: 1. A high-frequency antenna element comprising a substrate, a dielectric layer, a receiving antenna unit, and a coating layer, wherein: the dielectric layer is laminated on the substrate; the receiving antenna unit is mounted on the dielectric layer; the coating layer covers a surface of the dielectric layer in a portion in which the receiving antenna unit is not mounted while the coating layer is in contact with entire side surfaces of the receiving antenna unit, and the coating layer covers at least a part of an upper surface of the receiving antenna unit; and the coating layer is a film capable of imparting electromagnetic wave absorbing properties to the high-frequency antenna element. 2. The high-frequency antenna element according to claim 1 , wherein a coating layer covers an entire surface of the upper surface of the receiving antenna unit. 3. The high-frequency antenna element according to claim 1 , wherein the coating layer comprises epsilon-type iron oxide, wherein the epsilon-type iron oxide is at least one selected from an ε-Fe 2 O 3 crystal and a crystal having a crystalline structure and a space group identical to a crystalline structure and a space group of the ε-Fe 2 O 3 crystal, in which a part of Fe sites in the ε-Fe 2 O 3 crystal is substituted by an element M other than Fe, and is represented by a formula ε-M x Fe 2-x O 3 , wherein x is at least 0 and less than 2; and a relative permittivity of the coating layer is 6.5 to 65. 4. The high-frequency antenna element according to claim 1 , wherein the coating layer includes a carbon nanotube. 5. A high-frequency antenna module comprising a module assembly comprising the high-frequency antenna element according to claim 1 .
Radome integrated radiating elements · CPC title
mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title
Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith}(H01Q1/08, H01Q1/14 take precedence) · CPC title
formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} · CPC title
Electromagnetic shields · CPC title
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